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MSP430FR5735IRHAR

Texas Instruments

MSP430FR5735IRHAR by Texas Instruments

MSP430FR5735IRHAR by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 8192 ROM words. It features 14-Ch 10-Bit ADC channels, 3 DMA channels, and PWM support. Ideal for industrial applications requiring low power consumption, it offers various connectivity options like I2C, SCI, SPI, and UART.

Median Price

$1.855

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 12,987 parts In-Stock

1+ parts

$1.855

100+ parts

$1.512

1k+ parts

$1.008

10k+ parts

-

12,987

$1.855

$1.512

$1.008

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,527 parts In-Stock

1+ parts

$1.762

100+ parts

-

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-

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-

4,527

$1.762

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-

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Vyrian

USA . 7,495 parts In-Stock

1+ parts

-

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7,495

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 12,862 parts In-Stock

1+ parts

$1.580

100+ parts

-

1k+ parts

-

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12,862

$1.580

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Corphita

USA . 3,739 parts In-Stock

1+ parts

$1.670

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-

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3,739

$1.670

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Microchip USA

USA . 2,120 parts In-Stock

1+ parts

$8.801

100+ parts

-

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2,120

$8.801

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AZTECH Wire

Italy . 897 parts In-Stock

1+ parts

$11.000

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897

$11.000

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Parana Technologies

USA . 279 parts In-Stock

1+ parts

$21.182

100+ parts

-

1k+ parts

$21.470

10k+ parts

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279

$21.182

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$21.470

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ChromeModa Solutions

Germany . 1,890 parts In-Stock

1+ parts

$23.800

100+ parts

$19.516

1k+ parts

-

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1,890

$23.800

$19.516

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IDEA Electronic Components Group

UK . 1,071 parts In-Stock

1+ parts

$23.800

100+ parts

$22.610

1k+ parts

$21.420

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1,071

$23.800

$22.610

$21.420

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Perfect Parts

USA . 16,377 parts In-Stock

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16,377

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DigiPath Technology Company

USA . 1,210 parts In-Stock

1+ parts

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100+ parts

$21.458

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1,210

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$21.458

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Overview

Unlock the power of cutting-edge technology with the MSP430FR5735IRHAR by Texas Instruments. Crafted with precision and quality, this microcontroller offers unmatched performance and reliability for a variety of applications. From industrial automation to consumer electronics, this versatile device delivers superior functionality and efficiency. Experience the seamless connectivity, low power consumption, and advanced features that set this product apart from the rest. Elevate your projects to new heights with the MSP430FR5735IRHAR - the ideal choice for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for various applications without adding unnecessary weight.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a wide range of voltage sources.

No. of Terminals: 40

Offers a sufficient number of connections for interfacing with other components and peripherals in a complex system.

ADC Channels: YES

Integrated ADC channels enable analog sensor data to be easily processed by the microcontroller, expanding its functionality.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing Reduced Instruction Set Computing (RISC) architecture allows for efficient processing and execution of instructions, improving overall performance.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable precise control of analog signals, making the microcontroller suitable for applications requiring accurate modulation.

Connectivity: I2C, IRDA(2), SCI(3), SPI(3), UART(2)

The multiple connectivity options provide flexibility for communication with other devices, making it versatile for diverse projects.

Technical Specifications

Microcontrollers MSP430FR5735IRHAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

32

No. of Serial I/Os:

1

No. of Terminals:

40

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

8192

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

24 rpm

Maximum Supply Current:

4.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(2), SCI(3), SPI(3), UART(2)"

Peripherals:

"COMPARATOR(16), CRC, DMA(3), RTC, TIMER(5)"

Analog To Digital Convertors:

14-Ch 10-Bit

Trade Compliance

MSP430FR5735IRHAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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