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MSP430FR5872IRGCR

Texas Instruments

MSP430FR5872IRGCR by Texas Instruments

MSP430FR5872IRGCR by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 24 MHz. It features 8 ADC channels, 3 DMA channels, and FRAM ROM programmability. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$3.798

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,950 parts In-Stock

1+ parts

$3.798

100+ parts

$3.096

1k+ parts

$2.064

10k+ parts

-

3,950

$3.798

$3.096

$2.064

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,781 parts In-Stock

1+ parts

$3.608

100+ parts

-

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4,781

$3.608

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Vyrian

USA . 4,579 parts In-Stock

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4,579

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 167 parts In-Stock

1+ parts

$3.418

100+ parts

-

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-

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167

$3.418

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AZTECH Wire

Italy . 827 parts In-Stock

1+ parts

$9.140

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827

$9.140

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Microchip USA

USA . 3,161 parts In-Stock

1+ parts

$18.782

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3,161

$18.782

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Parana Technologies

USA . 632 parts In-Stock

1+ parts

$35.418

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632

$35.418

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ChromeModa Solutions

Germany . 4,200 parts In-Stock

1+ parts

$39.795

100+ parts

$32.632

1k+ parts

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4,200

$39.795

$32.632

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IDEA Electronic Components Group

UK . 128 parts In-Stock

1+ parts

$39.795

100+ parts

$37.805

1k+ parts

$35.816

10k+ parts

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128

$39.795

$37.805

$35.816

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DigiPath Technology Company

USA . 1,419 parts In-Stock

1+ parts

-

100+ parts

$35.879

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1,419

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$35.879

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Overview

Experience the cutting-edge technology of Texas Instruments with the MSP430FR5872IRGCR microcontroller, offering unparalleled performance in a compact package. Ideal for a wide range of applications, this microcontroller boasts advanced features such as low power mode, on-chip FRAM programmability, and multiple peripherals like BOR, RTC, and more. With a maximum clock frequency of 24 MHz and 51 I/O lines, this microcontroller delivers superior functionality and efficiency. Trust Texas Instruments for top-quality products that exceed expectations and provide reliable solutions for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in microcontrollers as it provides good insulation properties and is cost-effective.

Maximum Supply Voltage: 3.6 V

Having a higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes this microcontroller suitable for use in harsh environmental conditions.

ROM Words: 65536

With a large ROM capacity, this microcontroller can store a significant amount of program data, making it suitable for complex applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microcontroller efficient and robust.

Analog To Digital Convertors: 8-Ch 12-Bit

Having multiple ADC channels with high resolution allows for accurate analog signal processing, making this microcontroller versatile in applications requiring analog input.

PWM Channels: YES

PWM capability enables precise control of output signals and is essential for applications such as motor control and power management.

No. of I/O Lines: 51

The large number of I/O lines provides flexibility for connecting to external components and peripherals, making this microcontroller suitable for diverse applications.

Technical Specifications

Microcontrollers MSP430FR5872IRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

51

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Connectivity:

EUSCI(4)

Peripherals:

BOR, DMA(3), RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR5872IRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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