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MSP430FR58471IRHAT

Texas Instruments

MSP430FR58471IRHAT by Texas Instruments

MSP430FR58471IRHAT by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 32768 ROM words. It features 16 ADC channels, 3 DMA channels, and peripherals like CRC, RTC, and timers. Ideal for industrial applications requiring low power consumption and high-speed processing up to 16 MHz.

Median Price

$5.090

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 31,750 parts In-Stock

1+ parts

$3.338

100+ parts

$2.721

1k+ parts

$1.814

10k+ parts

-

31,750

$3.338

$2.721

$1.814

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Mouser Electronics

USA . 239 parts In-Stock

1+ parts

$5.090

100+ parts

$3.250

1k+ parts

$2.980

10k+ parts

-

239

$5.090

$3.250

$2.980

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DigiKey

USA . 230 parts In-Stock

1+ parts

$5.090

100+ parts

$3.244

1k+ parts

$3.085

10k+ parts

-

230

$5.090

$3.244

$3.085

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Distributors (In-Stock)

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Digiode

USA . 3,540 parts In-Stock

1+ parts

$3.171

100+ parts

-

1k+ parts

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3,540

$3.171

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-

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Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$3.613

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200

$3.613

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Chip Stock

USA . 6,170 parts In-Stock

1+ parts

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6,170

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Vyrian

USA . 5,022 parts In-Stock

1+ parts

-

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5,022

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 10,532 parts In-Stock

1+ parts

$1.930

100+ parts

-

1k+ parts

-

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10,532

$1.930

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-

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Corphita

USA . 130 parts In-Stock

1+ parts

$3.004

100+ parts

-

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130

$3.004

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$3.541

100+ parts

-

1k+ parts

$3.400

10k+ parts

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1,000

$3.541

-

$3.400

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Argo Parts USA

USA . 4,001 parts In-Stock

1+ parts

$3.613

100+ parts

-

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4,001

$3.613

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-

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Continental Prestige Electronics

USA . 1,696 parts In-Stock

1+ parts

$3.613

100+ parts

-

1k+ parts

-

10k+ parts

$3.541

1,696

$3.613

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-

$3.541

Corohmni

South Africa . 97 parts In-Stock

1+ parts

$21.690

100+ parts

-

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97

$21.690

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Parana Technologies

USA . 1,602 parts In-Stock

1+ parts

$72.896

100+ parts

-

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1,602

$72.896

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DigiPath Technology Company

USA . 459 parts In-Stock

1+ parts

$80.268

100+ parts

$73.846

1k+ parts

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459

$80.268

$73.846

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ChromeModa Solutions

Germany . 4,422 parts In-Stock

1+ parts

$81.906

100+ parts

$67.163

1k+ parts

-

10k+ parts

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4,422

$81.906

$67.163

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IDEA Electronic Components Group

UK . 384 parts In-Stock

1+ parts

$81.906

100+ parts

$77.811

1k+ parts

$73.715

10k+ parts

-

384

$81.906

$77.811

$73.715

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Overview

Unlock unparalleled performance and reliability with the MSP430FR58471IRHAT microcontroller by Texas Instruments, a trusted industry leader. Ideal for a wide range of applications, this advanced technology offers customers unmatched value, benefits, and advantages. Experience seamless connectivity, low power consumption, and superior functionality in a compact package. Trust Texas Instruments to deliver cutting-edge solutions that meet your needs and exceed your expectations. Elevate your projects with the MSP430FR58471IRHAT and see the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

The surface mount capability allows for easy and efficient assembly onto PCBs.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle high voltage applications.

On Chip Data RAM Width: 8

The 8-bit width of on-chip data RAM provides efficient storage and access to data.

Package Shape: SQUARE

The square package shape enables easy integration into compact electronic devices.

Bit Size: 16

The 16-bit architecture allows for efficient processing of instructions and data.

No. of Terminals: 40

Having 40 terminals provides ample connectivity options for various peripherals and components.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style ensures effective heat dissipation and compact design.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage makes the microcontroller suitable for low-power applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the reliability of the product in harsh environments.

CPU Family: MSP430

Being part of the MSP430 family guarantees high performance and reliability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent corrosion resistance and conductivity.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to interface with analog sensors and devices.

DMA Channels: YES

DMA channels facilitate efficient data transfer without CPU intervention, enhancing overall performance.

Terminal Position: QUAD

The quad terminal position allows for convenient PCB layout and connection.

ROM Words: 32768

The large ROM size provides ample space for program storage and data logging.

Maximum Seated Height: 1 mm

The low seated height makes the product suitable for compact designs with height restrictions.

Width: 6 mm

The 6mm width ensures compatibility with standard PCB layout requirements.

Boundary Scan: YES

Boundary scan capability allows for thorough testing and debugging of the microcontroller.

Peripherals: COMPARATOR, CRC,RTC, TIMER(15), WDT

The various peripherals enhance the functionality and versatility of the microcontroller.

Maximum Clock Frequency: 16 MHz

The high clock frequency enables fast processing of instructions and data.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature ensures the reliability of solder joints during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature guarantees proper soldering and assembly of the microcontroller.

Length: 6 mm

The 6mm length makes the microcontroller suitable for compact electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability and performance in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller ensures efficient and fast processing of instructions.

No. of Timers: 15

With 15 timers, the microcontroller can handle precise timing and scheduling of tasks.

RAM Bytes: 1024

The 1024 bytes of RAM provide sufficient memory for temporary data storage and manipulation.

Technology: CMOS

The CMOS technology ensures low power consumption and high noise immunity.

Terminal Form: NO LEAD

The no-lead terminal form offers improved reliability and solder joint quality.

Analog To Digital Convertors: 16-Ch 12-Bit

The 16-channel 12-bit ADCs enable accurate conversion of analog signals.

Maximum Supply Current: 1.62 mA

The low supply current consumption makes the microcontroller energy-efficient.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage is a common standard in many electronic devices.

No. of DMA Channels: 3

With 3 DMA channels, the microcontroller can efficiently handle data transfer tasks.

No. of Serial I/Os: 2

Having 2 serial I/Os allows for communication with other devices through serial interfaces.

PWM Channels: YES

The presence of PWM channels enables the microcontroller to generate precise analog voltage levels.

Connectivity: I2C, IRDA, SPI(1), UART, USCI(3)

The various connectivity options offer flexibility in interfacing with external devices and communication protocols.

ROM Programmability: FRAM

The FRAM programmability ensures fast and reliable programming of the microcontroller's ROM.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for high-density mounting on PCBs.

Format: FIXED POINT

The fixed-point format ensures accuracy in numerical computations.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the microcontroller can withstand moderate exposure to moisture during storage and handling.

Speed: 16 rpm

The 16 rpm speed specification is indicative of the microcontroller's processing speed capabilities.

Low Power Mode: YES

The low power mode feature allows for energy-efficient operation in battery-powered applications.

On Chip Program ROM Width: 8

The 8-bit ROM width provides efficient storage and retrieval of program instructions.

No. of I/O Lines: 33

With 33 I/O lines, the microcontroller can interface with a wide range of external devices and peripherals.

Technical Specifications

Microcontrollers MSP430FR58471IRHAT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

33

No. of Serial I/Os:

2

No. of Terminals:

40

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

1024

RAM Words:

1

ROM Words:

32768

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

1.62 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(1), UART, USCI(3)"

Peripherals:

"COMPARATOR, CRC,RTC, TIMER(15), WDT"

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

MSP430FR58471IRHAT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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