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MSP430FR5730IPWR

Texas Instruments

MSP430FR5730IPWR by Texas Instruments

MSP430FR5730IPWR by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 4096 ROM words. It operates at a max clock frequency of 24 MHz, making it suitable for industrial applications requiring high-speed processing. With PWM channels, ADC and DMA support, this MCU offers versatile functionality in a compact package ideal for IoT devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,581 parts In-Stock

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Vyrian

USA . 3,939 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 422 parts In-Stock

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$9.314

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422

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Parana Technologies

USA . 1,427 parts In-Stock

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$19.093

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$19.144

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1,427

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DigiPath Technology Company

USA . 291 parts In-Stock

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$21.024

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291

$21.024

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IDEA Electronic Components Group

UK . 1,600 parts In-Stock

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$21.453

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$20.380

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$19.308

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$19.308

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ChromeModa Solutions

Germany . 70 parts In-Stock

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$21.453

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$17.591

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70

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One Stop Electronics

USA . 569 parts In-Stock

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$30.000

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569

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Microchip USA

USA . 5,118 parts In-Stock

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Corphita

USA . 3,190 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments MSP430FR5730IPWR microcontroller. Designed for industrial-grade applications, this compact and efficient device offers unmatched performance and reliability. With advanced features like ADC and DMA channels, PWM capabilities, and a 24 MHz clock frequency, this microcontroller is perfect for a wide range of projects. Trust in Texas Instruments' reputation for quality and innovation, and discover the endless possibilities with the MSP430FR5730IPWR. Elevate your designs with this versatile and powerful microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller easy to handle and robust for various applications.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving space and reducing production costs.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage provides flexibility in power supply options and compatibility with a wide range of systems.

Bit Size: 16

A 16-bit architecture allows for enhanced processing capabilities and performance compared to lower bit microcontrollers.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages enables adaptable power configurations for different applications and environments.

No. of Terminals: 28

Having a sufficient number of terminals enables connectivity with external components and peripherals, expanding the microcontroller's capabilities.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand demanding environmental conditions and extended operation.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable performance in both extreme cold and hot conditions, making it suitable for diverse applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture offers efficient instruction execution and high performance, making this microcontroller ideal for real-time applications and low-power consumption.

RAM Bytes: 1024

Ample RAM capacity allows for faster data processing and multitasking capabilities, enhancing the microcontroller's performance in complex applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and increased reliability, making this microcontroller energy-efficient and stable.

Technical Specifications

Microcontrollers MSP430FR5730IPWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

21

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

4096

ROM Programmability:

MROM

Maximum Seated Height:

1.2 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

4.3 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

MSP430FR5730IPWR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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