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MSP430FR5722IRGER

Texas Instruments

MSP430FR5722IRGER by Texas Instruments

MSP430FR5722IRGER by Texas Instruments is a 16-bit microcontroller with 24 terminals, operating at up to 24 MHz. It features FRAM ROM programmability, 1024 bytes of RAM, and ADC/DMA channels. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,883 parts In-Stock

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Digiode

USA . 4,614 parts In-Stock

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4,614

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Distributors (Availability)

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AZTECH Wire

Italy . 742 parts In-Stock

1+ parts

$19.403

100+ parts

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742

$19.403

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One Stop Electronics

USA . 403 parts In-Stock

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$22.000

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403

$22.000

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Parana Technologies

USA . 1,714 parts In-Stock

1+ parts

$60.822

100+ parts

$5,648.218

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$54.740

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1,714

$60.822

$5,648.218

$54.740

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DigiPath Technology Company

USA . 2,324 parts In-Stock

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$66.972

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2,324

$66.972

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ChromeModa Solutions

Germany . 6,730 parts In-Stock

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$68.339

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$56.038

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6,730

$68.339

$56.038

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IDEA Electronic Components Group

UK . 1,398 parts In-Stock

1+ parts

$68.339

100+ parts

$64.922

1k+ parts

$61.505

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1,398

$68.339

$64.922

$61.505

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Corphita

USA . 922 parts In-Stock

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922

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Microchip USA

USA . 316 parts In-Stock

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Overview

Unlock the endless possibilities of innovation with the MSP430FR5722IRGER by Texas Instruments. As a trusted leader in microcontrollers, Texas Instruments delivers unparalleled quality and reliability. Perfect for a wide range of applications, this product offers customers exceptional value and benefits. Experience the seamless integration, efficiency, and performance that this microcontroller brings to your projects. Embrace the future of technology with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and lightweight, ensuring the product can withstand various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto PCBs, saving time and space in the design.

Maximum Supply Voltage: 3.6 V

Being able to handle up to 3.6V ensures compatibility with a wide range of power sources and applications.

Bit Size: 16

A 16-bit architecture provides improved processing capabilities and performance for more complex tasks.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this microcontroller can function reliably in industrial environments where temperatures can vary.

CPU Family: MSP430

The MSP430 family of CPUs is known for its low power consumption and high performance, making it an excellent choice for energy-efficient applications.

ADC Channels: YES

Having ADC channels allows the microcontroller to accurately measure analog signals, making it suitable for sensor-based applications.

DMA Channels: YES

Direct Memory Access channels enable efficient data transfer between peripherals and memory, improving overall system performance.

ROM Words: 8192

With a ROM size of 8192 words, the microcontroller can store a significant amount of program data without the need for external memory.

Maximum Clock Frequency: 24 MHz

A high maximum clock frequency of 24 MHz allows for faster program execution and higher data processing speeds.

RAM Bytes: 1024

The 1024 bytes of RAM provide sufficient memory for storing variables and runtime data, ensuring smooth operation of the system.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Technical Specifications

Microcontrollers MSP430FR5722IRGER attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

17

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

8192

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

2.8 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Trade Compliance

MSP430FR5722IRGER Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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