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MSP430FR5738IYQDT

Texas Instruments

MSP430FR5738IYQDT by Texas Instruments

MSP430FR5738IYQDT by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 16384 ROM words. It features 8 ADC channels, 3 DMA channels, and peripherals like comparators, CRC, RTC, and timers. Ideal for industrial applications requiring low power consumption and connectivity via I2C, IRDA, SCI, SPI, and UART interfaces at a max clock frequency of 24 MHz.

Median Price

$4.560

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,220 parts In-Stock

1+ parts

$3.733

100+ parts

$3.271

1k+ parts

$1.848

10k+ parts

-

1,220

$3.733

$3.271

$1.848

-

DigiKey

USA . 809 parts In-Stock

1+ parts

$4.560

100+ parts

$3.189

1k+ parts

$2.614

10k+ parts

-

809

$4.560

$3.189

$2.614

-

Mouser Electronics

USA . 15 parts In-Stock

1+ parts

$4.560

100+ parts

$2.890

1k+ parts

$2.530

10k+ parts

$2.510

15

$4.560

$2.890

$2.530

$2.510

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 118 parts In-Stock

1+ parts

$3.546

100+ parts

-

1k+ parts

-

10k+ parts

-

118

$3.546

-

-

-

Vyrian

USA . 8,412 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,412

-

-

-

-

Bristol Electronics

USA . 105 parts In-Stock

1+ parts

-

100+ parts

$1.846

1k+ parts

-

10k+ parts

-

105

-

$1.846

-

-

Dan-Mar Components

USA . 105 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

105

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,913 parts In-Stock

1+ parts

$3.360

100+ parts

-

1k+ parts

-

10k+ parts

-

3,913

$3.360

-

-

-

Microchip USA

USA . 2,753 parts In-Stock

1+ parts

$22.440

100+ parts

$22.310

1k+ parts

$22.240

10k+ parts

$22.170

2,753

$22.440

$22.310

$22.240

$22.170

Parana Technologies

USA . 40 parts In-Stock

1+ parts

$48.618

100+ parts

-

1k+ parts

-

10k+ parts

-

40

$48.618

-

-

-

ChromeModa Solutions

Germany . 6,736 parts In-Stock

1+ parts

$54.627

100+ parts

$44.794

1k+ parts

-

10k+ parts

-

6,736

$54.627

$44.794

-

-

IDEA Electronic Components Group

UK . 22 parts In-Stock

1+ parts

$54.627

100+ parts

$51.896

1k+ parts

$49.164

10k+ parts

-

22

$54.627

$51.896

$49.164

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,000

-

-

-

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DigiPath Technology Company

USA . 781 parts In-Stock

1+ parts

-

100+ parts

$49.252

1k+ parts

-

10k+ parts

-

781

-

$49.252

-

-

Overview

Unleash the power of innovation with the MSP430FR5738IYQDT by Texas Instruments, a cutting-edge microcontroller that boasts unparalleled quality and reliability. Designed for a wide range of applications, this device offers customers exceptional value and benefits, including low power consumption and high performance. With advanced features like connectivity options and on-chip peripherals, the MSP430FR5738IYQDT is the perfect choice for those seeking top-notch technology from a trusted manufacturer. Elevate your projects to new heights with this innovative microcontroller today!

Feature Benefit Bullets

Surface Mount: YES

Ease of manufacturing and mounting on PCBs, saving space and reducing overall product size.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a wide range of components.

On Chip Data RAM Width: 8

Sufficient RAM width for processing and storing data efficiently.

Package Shape: SQUARE

Square package shape provides uniformity and ease of integration into circuit designs.

Bit Size: 16

16-bit architecture allows for higher precision and performance compared to lower bit sizes.

No. of Terminals: 24

Sufficient number of terminals for connecting to external components and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Enables compact design with fine pitch for efficient routing of connections.

Minimum Supply Voltage: 2 V

Allows for operation at lower voltages, saving power and extending battery life.

Maximum Operating Temperature: 85 °C

Industrial-grade temperature range ensures reliability in various operating environments.

CPU Family: MSP430

Well-known and widely used CPU family known for low power consumption and high performance.

Technical Specifications

Microcontrollers MSP430FR5738IYQDT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-XBGA-B24

JESD-609 Code:

e1

Length:

2 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

21

No. of Serial I/Os:

1

No. of Terminals:

24

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA24,5X5,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

1024

RAM Words:

1

ROM Words:

16384

ROM Programmability:

FRAM

Maximum Seated Height:

.625 mm

Speed:

24 rpm

Maximum Supply Current:

4.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(2), SCI(3), SPI(3), UART(2)"

Peripherals:

"COMPARATOR(16), CRC, DMA(3), RTC, TIMER(5)"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430FR5738IYQDT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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