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MSP430FR5724IPW

Texas Instruments

MSP430FR5724IPW by Texas Instruments

MSP430FR5724IPW by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 8192 ROM words. It operates at a max clock frequency of 24 MHz, suitable for industrial applications requiring low power consumption. Featuring peripherals like CRC, DMA, and timers, it offers connectivity options such as I2C, SCI, SPI, and UART for versatile usage.

Median Price

$3.873

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,650 parts In-Stock

1+ parts

$2.666

100+ parts

$2.336

1k+ parts

$1.320

10k+ parts

-

10,650

$2.666

$2.336

$1.320

-

Mouser Electronics

USA . 248 parts In-Stock

1+ parts

$5.080

100+ parts

$2.590

1k+ parts

$1.880

10k+ parts

$1.830

248

$5.080

$2.590

$1.880

$1.830

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,402 parts In-Stock

1+ parts

$2.533

100+ parts

-

1k+ parts

-

10k+ parts

-

1,402

$2.533

-

-

-

Vyrian

USA . 3,370 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,370

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,544 parts In-Stock

1+ parts

$2.399

100+ parts

-

1k+ parts

-

10k+ parts

-

4,544

$2.399

-

-

-

Parana Technologies

USA . 1,286 parts In-Stock

1+ parts

$15.547

100+ parts

-

1k+ parts

$15.921

10k+ parts

-

1,286

$15.547

-

$15.921

-

Microchip USA

USA . 2,192 parts In-Stock

1+ parts

$16.900

100+ parts

$16.790

1k+ parts

$16.740

10k+ parts

$16.690

2,192

$16.900

$16.790

$16.740

$16.690

DigiPath Technology Company

USA . 771 parts In-Stock

1+ parts

$17.120

100+ parts

$15.750

1k+ parts

-

10k+ parts

-

771

$17.120

$15.750

-

-

ChromeModa Solutions

Germany . 3,666 parts In-Stock

1+ parts

$17.469

100+ parts

$14.325

1k+ parts

-

10k+ parts

-

3,666

$17.469

$14.325

-

-

IDEA Electronic Components Group

UK . 235 parts In-Stock

1+ parts

$17.469

100+ parts

$16.596

1k+ parts

$15.722

10k+ parts

-

235

$17.469

$16.596

$15.722

-

Advanced Electronics

New Zealand . 47 parts In-Stock

1+ parts

$18.390

100+ parts

$16.735

1k+ parts

$15.080

10k+ parts

-

47

$18.390

$16.735

$15.080

-

Overview

Experience the power of innovation with the Texas Instruments MSP430FR5724IPW microcontroller. Designed with precision and excellence, this device offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, the MSP430FR5724IPW delivers cutting-edge features such as low power mode and integrated peripherals, ensuring optimal functionality and efficiency. Trust in Texas Instruments' expertise in semiconductor technology to provide you with the quality and value you deserve. Elevate your projects with the MSP430FR5724IPW and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring long-term functionality.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options, making it compatible with a wide range of other components.

CPU Family: MSP430

Being part of the MSP430 family ensures a reliable and trusted brand in microcontrollers.

ROM Words: 8192

Ample storage for program data, allowing for complex functions and operations to be executed efficiently.

Analog To Digital Convertors: 14-Ch 10-Bit

Enables precise and accurate conversion of analog signals to digital data, essential for various applications.

Connectivity: "I2C, IRDA(2), SCI(3), SPI(3), UART(2)

Multiple communication options provide versatility in connecting with other devices and systems.

Technical Specifications

Microcontrollers MSP430FR5724IPW attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

21

No. of Serial I/Os:

2

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

8192

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

2.8 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(2), SCI(3), SPI(3), UART(2)"

Peripherals:

"COMPARATOR(16), CRC, DMA(3), RTC, TIMER(5)"

Analog To Digital Convertors:

14-Ch 10-Bit

Trade Compliance

MSP430FR5724IPW Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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