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MSP430FR58891IPM

Texas Instruments

MSP430FR58891IPM by Texas Instruments

MSP430FR58891IPM by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 2048 RAM bytes, and 12-Ch 12-Bit ADC channels. It is ideal for industrial applications requiring low power consumption, featuring BOR, RTC, and WDT peripherals. Operating temperature ranges from -40 to 85 °C with a max clock frequency of 24 MHz.

Median Price

$6.063

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,670 parts In-Stock

1+ parts

$6.063

100+ parts

$4.943

1k+ parts

$3.295

10k+ parts

-

9,670

$6.063

$4.943

$3.295

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,170 parts In-Stock

1+ parts

$5.760

100+ parts

-

1k+ parts

-

10k+ parts

-

4,170

$5.760

-

-

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$6.078

100+ parts

-

1k+ parts

-

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500

$6.078

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-

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Vyrian

USA . 3,625 parts In-Stock

1+ parts

-

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-

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3,625

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 9,615 parts In-Stock

1+ parts

$5.150

100+ parts

$5.021

1k+ parts

$4.996

10k+ parts

-

9,615

$5.150

$5.021

$4.996

-

Ampacity Inc.

Singapore . 9,190 parts In-Stock

1+ parts

$5.150

100+ parts

-

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9,190

$5.150

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Corphita

USA . 778 parts In-Stock

1+ parts

$5.457

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-

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778

$5.457

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-

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Continental Prestige Electronics

USA . 140 parts In-Stock

1+ parts

$6.078

100+ parts

-

1k+ parts

-

10k+ parts

$5.956

140

$6.078

-

-

$5.956

AZTECH Wire

Italy . 142 parts In-Stock

1+ parts

$13.040

100+ parts

-

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142

$13.040

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Corohmni

South Africa . 285 parts In-Stock

1+ parts

$17.210

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285

$17.210

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Parana Technologies

USA . 1,732 parts In-Stock

1+ parts

$71.421

100+ parts

-

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1,732

$71.421

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$77.522

100+ parts

$73.646

1k+ parts

$73.646

10k+ parts

-

3,000

$77.522

$73.646

$73.646

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DigiPath Technology Company

USA . 332 parts In-Stock

1+ parts

$78.643

100+ parts

-

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332

$78.643

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IDEA Electronic Components Group

UK . 790 parts In-Stock

1+ parts

$80.248

100+ parts

$76.236

1k+ parts

$72.223

10k+ parts

-

790

$80.248

$76.236

$72.223

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ChromeModa Solutions

Germany . 420 parts In-Stock

1+ parts

$80.248

100+ parts

$65.803

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420

$80.248

$65.803

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Argo Parts USA

USA . 1,074 parts In-Stock

1+ parts

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1,074

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$5.956

1k+ parts

$5.774

10k+ parts

$5.652

500

-

$5.956

$5.774

$5.652

Overview

Unlock the power of innovation with the Texas Instruments MSP430FR58891IPM microcontroller. Designed for high-performance applications, this device boasts integrated cache and low power modes, making it ideal for a wide range of industrial uses. With Texas Instruments' reputation for quality and reliability, customers can trust in the superior performance and durability of this microcontroller. Whether you're looking to optimize your system's efficiency or enhance its functionality, the MSP430FR58891IPM offers unmatched value and benefits that will take your projects to the next level. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a cost-effective and durable packaging solution for the microcontroller.

Integrated Cache: YES

The integrated cache helps improve the data processing speed, making this microcontroller efficient for various applications.

Surface Mount: YES

The surface mount capability allows for easy and secure mounting on PCBs, ensuring reliability in electronic designs.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle power inputs efficiently, providing versatility in different power supply configurations.

On Chip Data RAM Width: 8

The 8-bit data RAM width enhances the performance of the microcontroller by allowing for quick access and manipulation of data.

Package Shape: SQUARE

The square package shape offers a compact design, optimizing space utilization in electronic devices.

Bit Size: 16

The 16-bit architecture of this microcontroller enables processing of larger data chunks, increasing its computational capabilities.

No. of Terminals: 64

With 64 terminals, this microcontroller offers ample connectivity options for interfacing with external components.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

This package style ensures an easy and secure integration of the microcontroller on the PCB, ideal for space-constrained designs.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage allows for efficient power management, making this microcontroller suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions, increasing its durability and reliability.

Technical Specifications

Microcontrollers MSP430FR58891IPM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

3

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

131072

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Connectivity:

EUSCI(4)

Peripherals:

BOR, COMPARATOR(16), DMA(3), POR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

MSP430FR58891IPM Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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