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MSP430FR5727IRHAR

Texas Instruments

MSP430FR5727IRHAR by Texas Instruments

MSP430FR5727IRHAR by Texas Instruments is a 16-bit microcontroller with 16384 ROM words and 1024 RAM bytes. It operates at a max clock frequency of 24 MHz, suitable for industrial applications requiring low power consumption and high-speed processing. With PWM and ADC channels, it offers versatile functionality in compact dimensions for various embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,255 parts In-Stock

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Digiode

USA . 1,509 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 876 parts In-Stock

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$16.071

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One Stop Electronics

USA . 1,264 parts In-Stock

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$23.000

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Parana Technologies

USA . 2,072 parts In-Stock

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$60.423

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DigiPath Technology Company

USA . 1,584 parts In-Stock

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$66.533

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$61.211

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IDEA Electronic Components Group

UK . 2,076 parts In-Stock

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$67.891

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$64.496

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$61.102

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2,076

$67.891

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$61.102

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ChromeModa Solutions

Germany . 1,898 parts In-Stock

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$67.891

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$55.671

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Microchip USA

USA . 429 parts In-Stock

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Corphita

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Overview

Unleash the power of innovation with the Texas Instruments MSP430FR5727IRHAR microcontroller. This cutting-edge device offers unparalleled quality and reliability, backed by Texas Instruments' reputation for excellence. Ideal for a wide range of applications, this microcontroller provides customers with unmatched value, seamless performance, and endless possibilities. Experience the advantages of the MSP430FR5727IRHAR and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and good thermal resistance, making the product reliable for long-term operation.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options while ensuring safe operation within specified voltage limits.

Bit Size: 16

16-bit architecture allows for higher precision and performance compared to lower bit sizes, making it suitable for more complex applications.

Power Supplies (V): 2.5/3.3

Supports multiple power supply options, enabling compatibility with various system configurations.

No. of Terminals: 40

Sufficient number of terminals for connecting peripheral devices and interfacing with external components.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures reliable performance even in harsh environmental conditions.

ADC Channels: YES

Integrated ADC channels enable analog signal processing and sensor interfacing, expanding the range of applications the product can be used for.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

PWM Channels: YES

PWM channels allow for precise control of output signals, suitable for applications requiring pulse-width modulation.

Technical Specifications

Microcontrollers MSP430FR5727IRHAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

16384

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

2.8 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Trade Compliance

MSP430FR5727IRHAR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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