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MSP430FR5734IRGET

Texas Instruments

MSP430FR5734IRGET by Texas Instruments

MSP430FR5734IRGET by Texas Instruments is a 16-bit microcontroller with 24 terminals, operating at up to 24 MHz. It features FRAM ROM programmability, 1024 bytes of RAM, and ADC/DMA channels. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,400 parts In-Stock

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2,400

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Digiode

USA . 950 parts In-Stock

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950

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Distributors (Availability)

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One Stop Electronics

USA . 702 parts In-Stock

1+ parts

$6.000

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702

$6.000

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AZTECH Wire

Italy . 616 parts In-Stock

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$14.658

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616

$14.658

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Parana Technologies

USA . 1,904 parts In-Stock

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$53.779

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$53.779

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DigiPath Technology Company

USA . 1,369 parts In-Stock

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$59.217

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$54.480

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1,369

$59.217

$54.480

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ChromeModa Solutions

Germany . 6,496 parts In-Stock

1+ parts

$60.426

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$49.549

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6,496

$60.426

$49.549

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IDEA Electronic Components Group

UK . 543 parts In-Stock

1+ parts

$60.426

100+ parts

$57.405

1k+ parts

$54.383

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543

$60.426

$57.405

$54.383

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Corphita

USA . 1,258 parts In-Stock

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Microchip USA

USA . 461 parts In-Stock

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Overview

Discover the power and precision of the Texas Instruments MSP430FR5734IRGET microcontroller, a game-changer in the world of technology. With its cutting-edge features and reliable performance, this innovative product from a trusted manufacturer offers unparalleled value to customers across various industries. From automation to IoT applications, this versatile microcontroller is designed to meet your unique needs and exceed your expectations. Experience the difference with Texas Instruments and unleash the full potential of your projects with the MSP430FR5734IRGET.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures a lightweight and durable package for the microcontroller.

Surface Mount: YES

Surface mount capability makes it easy to integrate this microcontroller onto circuit boards efficiently.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle various power input levels effectively.

Package Shape: SQUARE

Square shape allows for efficient use of space on a circuit board.

Bit Size: 16

16-bit architecture provides enhanced processing capabilities.

Power Supplies (V): 2.5/3.3

Supports multiple power supply options for flexibility in design.

No. of Terminals: 24

Sufficient number of terminals for connectivity and interfacing with other components.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Various package styles offer different mounting options based on the application requirements.

Minimum Supply Voltage: 2 V

Can operate at a low minimum supply voltage for energy efficiency.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, suitable for industrial applications.

CPU Family: MSP430

MSP430 CPU family is known for its low power consumption and high performance.

Minimum Operating Temperature: -40 °C

Able to withstand very low temperatures, making it suitable for harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish for reliable connections.

ADC Channels: YES

Built-in ADC channels for analog input capabilities.

DMA Channels: YES

Supports direct memory access for efficient data transfer.

Terminal Position: QUAD

Quad terminal position for easy soldering and board layout.

ROM Words: 8192

Ample ROM storage capacity for program and data storage.

Maximum Seated Height: 1 mm

Low seated height for compact designs.

Width: 4 mm

Compact width for space-constrained applications.

Maximum Clock Frequency: 24 MHz

High clock frequency for fast processing speed.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand reflow soldering process for up to 30 seconds.

Peak Reflow Temperature °C: 260

Can handle high peak reflow temperatures during assembly.

Length: 4 mm

Compact length for space-saving designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliable operation in harsh conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient and optimized performance.

RAM Bytes: 1024

Sufficient RAM for data processing and temporary storage.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: NO LEAD

No-lead terminal form for RoHS compliance and environmental friendliness.

Maximum Supply Current: 4.3 mA

Low supply current for energy-efficient operation.

Nominal Supply Voltage: 3 V

Nominal supply voltage for stable and reliable performance.

PWM Channels: YES

Supports PWM channels for control of analog outputs.

ROM Programmability: FRAM

FRAM technology for fast and reliable ROM programmability.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density board layouts.

Moisture Sensitivity Level (MSL): 2

MSL 2 level for moisture resistance during storage and assembly.

Speed: 24 rpm

High speed capabilities for quick data processing.

No. of I/O Lines: 17

Sufficient number of I/O lines for versatile connectivity options.

Technical Specifications

Microcontrollers MSP430FR5734IRGET attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

17

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

8192

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

4.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Trade Compliance

MSP430FR5734IRGET Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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