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MSP430FR5722IPWR

Texas Instruments

MSP430FR5722IPWR by Texas Instruments

MSP430FR5722IPWR by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 8192 ROM words. It operates at a max clock frequency of 24 MHz, suitable for industrial applications requiring low power consumption and high-speed processing. With PWM channels, ADC and DMA support, it offers versatile functionality in a compact package ideal for IoT devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,610 parts In-Stock

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6,610

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Digiode

USA . 1,609 parts In-Stock

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1,609

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 484 parts In-Stock

1+ parts

$16.967

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484

$16.967

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One Stop Electronics

USA . 1,339 parts In-Stock

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$17.000

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1,339

$17.000

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Parana Technologies

USA . 980 parts In-Stock

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$59.692

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980

$59.692

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ChromeModa Solutions

Germany . 1,535 parts In-Stock

1+ parts

$67.070

100+ parts

$54.997

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1,535

$67.070

$54.997

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IDEA Electronic Components Group

UK . 883 parts In-Stock

1+ parts

$67.070

100+ parts

$63.716

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$60.363

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883

$67.070

$63.716

$60.363

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DigiPath Technology Company

USA . 1,702 parts In-Stock

1+ parts

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100+ parts

$60.470

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1,702

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$60.470

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Microchip USA

USA . 401 parts In-Stock

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401

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Corphita

USA . 390 parts In-Stock

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390

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Overview

Unleash the power of innovation with the Texas Instruments MSP430FR5722IPWR microcontroller. Designed to exceed expectations, this device offers unmatched quality and reliability. Ideal for a wide range of applications, this microcontroller provides customers with superior performance and efficiency. Experience seamless integration and exceptional value with the MSP430FR5722IPWR, setting new standards in the industry. Elevate your projects with this cutting-edge technology from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, suitable for a wide range of applications.

Surface Mount: YES

Surface mount packaging allows for easy and efficient assembly onto circuit boards, saving space and reducing production costs.

Maximum Supply Voltage: 3.6 V

Supports a maximum supply voltage of 3.6V, providing flexibility in power supply options.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into existing circuit board layouts and designs.

Bit Size: 16

16-bit architecture provides enhanced processing capabilities for complex tasks and applications.

Power Supplies (V): 2.5/3.3

Supports a range of power supply voltages, allowing for compatibility with different systems and devices.

No. of Terminals: 28

28 terminals provide ample connectivity options for external peripherals and interfaces.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Small outline, thin profile, and shrink pitch package style saves space and allows for compact device designs.

Minimum Supply Voltage: 2 V

Supports a minimum supply voltage of 2V, enabling operation in low-power scenarios.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85°C ensures reliable performance even in demanding environments.

CPU Family: MSP430

Belonging to the MSP430 CPU family indicates a high level of efficiency and performance.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C allows for operation in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel, palladium, and gold terminal finish offers excellent conductivity and corrosion resistance for long-term reliability.

ADC Channels: YES

Analog-to-digital converter channels allow for accurate conversion of analog signals, enabling sensor integration and data acquisition.

DMA Channels: YES

Direct memory access channels improve data transfer efficiency and enable high-speed communication with peripherals.

Terminal Position: DUAL

Dual terminal position offers flexibility in mounting options and enhances signal integrity in the design.

ROM Words: 8192

8192 ROM words provide ample memory for program storage and data handling.

Maximum Seated Height: 1.2 mm

Low maximum seated height of 1.2mm allows for thin device profiles and compact design solutions.

Width: 4.4 mm

Narrow width of 4.4mm enables integration into space-constrained applications and devices.

Maximum Clock Frequency: 24 MHz

High maximum clock frequency of 24MHz supports fast processing speeds and real-time operations.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for precise control during the reflow process, ensuring optimal soldering and assembly quality.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C facilitates reliable soldering and ensures robust connections.

Length: 9.7 mm

Compact length of 9.7mm contributes to a small overall footprint and ease of integration.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates robustness and reliability in harsh operating environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers efficient processing for embedded applications and low power consumption.

RAM Bytes: 1024

1024 RAM bytes provide sufficient memory for data storage and buffer capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

Gull wing terminal form allows for easy surface mounting and reliable solder connections.

Maximum Supply Current: 2.8 mA

Low maximum supply current of 2.8mA contributes to energy efficiency and extended battery life.

Nominal Supply Voltage: 3 V

Nominal supply voltage of 3V ensures stable and consistent operation across varied conditions.

PWM Channels: YES

Pulse width modulation channels enable precise control of output signals for motor control and power management.

ROM Programmability: MROM

Mask ROM programmability ensures secure and permanent storage of critical firmware and software.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65mm allows for high-density mounting and efficient use of board space.

Speed: 24 rpm

Fast processing speed of 24rpm supports real-time operations and responsive system performance.

No. of I/O Lines: 21

21 I/O lines provide flexible connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers MSP430FR5722IPWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

21

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

1.2 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

2.8 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

MSP430FR5722IPWR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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