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MSP430FR58721IRGCR

Texas Instruments

MSP430FR58721IRGCR by Texas Instruments

MSP430FR58721IRGCR by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 24 MHz. Featuring FRAM ROM programmability and low power mode, it offers 8 ADC channels and 3 DMA channels for industrial applications requiring high-speed processing and low supply current.

Median Price

$3.798

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,950 parts In-Stock

1+ parts

$3.798

100+ parts

$3.096

1k+ parts

$2.064

10k+ parts

-

3,950

$3.798

$3.096

$2.064

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 304 parts In-Stock

1+ parts

$3.608

100+ parts

-

1k+ parts

-

10k+ parts

-

304

$3.608

-

-

-

Vyrian

USA . 3,973 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

-

3,973

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,222 parts In-Stock

1+ parts

$3.418

100+ parts

-

1k+ parts

-

10k+ parts

-

2,222

$3.418

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-

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AZTECH Wire

Italy . 1,041 parts In-Stock

1+ parts

$9.390

100+ parts

-

1k+ parts

-

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1,041

$9.390

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Parana Technologies

USA . 1,964 parts In-Stock

1+ parts

$13.564

100+ parts

-

1k+ parts

$14.066

10k+ parts

-

1,964

$13.564

-

$14.066

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DigiPath Technology Company

USA . 1,832 parts In-Stock

1+ parts

$14.935

100+ parts

-

1k+ parts

-

10k+ parts

-

1,832

$14.935

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-

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ChromeModa Solutions

Germany . 2,934 parts In-Stock

1+ parts

$15.240

100+ parts

$12.497

1k+ parts

-

10k+ parts

-

2,934

$15.240

$12.497

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IDEA Electronic Components Group

UK . 493 parts In-Stock

1+ parts

$15.240

100+ parts

$14.478

1k+ parts

$13.716

10k+ parts

-

493

$15.240

$14.478

$13.716

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Microchip USA

USA . 1,439 parts In-Stock

1+ parts

$18.020

100+ parts

$17.910

1k+ parts

$17.860

10k+ parts

$17.800

1,439

$18.020

$17.910

$17.860

$17.800

Overview

Unlock the power of innovation with the Texas Instruments MSP430FR58721IRGCR microcontroller. Crafted with precision and expertise, this versatile device offers unparalleled performance and reliability for a wide range of applications. From IoT devices to industrial automation, this microcontroller provides seamless connectivity and advanced features to streamline your projects. Experience the value of cutting-edge technology with the MSP430FR58721IRGCR and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the microcontroller lightweight and cost-effective.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 3.6 V

Support for a high maximum supply voltage allows for flexibility in power supply options.

On Chip Data RAM Width: 8

Having a wider data RAM width enhances the data processing capabilities of the microcontroller.

Package Shape: SQUARE

Square package shape provides efficient use of space on the PCB.

Bit Size: 16

16-bit architecture enables handling of larger data sizes and more complex computations.

No. of Terminals: 64

A higher number of terminals allow for more connectivity options and expansion capabilities.

Minimum Supply Voltage: 1.8 V

Support for a low minimum supply voltage enables power-efficient operation.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the microcontroller can operate reliably in various environmental conditions.

CPU Family: MSP430

The MSP430 family is known for its low power consumption, making it suitable for battery-powered applications.

Minimum Operating Temperature: -40 °C

The microcontroller can operate in extremely cold temperatures, making it suitable for industrial and automotive applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of these high-quality materials for terminal finish ensures reliable connections and durability.

ADC Channels: YES

Having analog-to-digital converter channels simplifies interfacing with analog sensors and signals.

DMA Channels: YES

Support for direct memory access channels enhances data transfer speeds and efficiency.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers high performance and efficiency in executing instructions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Technical Specifications

Microcontrollers MSP430FR58721IRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

51

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Connectivity:

EUSCI(4)

Peripherals:

BOR, DMA(3), RTC, TIMER(5), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR58721IRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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