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MSP430FR5869IRGZT

Texas Instruments

MSP430FR5869IRGZT by Texas Instruments

MSP430FR5869IRGZT by Texas Instruments is a 16-bit microcontroller with 48 terminals, operating at up to 16 MHz. It features 18-Ch 12-Bit ADCs, FRAM ROM programmability, and low power mode. Ideal for industrial applications requiring high-speed processing and connectivity via I2C, IRDA, SPI, UART, and USCI interfaces.

Median Price

$5.582

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 12,190 parts In-Stock

1+ parts

$4.504

100+ parts

$3.672

1k+ parts

$2.448

10k+ parts

-

12,190

$4.504

$3.672

$2.448

-

DigiKey

USA . 700 parts In-Stock

1+ parts

$6.660

100+ parts

$4.320

1k+ parts

$3.998

10k+ parts

-

700

$6.660

$4.320

$3.998

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,156 parts In-Stock

1+ parts

$4.279

100+ parts

-

1k+ parts

-

10k+ parts

-

3,156

$4.279

-

-

-

Vyrian

USA . 8,193 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,193

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,063 parts In-Stock

1+ parts

$4.054

100+ parts

-

1k+ parts

-

10k+ parts

-

3,063

$4.054

-

-

-

Parana Technologies

USA . 838 parts In-Stock

1+ parts

$25.709

100+ parts

-

1k+ parts

$26.312

10k+ parts

-

838

$25.709

-

$26.312

-

DigiPath Technology Company

USA . 1,012 parts In-Stock

1+ parts

$28.309

100+ parts

$26.045

1k+ parts

-

10k+ parts

-

1,012

$28.309

$26.045

-

-

ChromeModa Solutions

Germany . 2,613 parts In-Stock

1+ parts

$28.887

100+ parts

$23.687

1k+ parts

-

10k+ parts

-

2,613

$28.887

$23.687

-

-

IDEA Electronic Components Group

UK . 1,341 parts In-Stock

1+ parts

$28.887

100+ parts

$27.443

1k+ parts

$25.998

10k+ parts

-

1,341

$28.887

$27.443

$25.998

-

Microchip USA

USA . 1,262 parts In-Stock

1+ parts

$29.730

100+ parts

$29.550

1k+ parts

$29.460

10k+ parts

$29.370

1,262

$29.730

$29.550

$29.460

$29.370

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$64.315

100+ parts

$58.527

1k+ parts

$52.738

10k+ parts

-

3,000

$64.315

$58.527

$52.738

-

Overview

Unlock the full potential of your projects with the Texas Instruments MSP430FR5869IRGZT microcontroller. Known for their top-notch quality and reliability, Texas Instruments offers a wide range of applications for this versatile device. From industrial automation to consumer electronics, the MSP430FR5869IRGZT delivers outstanding performance and efficiency. With low power consumption and advanced features like built-in ADC channels and PWM capability, this microcontroller is designed to streamline your development process and bring your ideas to life. Choose Texas Instruments for unparalleled value and unbeatable results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a wide range of applications while ensuring longevity.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with various voltage sources.

No. of Terminals: 48

With a high number of terminals, the product can support a wide range of input and output connections for versatile functionality.

CPU Family: MSP430

Being part of the MSP430 family ensures reliability, compatibility, and access to a range of support and development resources.

ADC Channels: YES

The presence of Analog to Digital Converter channels allows for accurate conversion of analog signals to digital data, expanding the product's usability in various applications.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency enables fast processing speeds and real-time data handling, making the product suitable for time-sensitive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Featuring RISC architecture enhances performance and efficiency in instruction execution, making the product a powerful choice for computing tasks.

Analog To Digital Convertors: 18-Ch 12-Bit

Having multiple ADC channels with a high resolution of 12 bits ensures accurate conversion of analog signals, catering to precise measurement and control requirements.

Connectivity: I2C, IRDA, SPI(1), UART, USCI(3)

Offering multiple communication interfaces expands the product's compatibility and integration capabilities with various devices and systems.

Moisture Sensitivity Level (MSL): 3

With a moderate MSL, the product can withstand moderate levels of moisture exposure during storage and handling, ensuring reliability in various environmental conditions.

Technical Specifications

Microcontrollers MSP430FR5869IRGZT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

40

No. of Serial I/Os:

2

No. of Terminals:

48

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(1), UART, USCI(3)"

Peripherals:

"COMPARATOR, CRC,RTC, TIMER(15), WDT"

Analog To Digital Convertors:

18-Ch 12-Bit

Trade Compliance

MSP430FR5869IRGZT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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