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MSP430FR5858IRHAT

Texas Instruments

MSP430FR5858IRHAT by Texas Instruments

MSP430FR5858IRHAT by Texas Instruments is a 16-bit microcontroller with 49152 ROM words and 2048 RAM bytes. It features 16-Ch 12-Bit ADC channels, 3 DMA channels, and operates at a max clock frequency of 16 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$5.990

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,500 parts In-Stock

1+ parts

$4.002

100+ parts

$3.263

1k+ parts

$2.175

10k+ parts

-

7,500

$4.002

$3.263

$2.175

-

DigiKey

USA . 330 parts In-Stock

1+ parts

$5.990

100+ parts

$4.241

1k+ parts

$3.509

10k+ parts

$3.377

330

$5.990

$4.241

$3.509

$3.377

Mouser Electronics

USA . 175 parts In-Stock

1+ parts

$5.990

100+ parts

$4.250

1k+ parts

$3.370

10k+ parts

-

175

$5.990

$4.250

$3.370

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,680 parts In-Stock

1+ parts

$3.802

100+ parts

-

1k+ parts

-

10k+ parts

-

2,680

$3.802

-

-

-

Vyrian

USA . 8,967 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,967

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,232 parts In-Stock

1+ parts

$3.602

100+ parts

-

1k+ parts

-

10k+ parts

-

2,232

$3.602

-

-

-

Microchip USA

USA . 1,180 parts In-Stock

1+ parts

$26.420

100+ parts

$26.250

1k+ parts

$26.170

10k+ parts

$26.090

1,180

$26.420

$26.250

$26.170

$26.090

Parana Technologies

USA . 1,886 parts In-Stock

1+ parts

$57.691

100+ parts

-

1k+ parts

-

10k+ parts

-

1,886

$57.691

-

-

-

DigiPath Technology Company

USA . 887 parts In-Stock

1+ parts

$63.525

100+ parts

$58.443

1k+ parts

-

10k+ parts

-

887

$63.525

$58.443

-

-

ChromeModa Solutions

Germany . 6,134 parts In-Stock

1+ parts

$64.821

100+ parts

$53.153

1k+ parts

-

10k+ parts

-

6,134

$64.821

$53.153

-

-

IDEA Electronic Components Group

UK . 1,858 parts In-Stock

1+ parts

$64.821

100+ parts

$61.580

1k+ parts

$58.339

10k+ parts

-

1,858

$64.821

$61.580

$58.339

-

Overview

Unlock the power of innovation with the Texas Instruments MSP430FR5858IRHAT microcontroller. Designed to meet the highest quality standards, this versatile device offers a wide range of applications in various industries. With advanced features and cutting-edge technology, it provides unmatched value and performance for customers seeking reliable solutions. Elevate your projects with the outstanding benefits and advantages that this exceptional product delivers, setting new standards in efficiency and functionality. Trust in Texas Instruments for top-notch quality and superior performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material offers high durability and protection for the microcontroller.

Maximum Supply Voltage: 3.6 V

This higher supply voltage allows for greater flexibility in power input.

CPU Family: MSP430

Belonging to the MSP430 family ensures compatibility and support for a wide range of applications.

ADC Channels: YES

Having Analog to Digital Converters (ADC) channels enables the microcontroller to handle analog input signals.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a Reduced Instruction Set Computer (RISC) microcontroller allows for efficient and fast processing of instructions.

Technology: CMOS

CMOS technology offers low power consumption and allows for high integration on a single chip.

Connectivity: "I2C, IRDA, SPI(1), UART, USCI(3)

Multiple connectivity options such as I2C, UART, and SPI enhance communication capabilities with other devices.

ROM Programmability: FRAM

Ferroelectric Random Access Memory (FRAM) technology provides fast and reliable non-volatile data storage.

Low Power Mode: YES

Support for low power modes helps in conserving energy and prolonging battery life.

Technical Specifications

Microcontrollers MSP430FR5858IRHAT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

33

No. of Serial I/Os:

2

No. of Terminals:

40

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

49152

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(1), UART, USCI(3)"

Peripherals:

"COMPARATOR, CRC,RTC, TIMER(15), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430FR5858IRHAT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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