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MSP430FR59221IG56R

Texas Instruments

MSP430FR59221IG56R by Texas Instruments

MSP430FR59221IG56R by Texas Instruments is a 16-bit microcontroller with 8KB RAM and 64KB ROM. It features 8 ADC channels, 3 DMA channels, and 5 timers, making it ideal for industrial applications requiring low power consumption. With a temperature range of -40 to +85°C, this CMOS technology-based MCU offers high performance in a compact package suitable for various embedded systems.

Median Price

$3.754

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,950 parts In-Stock

1+ parts

$3.754

100+ parts

$3.060

1k+ parts

$2.040

10k+ parts

-

3,950

$3.754

$3.060

$2.040

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,722 parts In-Stock

1+ parts

$3.566

100+ parts

-

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1,722

$3.566

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Vyrian

USA . 7,063 parts In-Stock

1+ parts

-

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7,063

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,108 parts In-Stock

1+ parts

$3.379

100+ parts

-

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3,108

$3.379

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AZTECH Wire

Italy . 1,023 parts In-Stock

1+ parts

$12.820

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1,023

$12.820

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Parana Technologies

USA . 535 parts In-Stock

1+ parts

$22.809

100+ parts

-

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$23.471

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535

$22.809

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$23.471

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DigiPath Technology Company

USA . 579 parts In-Stock

1+ parts

$25.115

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579

$25.115

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IDEA Electronic Components Group

UK . 2,134 parts In-Stock

1+ parts

$25.628

100+ parts

$24.347

1k+ parts

$23.065

10k+ parts

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2,134

$25.628

$24.347

$23.065

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ChromeModa Solutions

Germany . 1,795 parts In-Stock

1+ parts

$25.628

100+ parts

$21.015

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-

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1,795

$25.628

$21.015

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Overview

Unleash the power of innovation with the Texas Instruments MSP430FR59221IG56R microcontroller. Designed with cutting-edge technology and impeccable quality, this versatile device offers unparalleled performance in a compact package. Ideal for a wide range of applications, from IoT devices to consumer electronics, this microcontroller boasts low power consumption and high-speed processing capabilities. Elevate your projects with the value and reliability that Texas Instruments is known for, and experience the next level of efficiency and functionality with the MSP430FR59221IG56R.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability of the microcontroller package.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of power supply options, making it versatile for various applications.

CPU Family: MSP430

MSP430 family is known for low power consumption and high performance, making it an efficient choice for energy-efficient devices.

RAM Bytes: 2048

Sufficient RAM capacity for storing and processing data efficiently.

Analog To Digital Convertors: 8-Ch 12-Bit

Multiple ADC channels with 12-bit resolution for accurate analog to digital conversion.

PWM Channels: YES

Provides Pulse Width Modulation channels for controlling devices with precision.

ROM Programmability: FRAM

FRAM technology offers fast and reliable non-volatile memory programming.

Connectivity: EUSCI(4)

Enhanced Universal Serial Communication Interface for seamless connectivity with other devices.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Low Power Mode: YES

Includes low power mode for energy-efficient operation.

Technical Specifications

Microcontrollers MSP430FR59221IG56R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

46

No. of Serial I/Os:

4

No. of Terminals:

56

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Peripheral IC Type:

Connectivity:

EUSCI(4)

Peripherals:

BOR, DMA(3), RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR59221IG56R Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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