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MSP430FR5727IDAR

Texas Instruments

MSP430FR5727IDAR by Texas Instruments

MSP430FR5727IDAR by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 16384 ROM words. It operates at a max clock frequency of 24 MHz, suitable for industrial applications requiring low power consumption and high-speed processing. With features like 14-Ch 10-Bit ADC channels, FRAM ROM programmability, and multiple connectivity options (I2C, IRDA, SCI, SPI, UART), it offers versatile solutions in compact dimensions (12.5mm x 6.1mm).

Median Price

$2.583

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 25,484 parts In-Stock

1+ parts

$2.583

100+ parts

$2.106

1k+ parts

$1.404

10k+ parts

-

25,484

$2.583

$2.106

$1.404

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,788 parts In-Stock

1+ parts

$2.454

100+ parts

-

1k+ parts

-

10k+ parts

-

2,788

$2.454

-

-

-

Vyrian

USA . 4,527 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,527

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 85 parts In-Stock

1+ parts

$2.325

100+ parts

-

1k+ parts

-

10k+ parts

-

85

$2.325

-

-

-

AZTECH Wire

Italy . 772 parts In-Stock

1+ parts

$18.610

100+ parts

-

1k+ parts

-

10k+ parts

-

772

$18.610

-

-

-

Parana Technologies

USA . 1,309 parts In-Stock

1+ parts

$22.770

100+ parts

-

1k+ parts

$23.435

10k+ parts

-

1,309

$22.770

-

$23.435

-

ChromeModa Solutions

Germany . 2,130 parts In-Stock

1+ parts

$25.584

100+ parts

$20.979

1k+ parts

-

10k+ parts

-

2,130

$25.584

$20.979

-

-

IDEA Electronic Components Group

UK . 1,046 parts In-Stock

1+ parts

$25.584

100+ parts

$24.305

1k+ parts

$23.026

10k+ parts

-

1,046

$25.584

$24.305

$23.026

-

DigiPath Technology Company

USA . 2,067 parts In-Stock

1+ parts

-

100+ parts

$23.067

1k+ parts

-

10k+ parts

-

2,067

-

$23.067

-

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Overview

Unlock the power of innovation with the Texas Instruments MSP430FR5727IDAR microcontroller. Designed for a wide range of applications, this high-quality product offers unparalleled performance and reliability. With advanced features like low power mode and FRAM programmability, customers can expect seamless operation and maximum efficiency. Trust in the expertise of Texas Instruments to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the MSP430FR5727IDAR and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy integration onto PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options while maintaining stable operation.

On Chip Data RAM Width: 8

The wide data RAM width allows for efficient data processing and storage on the chip.

Package Shape: RECTANGULAR

Rectangular shape makes it easier to design and layout the PCB for the product.

Bit Size: 16

With a 16-bit architecture, the microcontroller can handle larger data chunks and perform more complex calculations.

Power Supplies (V): 2.5/3.3

Compatibility with multiple power supply voltages allows for versatile use in different systems.

No. of Terminals: 38

Sufficient terminals for connecting various external components and peripherals to the microcontroller.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style saves space on the PCB and reduces overall footprint of the product.

Minimum Supply Voltage: 2 V

Operates efficiently even at lower voltages, helping conserve power in battery-operated devices.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for use in harsh environmental conditions.

CPU Family: MSP430

Part of the MSP430 family known for low power consumption and high performance, making it a reliable choice for energy-efficient applications.

Minimum Operating Temperature: -40 °C

Can withstand cold temperatures, making it suitable for use in freezer or outdoor applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish ensures good connectivity and reliability over time.

ADC Channels: YES

Built-in ADC channels allow for analog signal processing, making the microcontroller versatile for sensor interfacing.

DMA Channels: YES

DMA channels enable efficient data transfer between memory and peripherals, improving overall system performance.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout and connection options.

ROM Words: 16384

Ample ROM words for storing program instructions and data, allowing for complex firmware implementation.

Maximum Seated Height: 1.2 mm

Low profile design is suitable for compact electronic devices with height constraints.

Width: 6.1 mm

Narrow width saves space on the PCB, ideal for designs with limited board real estate.

Boundary Scan: YES

Boundary scan support aids in testing and debugging the product during manufacturing and maintenance.

Peripherals: COMPARATOR(16), CRC, DMA(3), RTC, TIMER(5)

Rich set of peripherals enhances the microcontroller's capabilities for various applications.

Maximum Clock Frequency: 24 MHz

High clock frequency enables fast execution of instructions, improving overall performance of the product.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during manufacturing processes without compromising functionality.

Length: 12.5 mm

Moderate length for easy integration into different product designs while maintaining a compact form factor.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in demanding industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers efficient instruction execution and low power consumption.

No. of Timers: 5

Multiple timers allow for precise timing control in diverse applications, such as motor control and industrial automation.

RAM Bytes: 1024

Sufficient RAM capacity for storing variables and temporary data during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal form ensures secure soldering and robust mechanical connections on the PCB.

Analog To Digital Convertors: 14-Ch 10-Bit

Multiple ADC channels with high resolution allow for accurate analog signal conversion in the product.

Maximum Supply Current: 2.8 mA

Low supply current consumption helps in reducing overall power consumption and enhancing battery life.

Nominal Supply Voltage: 3 V

Stable nominal supply voltage ensures consistent operation of the microcontroller in the target application.

No. of DMA Channels: 3

Multiple DMA channels support efficient data transfer between peripherals, reducing CPU overhead.

No. of Serial I/Os: 2

Serial I/O interfaces enable communication with external devices, expanding the connectivity options of the product.

PWM Channels: YES

PWM channels allow for precise control of pulse-width modulation signals for applications like motor speed control and LED brightness.

Connectivity: I2C, IRDA(2), SCI(3), SPI(3), UART(2)

Multiple interface options provide flexibility for connecting to various devices and communication protocols in the product.

ROM Programmability: FRAM

FRAM technology offers fast and non-volatile program memory, enabling quick and reliable program execution.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting on the PCB, suitable for compact designs.

Format: FIXED POINT

Fixed-point format facilitates efficient arithmetic operations and numerical calculations in the product.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates that the product can withstand moderate exposure to moisture, ensuring reliability in various operating conditions.

Speed: 24 rpm

High speed operation enables quick response time in processing data and executing commands in the product.

Low Power Mode: YES

Low power mode feature helps in minimizing power consumption during idle or standby periods, prolonging battery life.

On Chip Program ROM Width: 8

The wide on-chip program ROM width allows for storing a large number of program instructions for execution.

No. of I/O Lines: 32

Sufficient I/O lines for connecting to external peripherals and interfacing with sensors, actuators, and communication devices.

Technical Specifications

Microcontrollers MSP430FR5727IDAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

32

No. of Serial I/Os:

2

No. of Terminals:

38

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

16384

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

2.8 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(2), SCI(3), SPI(3), UART(2)"

Peripherals:

"COMPARATOR(16), CRC, DMA(3), RTC, TIMER(5)"

Analog To Digital Convertors:

14-Ch 10-Bit

Trade Compliance

MSP430FR5727IDAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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