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MSP430FR5858IRHAR

Texas Instruments

MSP430FR5858IRHAR by Texas Instruments

MSP430FR5858IRHAR by Texas Instruments is a 16-bit microcontroller with 49152 ROM words, 2048 RAM bytes, and 16 ADC channels. Ideal for industrial applications requiring low power consumption, it features peripherals like CRC, RTC, and UART connectivity. Operating temperature ranges from -40 to 85°C.

Median Price

$3.362

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 22,056 parts In-Stock

1+ parts

$3.362

100+ parts

$2.741

1k+ parts

$1.827

10k+ parts

-

22,056

$3.362

$2.741

$1.827

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 703 parts In-Stock

1+ parts

$3.194

100+ parts

-

1k+ parts

-

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-

703

$3.194

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Vyrian

USA . 8,858 parts In-Stock

1+ parts

-

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-

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-

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-

8,858

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 734 parts In-Stock

1+ parts

$3.026

100+ parts

-

1k+ parts

-

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734

$3.026

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AZTECH Wire

Italy . 1,054 parts In-Stock

1+ parts

$14.340

100+ parts

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1,054

$14.340

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Parana Technologies

USA . 404 parts In-Stock

1+ parts

$34.539

100+ parts

-

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404

$34.539

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ChromeModa Solutions

Germany . 5,119 parts In-Stock

1+ parts

$38.808

100+ parts

$31.823

1k+ parts

-

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5,119

$38.808

$31.823

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IDEA Electronic Components Group

UK . 658 parts In-Stock

1+ parts

$38.808

100+ parts

$36.868

1k+ parts

$34.927

10k+ parts

-

658

$38.808

$36.868

$34.927

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DigiPath Technology Company

USA . 787 parts In-Stock

1+ parts

-

100+ parts

$34.989

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787

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$34.989

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Overview

Unlock the power of innovation with the Texas Instruments MSP430FR5858IRHAR microcontroller, a cutting-edge solution for a wide range of applications. With its advanced technology and high-quality manufacturing by Texas Instruments, this microcontroller offers unparalleled value and benefits to customers. From industrial automation to consumer electronics, the MSP430FR5858IRHAR provides reliable performance, low power consumption, and versatile connectivity options. Experience the next level of efficiency and reliability with this exceptional microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material ensures durability and protection for the microcontroller, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy integration onto circuit boards, saving space and enabling streamlined manufacturing processes.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in power supply options and allows for compatibility with different voltage requirements in various systems.

ADC Channels: YES

Analog to Digital Converters enable the microcontroller to interface with analog sensors and signals, opening up opportunities for a wide range of applications.

Maximum Clock Frequency: 16 MHz

The high clock frequency enables fast processing speeds, making the microcontroller suitable for tasks that require quick data processing and response times.

Connectivity: "I2C, IRDA, SPI(1), UART, USCI(3)

The multiple connectivity options allow for versatile communication capabilities, enabling the microcontroller to interface with various devices and systems.

RAM Bytes: 2048

The ample RAM capacity allows for efficient data storage and manipulation, enhancing the performance and capabilities of the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller an energy-efficient and reliable choice for different applications.

Technical Specifications

Microcontrollers MSP430FR5858IRHAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

33

No. of Serial I/Os:

2

No. of Terminals:

40

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

49152

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(1), UART, USCI(3)"

Peripherals:

"COMPARATOR, CRC,RTC, TIMER(15), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430FR5858IRHAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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