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MSP430FR5857IDAR

Texas Instruments

MSP430FR5857IDAR by Texas Instruments

MSP430FR5857IDAR by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 32768 ROM words. It features 16-Ch 12-Bit ADC channels, 3 DMA channels, and peripherals like CRC, RTC, and timers. Ideal for industrial applications requiring low power consumption and high-speed processing up to 16 MHz.

Median Price

$2.782

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,230 parts In-Stock

1+ parts

$2.782

100+ parts

$2.268

1k+ parts

$1.512

10k+ parts

-

10,230

$2.782

$2.268

$1.512

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,733 parts In-Stock

1+ parts

$2.643

100+ parts

-

1k+ parts

-

10k+ parts

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2,733

$2.643

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-

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Vyrian

USA . 6,200 parts In-Stock

1+ parts

-

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-

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10k+ parts

-

6,200

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 267 parts In-Stock

1+ parts

$2.504

100+ parts

-

1k+ parts

-

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267

$2.504

-

-

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AZTECH Wire

Italy . 996 parts In-Stock

1+ parts

$12.220

100+ parts

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996

$12.220

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Microchip USA

USA . 2,658 parts In-Stock

1+ parts

$13.200

100+ parts

$13.120

1k+ parts

$13.080

10k+ parts

$13.040

2,658

$13.200

$13.120

$13.080

$13.040

Parana Technologies

USA . 1,135 parts In-Stock

1+ parts

$13.886

100+ parts

-

1k+ parts

$14.367

10k+ parts

-

1,135

$13.886

-

$14.367

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DigiPath Technology Company

USA . 352 parts In-Stock

1+ parts

$15.290

100+ parts

$14.067

1k+ parts

-

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352

$15.290

$14.067

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ChromeModa Solutions

Germany . 3,502 parts In-Stock

1+ parts

$15.602

100+ parts

$12.794

1k+ parts

-

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3,502

$15.602

$12.794

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IDEA Electronic Components Group

UK . 1,864 parts In-Stock

1+ parts

$15.602

100+ parts

$14.822

1k+ parts

$14.042

10k+ parts

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1,864

$15.602

$14.822

$14.042

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Overview

Unlock the power of innovation with the Texas Instruments MSP430FR5857IDAR Microcontroller. Known for its superior quality and cutting-edge technology, Texas Instruments delivers unmatched performance in the world of microcontrollers. Ideal for a wide range of applications, this product offers customers unparalleled value with its low power consumption, high-speed processing, and advanced connectivity options. Whether you're designing IoT devices, smart home systems, or industrial automation solutions, the MSP430FR5857IDAR is the perfect choice to bring your ideas to life. Discover the difference that Texas Instruments can make in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wider range of systems.

No. of Terminals: 38

Higher number of terminals provide more connectivity options and versatility in designing circuits with this microcontroller.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stability and reliability in harsh environmental conditions.

ADC Channels: YES

Presence of ADC channels enables analog-to-digital conversion, making the microcontroller suitable for applications involving sensor interfacing.

Peripherals: COMP, CRC, RTC, TIMER(15), WDT

Wide range of peripherals including comparators, timers, and watchdog timer enhance the functionality and capabilities of the microcontroller.

Analog To Digital Convertors: 16-Ch 12-Bit

High-resolution ADC with 16 channels allows for accurate and precise conversion of analog signals into digital data.

Connectivity: I2C, IRDA, SPI(1), UART, USCI(3)

Multiple connectivity options such as I2C, SPI, and UART facilitate communication with other devices, expanding the microcontroller's compatibility.

Low Power Mode: YES

Inclusion of low power mode helps in conserving energy and prolonging battery life in power-sensitive applications.

Speed: 16 rpm

Operational speed of 16 rpm ensures efficient processing and execution of tasks, making the microcontroller suitable for real-time applications.

Technical Specifications

Microcontrollers MSP430FR5857IDAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

33

No. of Serial I/Os:

2

No. of Terminals:

38

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

1024

RAM Words:

1

ROM Words:

32768

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.2 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(1), UART, USCI(3)"

Peripherals:

"COMPARATOR, CRC,RTC, TIMER(15), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430FR5857IDAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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