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MSP430FR5734IRGER

Texas Instruments

MSP430FR5734IRGER by Texas Instruments

MSP430FR5734IRGER by Texas Instruments is a 16-bit microcontroller with 24 terminals, operating at up to 24 MHz. It features FRAM ROM programmability, 1024 bytes of RAM, and ADC/DMA channels. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,834 parts In-Stock

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Digiode

USA . 1,594 parts In-Stock

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1,594

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Distributors (Availability)

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AZTECH Wire

Italy . 313 parts In-Stock

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$7.232

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313

$7.232

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Parana Technologies

USA . 689 parts In-Stock

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$14.658

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$15.096

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689

$14.658

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$15.096

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DigiPath Technology Company

USA . 1,959 parts In-Stock

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$16.141

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$14.849

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1,959

$16.141

$14.849

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ChromeModa Solutions

Germany . 6,551 parts In-Stock

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$16.470

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$13.505

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6,551

$16.470

$13.505

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IDEA Electronic Components Group

UK . 560 parts In-Stock

1+ parts

$16.470

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$15.646

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$14.823

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560

$16.470

$15.646

$14.823

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One Stop Electronics

USA . 660 parts In-Stock

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$28.000

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660

$28.000

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Corphita

USA . 3,366 parts In-Stock

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Microchip USA

USA . 419 parts In-Stock

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Overview

Experience the innovation and reliability of Texas Instruments with the MSP430FR5734IRGER microcontroller. This versatile device offers exceptional performance for a wide range of applications, from consumer electronics to industrial automation. With its advanced features and cutting-edge technology, this microcontroller provides unmatched value and benefits to customers. Trust in Texas Instruments to deliver quality products that will exceed your expectations and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material used in the package body provides durability and protection to the microcontroller.

Surface Mount: YES

Surface mount design allows for easy and efficient integration into circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this microcontroller can handle higher power requirements for various applications.

Bit Size: 16

16-bit architecture provides improved performance and processing capabilities compared to lower bit microcontrollers.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages (2.5V and 3.3V) offers flexibility in different operating environments.

No. of Terminals: 24

Having 24 terminals allows for versatile connectivity options and expansion of I/O capabilities.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The diverse package styles offer flexibility in design and thermal management, making it suitable for various applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliability in harsh environmental conditions.

CPU Family: MSP430

MSP430 CPU family is known for its low power consumption and high performance, making this microcontroller energy-efficient.

RAM Bytes: 1024

With 1024 bytes of RAM, this microcontroller can efficiently handle data storage and processing requirements.

Technical Specifications

Microcontrollers MSP430FR5734IRGER attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

17

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

8192

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

4.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Trade Compliance

MSP430FR5734IRGER Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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