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MSP430FR5887IPM

Texas Instruments

MSP430FR5887IPM by Texas Instruments

MSP430FR5887IPM by Texas Instruments is a 16-bit microcontroller with 64 terminals, 24 MHz clock frequency, and 12-Ch 12-Bit ADC channels. Ideal for industrial applications requiring low power consumption, it features FRAM ROM programmability and multiple peripherals like BOR, RTC, and DMA.

Median Price

$7.075

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,350 parts In-Stock

1+ parts

$7.075

100+ parts

$5.768

1k+ parts

$3.845

10k+ parts

-

9,350

$7.075

$5.768

$3.845

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,391 parts In-Stock

1+ parts

$6.721

100+ parts

-

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-

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2,391

$6.721

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-

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Vyrian

USA . 2,766 parts In-Stock

1+ parts

-

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-

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-

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2,766

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,979 parts In-Stock

1+ parts

$6.368

100+ parts

-

1k+ parts

-

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2,979

$6.368

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-

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AZTECH Wire

Italy . 1,158 parts In-Stock

1+ parts

$21.250

100+ parts

-

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-

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1,158

$21.250

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Parana Technologies

USA . 343 parts In-Stock

1+ parts

$65.159

100+ parts

-

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-

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343

$65.159

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DigiPath Technology Company

USA . 106 parts In-Stock

1+ parts

$71.748

100+ parts

$66.008

1k+ parts

-

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106

$71.748

$66.008

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ChromeModa Solutions

Germany . 4,998 parts In-Stock

1+ parts

$73.212

100+ parts

$60.034

1k+ parts

-

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4,998

$73.212

$60.034

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IDEA Electronic Components Group

UK . 84 parts In-Stock

1+ parts

$73.212

100+ parts

$69.551

1k+ parts

$65.891

10k+ parts

-

84

$73.212

$69.551

$65.891

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QUARKTWIN TECHNOLOGY LTD

USA . 2,838 parts In-Stock

1+ parts

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2,838

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Component Stockers USA

USA . 474 parts In-Stock

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474

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Overview

Unlock the full potential of your innovative projects with the Texas Instruments MSP430FR5887IPM microcontroller. Renowned for its exceptional quality and cutting-edge technology, Texas Instruments delivers a product that exceeds expectations in the realm of microcontrollers. Ideal for a wide range of applications, this device offers unparalleled value and benefits, providing customers with a reliable and efficient solution to their design needs. Experience the advantages of the MSP430FR5887IPM and take your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY package body material makes the product lightweight and durable, ideal for portable devices.

Integrated Cache: YES

Integrated cache improves the performance of the microcontroller by reducing access times to frequently used data.

Surface Mount: YES

Surface mount design makes it easy to integrate the microcontroller onto PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6 V allows for compatibility with a wide range of power sources.

CPU Family: MSP430

Part of the MSP430 CPU family known for its low power consumption and high performance, making it suitable for battery-operated devices.

Technical Specifications

Microcontrollers MSP430FR5887IPM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

3

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Connectivity:

EUSCI(4)

Peripherals:

BOR, COMPARATOR(16), DMA(3), POR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

MSP430FR5887IPM Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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