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MSP430FR58671IRGZR

Texas Instruments

MSP430FR58671IRGZR by Texas Instruments

MSP430FR58671IRGZR by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 32768 ROM words. It features 18-Ch 12-Bit ADC channels, 3 DMA channels, and peripherals like CRC, RTC, and timers. Ideal for industrial applications requiring low power consumption and high-speed processing up to 16 MHz.

Median Price

$2.870

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,950 parts In-Stock

1+ parts

$2.870

100+ parts

$2.340

1k+ parts

$1.560

10k+ parts

-

9,950

$2.870

$2.340

$1.560

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,374 parts In-Stock

1+ parts

$2.726

100+ parts

-

1k+ parts

-

10k+ parts

-

4,374

$2.726

-

-

-

Vyrian

USA . 1,090 parts In-Stock

1+ parts

$2.870

100+ parts

-

1k+ parts

-

10k+ parts

-

1,090

$2.870

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,274 parts In-Stock

1+ parts

$2.583

100+ parts

-

1k+ parts

-

10k+ parts

-

2,274

$2.583

-

-

-

Microchip USA

USA . 1,595 parts In-Stock

1+ parts

$13.620

100+ parts

$13.540

1k+ parts

$13.500

10k+ parts

$13.450

1,595

$13.620

$13.540

$13.500

$13.450

AZTECH Wire

Italy . 709 parts In-Stock

1+ parts

$17.280

100+ parts

-

1k+ parts

-

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709

$17.280

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-

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Parana Technologies

USA . 330 parts In-Stock

1+ parts

$65.309

100+ parts

-

1k+ parts

-

10k+ parts

-

330

$65.309

-

-

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DigiPath Technology Company

USA . 2,140 parts In-Stock

1+ parts

$71.913

100+ parts

$66.160

1k+ parts

-

10k+ parts

-

2,140

$71.913

$66.160

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ChromeModa Solutions

Germany . 2,642 parts In-Stock

1+ parts

$73.381

100+ parts

$60.172

1k+ parts

-

10k+ parts

-

2,642

$73.381

$60.172

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IDEA Electronic Components Group

UK . 1,412 parts In-Stock

1+ parts

$73.381

100+ parts

$69.712

1k+ parts

$66.043

10k+ parts

-

1,412

$73.381

$69.712

$66.043

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QUARKTWIN TECHNOLOGY LTD

USA . 29,841 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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29,841

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Overview

Unlock the potential of your projects with the MSP430FR58671IRGZR microcontroller from Texas Instruments. As a leader in the industry, Texas Instruments is known for delivering high-quality products that exceed customer expectations. Ideal for a wide range of applications, this microcontroller offers unparalleled value and benefits, such as low power consumption and advanced connectivity options. Say goodbye to limitations and hello to endless possibilities with the MSP430FR58671IRGZR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in powering the microcontroller while still staying within safe operating limits.

ADC Channels: YES

Integrated Analog to Digital Converters allow for easy interfacing with analog sensors and signals.

PWM Channels: YES

Pulse Width Modulation channels provide options for controlling motor speed, LED brightness, and other analog outputs.

Connectivity: I2C, IRDA, SPI(1), UART, USCI(3)

Multiple communication interfaces allow for versatile connectivity options with other devices or peripherals.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient processing and execution of instructions, making the microcontroller suitable for a wide range of applications.

Speed: 16 rpm

Operates at a moderate speed suitable for various real-time applications without compromising on power efficiency.

Low Power Mode: YES

Supports low power consumption mode, making it ideal for battery-powered or energy-efficient devices.

Technical Specifications

Microcontrollers MSP430FR58671IRGZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

40

No. of Serial I/Os:

2

No. of Terminals:

48

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

1024

RAM Words:

1

ROM Words:

32768

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(1), UART, USCI(3)"

Peripherals:

"COMPARATOR, CRC,RTC, TIMER(15), WDT"

Analog To Digital Convertors:

18-Ch 12-Bit

Trade Compliance

MSP430FR58671IRGZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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