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MSP430FR5732IPW

Texas Instruments

MSP430FR5732IPW by Texas Instruments

MSP430FR5732IPW by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 8192 ROM words. It operates at a max clock frequency of 24 MHz, suitable for industrial applications requiring low power consumption. Features include 5 timers, DMA channels, and connectivity options like I2C, SPI, and UART.

Median Price

$2.801

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,878 parts In-Stock

1+ parts

$2.162

100+ parts

$1.763

1k+ parts

$1.175

10k+ parts

-

9,878

$2.162

$1.763

$1.175

-

DigiKey

USA . 69 parts In-Stock

1+ parts

$3.440

100+ parts

$2.141

1k+ parts

$1.906

10k+ parts

$1.812

69

$3.440

$2.141

$1.906

$1.812

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,360 parts In-Stock

1+ parts

$2.054

100+ parts

-

1k+ parts

-

10k+ parts

-

1,360

$2.054

-

-

-

Vyrian

USA . 7,543 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,543

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,010 parts In-Stock

1+ parts

$1.946

100+ parts

-

1k+ parts

-

10k+ parts

-

2,010

$1.946

-

-

-

Microchip USA

USA . 2,585 parts In-Stock

1+ parts

$20.410

100+ parts

$20.280

1k+ parts

$20.220

10k+ parts

$20.160

2,585

$20.410

$20.280

$20.220

$20.160

Parana Technologies

USA . 1,373 parts In-Stock

1+ parts

$74.927

100+ parts

-

1k+ parts

-

10k+ parts

-

1,373

$74.927

-

-

-

DigiPath Technology Company

USA . 709 parts In-Stock

1+ parts

$82.504

100+ parts

$75.904

1k+ parts

-

10k+ parts

-

709

$82.504

$75.904

-

-

ChromeModa Solutions

Germany . 2,594 parts In-Stock

1+ parts

$84.188

100+ parts

$69.034

1k+ parts

-

10k+ parts

-

2,594

$84.188

$69.034

-

-

IDEA Electronic Components Group

UK . 1,676 parts In-Stock

1+ parts

$84.188

100+ parts

$79.979

1k+ parts

$75.769

10k+ parts

-

1,676

$84.188

$79.979

$75.769

-

Perfect Parts

USA . 325 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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325

-

-

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Overview

Unlock the power of innovation with the Texas Instruments MSP430FR5732IPW microcontroller. Designed with precision and reliability in mind, this small but mighty device offers a wide range of applications in various industries. From industrial automation to consumer electronics, the MSP430FR5732IPW delivers unmatched performance and efficiency. Experience seamless connectivity, low power consumption, and advanced features that set this microcontroller apart from the rest. Trust in Texas Instruments for quality and innovation that exceeds expectations. Elevate your projects with the MSP430FR5732IPW and take your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability and resistance to moisture, making the product reliable in various environments.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a wide range of applications.

ADC Channels: YES

Integration of Analog-to-Digital Converters enables accurate conversion of analog signals to digital data for various sensing and measurement applications.

ROM Programmability: FRAM

Ferroelectric RAM provides fast read and write speeds, lower power consumption, and non-volatile memory storage, enhancing overall performance and reliability.

Connectivity: "I2C, IRDA(2), SCI(3), SPI(3), UART(2)

Multiple communication interfaces allow for easy integration with other devices and systems, enhancing versatility and connectivity options.

Peripheral IC Type: MICROCONTROLLER, RISC

Advanced RISC architecture allows for efficient processing of instructions and high performance in a compact design.

Technical Specifications

Microcontrollers MSP430FR5732IPW attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

21

No. of Serial I/Os:

1

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

8192

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

24 rpm

Maximum Supply Current:

4.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(2), SCI(3), SPI(3), UART(2)"

Peripherals:

"COMPARATOR(16), CRC, DMA(3), RTC, TIMER(5)"

Trade Compliance

MSP430FR5732IPW Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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