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MSP430FR5922IPMR

Texas Instruments

MSP430FR5922IPMR by Texas Instruments

MSP430FR5922IPMR by Texas Instruments is a 16-bit microcontroller with 8KB RAM and 64 terminals. It features 8 ADC channels, 3 DMA channels, and 5 timers suitable for industrial applications. With low power mode and FRAM ROM programmability, it operates at temperatures ranging from -40 to 85°C.

Median Price

$3.790

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 24,000 parts In-Stock

1+ parts

$3.790

100+ parts

$3.090

1k+ parts

$2.060

10k+ parts

-

24,000

$3.790

$3.090

$2.060

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,647 parts In-Stock

1+ parts

$3.600

100+ parts

-

1k+ parts

-

10k+ parts

-

1,647

$3.600

-

-

-

Vyrian

USA . 8,803 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,803

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 23,994 parts In-Stock

1+ parts

$3.220

100+ parts

-

1k+ parts

-

10k+ parts

-

23,994

$3.220

-

-

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Corphita

USA . 2,719 parts In-Stock

1+ parts

$3.411

100+ parts

-

1k+ parts

-

10k+ parts

-

2,719

$3.411

-

-

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AZTECH Wire

Italy . 581 parts In-Stock

1+ parts

$13.420

100+ parts

-

1k+ parts

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10k+ parts

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581

$13.420

-

-

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Microchip USA

USA . 2,666 parts In-Stock

1+ parts

$18.930

100+ parts

$18.820

1k+ parts

$18.760

10k+ parts

$18.700

2,666

$18.930

$18.820

$18.760

$18.700

Parana Technologies

USA . 1,740 parts In-Stock

1+ parts

$19.247

100+ parts

-

1k+ parts

$19.284

10k+ parts

-

1,740

$19.247

-

$19.284

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DigiPath Technology Company

USA . 1,403 parts In-Stock

1+ parts

$21.193

100+ parts

$19.498

1k+ parts

-

10k+ parts

-

1,403

$21.193

$19.498

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IDEA Electronic Components Group

UK . 2,077 parts In-Stock

1+ parts

$21.626

100+ parts

$20.545

1k+ parts

$19.463

10k+ parts

-

2,077

$21.626

$20.545

$19.463

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ChromeModa Solutions

Germany . 15 parts In-Stock

1+ parts

$21.626

100+ parts

$17.733

1k+ parts

-

10k+ parts

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15

$21.626

$17.733

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Component Stockers USA

USA . 2,868 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,868

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Overview

Unlock the power of innovation with the Texas Instruments MSP430FR5922IPMR Microcontroller. This cutting-edge device offers unparalleled quality and reliability, thanks to its renowned manufacturer. Ideal for a wide range of applications, this microcontroller delivers exceptional value and benefits to customers looking for advanced performance and efficiency. Experience seamless connectivity and optimal functionality with the MSP430FR5922IPMR, setting new standards in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between durability and cost-effectiveness, making the product suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with various voltage levels in different systems.

Bit Size: 16

The 16-bit architecture allows for efficient processing of data and instructions, making the product suitable for tasks that require higher computational power.

ADC Channels: YES

The presence of Analog to Digital Converter channels enables the product to interface with analog sensors and signals, expanding its application capabilities.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC (Reduced Instruction Set Computing) microcontroller type, this product offers enhanced performance and efficiency in executing instructions, making it a reliable choice for various embedded applications.

Low Power Mode: YES

The availability of a low power mode helps in optimizing energy consumption and extending battery life, making the product suitable for portable and battery-operated devices.

Technical Specifications

Microcontrollers MSP430FR5922IPMR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

51

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Connectivity:

EUSCI(4)

Peripherals:

BOR, DMA(3), RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR5922IPMR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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