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MSP430FR5732IRGET

Texas Instruments

MSP430FR5732IRGET by Texas Instruments

MSP430FR5732IRGET by Texas Instruments is a 16-bit microcontroller with 24 terminals, operating at up to 24 MHz. It features FRAM ROM programmability, 1024 bytes of RAM, and various peripherals like CRC and DMA. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$2.562

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 46,480 parts In-Stock

1+ parts

$1.965

100+ parts

$1.602

1k+ parts

$1.068

10k+ parts

-

46,480

$1.965

$1.602

$1.068

-

DigiKey

USA . 248 parts In-Stock

1+ parts

$3.160

100+ parts

$1.955

1k+ parts

$1.851

10k+ parts

-

248

$3.160

$1.955

$1.851

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 971 parts In-Stock

1+ parts

$1.867

100+ parts

-

1k+ parts

-

10k+ parts

-

971

$1.867

-

-

-

Vyrian

USA . 7,452 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,452

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 808 parts In-Stock

1+ parts

$1.768

100+ parts

-

1k+ parts

-

10k+ parts

-

808

$1.768

-

-

-

Microchip USA

USA . 1,073 parts In-Stock

1+ parts

$12.970

100+ parts

$12.890

1k+ parts

$12.850

10k+ parts

$12.810

1,073

$12.970

$12.890

$12.850

$12.810

Parana Technologies

USA . 1,311 parts In-Stock

1+ parts

$60.710

100+ parts

-

1k+ parts

-

10k+ parts

-

1,311

$60.710

-

-

-

ChromeModa Solutions

Germany . 1,347 parts In-Stock

1+ parts

$68.214

100+ parts

$55.935

1k+ parts

-

10k+ parts

-

1,347

$68.214

$55.935

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-

IDEA Electronic Components Group

UK . 356 parts In-Stock

1+ parts

$68.214

100+ parts

$64.803

1k+ parts

$61.393

10k+ parts

-

356

$68.214

$64.803

$61.393

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DigiPath Technology Company

USA . 1,545 parts In-Stock

1+ parts

-

100+ parts

$61.502

1k+ parts

-

10k+ parts

-

1,545

-

$61.502

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-

Overview

Unlock the power of innovation with the Texas Instruments MSP430FR5732IRGET Microcontroller. Built by a trusted manufacturer, this versatile device offers unmatched performance and reliability for a wide range of applications. With features like low power mode and PWM channels, this product delivers exceptional value to customers looking to optimize their designs. Whether you're working on IoT devices or industrial automation, the MSP430FR5732IRGET is your go-to solution for seamless integration and cutting-edge technology. Experience the difference with this top-of-the-line microcontroller and elevate your projects to new heights of success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good insulation and protection for the microcontroller, ensuring durability and reliability.

Maximum Supply Voltage: 3.6 V

Allows for a higher supply voltage, increasing flexibility in power supply options for the microcontroller.

Minimum Operating Temperature: -40 °C

Capable of operating in very low temperature environments, making it suitable for a wide range of applications.

ADC Channels: YES

Includes Analog-to-Digital Converter channels, allowing the microcontroller to convert analog signals to digital data for processing.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes Reduced Instruction Set Computing (RISC) architecture, which enhances processing speed and efficiency of the microcontroller.

Connectivity: I2C, IRDA(2), SCI(3), SPI(3), UART(2)

Offers a wide range of connectivity options, enabling communication with other devices and systems.

Technical Specifications

Microcontrollers MSP430FR5732IRGET attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

17

No. of Serial I/Os:

1

No. of Terminals:

24

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

8192

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

24 rpm

Maximum Supply Current:

4.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(2), SCI(3), SPI(3), UART(2)"

Peripherals:

"COMPARATOR(16), CRC, DMA(3), RTC, TIMER(5)"

Trade Compliance

MSP430FR5732IRGET Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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