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MSP430FR5889IRGCR

Texas Instruments

MSP430FR5889IRGCR by Texas Instruments

MSP430FR5889IRGCR by Texas Instruments is a 16-bit microcontroller with 131072 ROM words and 2048 RAM bytes. It features 12-Ch 12-Bit ADC channels, 3 DMA channels, and operates at a max clock frequency of 24 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$5.049

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,000 parts In-Stock

1+ parts

$5.049

100+ parts

$4.116

1k+ parts

$2.744

10k+ parts

-

10,000

$5.049

$4.116

$2.744

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,716 parts In-Stock

1+ parts

$4.797

100+ parts

-

1k+ parts

-

10k+ parts

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1,716

$4.797

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-

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Vyrian

USA . 6,121 parts In-Stock

1+ parts

-

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6,121

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Nova Conductors

Japan . 450 parts In-Stock

1+ parts

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450

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 389 parts In-Stock

1+ parts

$3.228

100+ parts

-

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-

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389

$3.228

-

-

-

Advanced Electronics

New Zealand . 60 parts In-Stock

1+ parts

$3.325

100+ parts

$3.159

1k+ parts

$3.159

10k+ parts

-

60

$3.325

$3.159

$3.159

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Ampacity Inc.

Singapore . 4,772 parts In-Stock

1+ parts

$4.290

100+ parts

-

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4,772

$4.290

-

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Semicontronic

India . 4,727 parts In-Stock

1+ parts

$4.290

100+ parts

$4.183

1k+ parts

$4.161

10k+ parts

-

4,727

$4.290

$4.183

$4.161

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Corphita

USA . 437 parts In-Stock

1+ parts

$4.544

100+ parts

-

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10k+ parts

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437

$4.544

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Parana Technologies

USA . 316 parts In-Stock

1+ parts

$28.123

100+ parts

$2,611.657

1k+ parts

$25.311

10k+ parts

-

316

$28.123

$2,611.657

$25.311

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DigiPath Technology Company

USA . 1,178 parts In-Stock

1+ parts

$30.967

100+ parts

$28.490

1k+ parts

-

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1,178

$30.967

$28.490

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ChromeModa Solutions

Germany . 3,801 parts In-Stock

1+ parts

$31.599

100+ parts

$25.911

1k+ parts

-

10k+ parts

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3,801

$31.599

$25.911

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IDEA Electronic Components Group

UK . 1,500 parts In-Stock

1+ parts

$31.599

100+ parts

$30.019

1k+ parts

$28.439

10k+ parts

-

1,500

$31.599

$30.019

$28.439

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Argo Parts USA

USA . 3,557 parts In-Stock

1+ parts

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3,557

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Continental Prestige Electronics

USA . 2,117 parts In-Stock

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2,117

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Lixinc

USA . 355 parts In-Stock

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355

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Bastille Electronics

Australia . 52 parts In-Stock

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52

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Overview

Unlock the power of innovation with the MSP430FR5889IRGCR by Texas Instruments, a top-quality microcontroller designed to revolutionize your projects. With cutting-edge technology and a wide range of applications, this product offers unparalleled value and benefits. Experience seamless connectivity, low power consumption, and advanced features that will take your creations to the next level. Trust Texas Instruments for reliable performance and unleash your creativity with the MSP430FR5889IRGCR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the internal components, ensuring long-term reliability.

Integrated Cache: YES

Enhances processing speed by storing frequently accessed data closer to the CPU, reducing access time.

Maximum Supply Voltage: 3.6 V

Allows for a higher power supply, enabling the microcontroller to handle more complex tasks and peripherals.

On Chip Data RAM Width: 8

Provides sufficient space for temporary data storage, optimizing the performance of the microcontroller.

Package Shape: SQUARE

Enables easy and efficient placement on a circuit board, saving space and facilitating design layout.

Bit Size: 16

Offers a good balance between processing power and energy efficiency, suitable for a wide range of applications.

No. of Terminals: 64

Provides ample connectivity options for external components, enhancing the versatility of the microcontroller.

Minimum Supply Voltage: 1.8 V

Allows for operation in low-power scenarios, increasing energy efficiency and extending battery life.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments, suitable for industrial applications.

CPU Family: MSP430

Comes from a respected and reliable brand known for quality microcontrollers, ensuring a proven track record of performance.

ADC Channels: YES

Enables analog-to-digital conversion, essential for reading sensors and interfacing with the analog world.

DMA Channels: YES

Facilitates direct memory access, improving data transfer speed and offloading the CPU for more critical tasks.

ROM Words: 131072

Offers ample space for program storage, allowing for complex algorithms and applications to be implemented.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances performance by simplifying instructions and streamlining processing, making it efficient for real-time applications.

Maximum Clock Frequency: 24 MHz

Provides high-speed operation for demanding tasks, ensuring quick response times and efficient processing.

RAM Bytes: 2048

Offers a decent amount of random access memory for storing variables and temporary data during operation.

Technical Specifications

Microcontrollers MSP430FR5889IRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

3

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

131072

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9 mm

Peripheral IC Type:

Connectivity:

EUSCI(4)

Peripherals:

BOR, COMPARATOR(16), DMA(3), POR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

MSP430FR5889IRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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