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MSP430FR5731IRHAT

Texas Instruments

MSP430FR5731IRHAT by Texas Instruments

MSP430FR5731IRHAT by Texas Instruments is a 16-bit microcontroller with 40 terminals, operating at up to 24 MHz. It features FRAM ROM programmability, 14-Ch 10-Bit ADC channels, and low power mode. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

$1.489

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 200 parts In-Stock

1+ parts

$0.675

100+ parts

$0.675

1k+ parts

-

10k+ parts

-

200

$0.675

$0.675

-

-

Rochester

USA . 1,497 parts In-Stock

1+ parts

$1.410

100+ parts

$1.380

1k+ parts

$1.350

10k+ parts

-

1,497

$1.410

$1.380

$1.350

-

Texas Instruments

USA . 13,460 parts In-Stock

1+ parts

$1.568

100+ parts

$1.278

1k+ parts

$0.852

10k+ parts

-

13,460

$1.568

$1.278

$0.852

-

DigiKey

USA . 145 parts In-Stock

1+ parts

$2.580

100+ parts

$1.572

1k+ parts

-

10k+ parts

-

145

$2.580

$1.572

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,090 parts In-Stock

1+ parts

$0.641

100+ parts

-

1k+ parts

-

10k+ parts

-

2,090

$0.641

-

-

-

Vyrian

USA . 7,590 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,590

-

-

-

-

Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 60 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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60

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,594 parts In-Stock

1+ parts

$0.608

100+ parts

-

1k+ parts

-

10k+ parts

-

4,594

$0.608

-

-

-

Component Stockers USA

USA . 241 parts In-Stock

1+ parts

$2.500

100+ parts

$1.810

1k+ parts

-

10k+ parts

-

241

$2.500

$1.810

-

-

Microchip USA

USA . 127 parts In-Stock

1+ parts

$11.660

100+ parts

$11.620

1k+ parts

$11.620

10k+ parts

$11.590

127

$11.660

$11.620

$11.620

$11.590

Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$17.272

100+ parts

$15.718

1k+ parts

$14.163

10k+ parts

-

200

$17.272

$15.718

$14.163

-

Parana Technologies

USA . 2,335 parts In-Stock

1+ parts

$70.874

100+ parts

-

1k+ parts

-

10k+ parts

-

2,335

$70.874

-

-

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ChromeModa Solutions

Germany . 2,896 parts In-Stock

1+ parts

$79.634

100+ parts

$65.300

1k+ parts

-

10k+ parts

-

2,896

$79.634

$65.300

-

-

IDEA Electronic Components Group

UK . 1,703 parts In-Stock

1+ parts

$79.634

100+ parts

$75.652

1k+ parts

$71.671

10k+ parts

-

1,703

$79.634

$75.652

$71.671

-

Perfect Parts

USA . 1,616 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,616

-

-

-

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DigiPath Technology Company

USA . 6 parts In-Stock

1+ parts

-

100+ parts

$71.798

1k+ parts

-

10k+ parts

-

6

-

$71.798

-

-

Overview

Experience unparalleled efficiency and performance with the Texas Instruments MSP430FR5731IRHAT microcontroller. Known for its reliable quality and cutting-edge technology, this versatile chip carrier offers a wide range of applications in various industries. With features like 32 I/O lines, low power mode, and peripherals including comparators, CRC, and DMA, this industrial-grade microcontroller provides unmatched value and benefits to customers looking for a powerful and efficient solution for their projects. Upgrade your designs today with the MSP430FR5731IRHAT and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and resistant to cracking, enhancing durability and ease of handling.

Surface Mount: YES

Surface mount technology allows for smaller form factor and easier automated assembly, making the product suitable for modern compact designs.

Maximum Supply Voltage: 3.6 V

Operating at a maximum supply voltage of 3.6V provides flexibility and compatibility with various power sources.

Package Shape: SQUARE

Square package shape enables efficient space utilization, especially in applications where board space is limited.

Bit Size: 16

16-bit architecture allows for more complex operations and higher precision calculations compared to lower bit microcontrollers.

No. of Terminals: 40

Having 40 terminals provides ample connectivity options for interfacing with other components and peripherals in the system.

Minimum Supply Voltage: 2 V

Operating at a minimum supply voltage of 2V allows for lower power consumption and extended battery life in portable devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this microcontroller can withstand elevated temperatures in industrial environments.

CPU Family: MSP430

Part of the MSP430 family known for its low power consumption and high performance, making it suitable for battery-operated IoT devices.

Minimum Operating Temperature: -40 °C

The microcontroller can operate effectively in extremely cold conditions down to -40°C, ensuring reliable performance in harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This high-quality terminal finish provides excellent corrosion resistance and ensures reliable electrical connections for improved overall product reliability.

ADC Channels: YES

Analog-to-Digital Converter channels allow the microcontroller to interface with analog sensors and signals, expanding its application compatibility.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and reduce CPU load, enhancing overall system performance.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller offers high performance with reduced instruction set complexity, enabling faster execution of tasks.

Speed: 24 rpm

Operating at a speed of 24MHz provides fast processing capabilities for real-time applications, making it suitable for time-critical tasks.

RAM Bytes: 1024

With 1024 bytes of RAM, the microcontroller can efficiently store and access data during program execution, enabling smooth operation of applications.

Technical Specifications

Microcontrollers MSP430FR5731IRHAT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

32

No. of Terminals:

40

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

4096

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

24 rpm

Maximum Supply Current:

4.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA(2), SPI(3), UART(2)

Peripherals:

COMPARATOR(16), CRC, DMA(3), PWM, RTC, TIMER(5)

Analog To Digital Convertors:

14-Ch 10-Bit; 10-Ch 10-Bit

Trade Compliance

MSP430FR5731IRHAT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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