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MSP430FR5721IDA

Texas Instruments

MSP430FR5721IDA by Texas Instruments

MSP430FR5721IDA by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 4096 ROM words. It operates at a max clock frequency of 24 MHz, suitable for industrial applications requiring low power consumption. Featuring 14-Ch 10-Bit ADC channels and various connectivity options like I2C, SCI, SPI, this MCU is ideal for embedded systems design.

Median Price

$2.559

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 41,250 parts In-Stock

1+ parts

$2.559

100+ parts

$2.243

1k+ parts

$1.267

10k+ parts

-

41,250

$2.559

$2.243

$1.267

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 243 parts In-Stock

1+ parts

$2.431

100+ parts

-

1k+ parts

-

10k+ parts

-

243

$2.431

-

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Vyrian

USA . 4,763 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

-

4,763

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,402 parts In-Stock

1+ parts

$2.303

100+ parts

-

1k+ parts

-

10k+ parts

-

1,402

$2.303

-

-

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AZTECH Wire

Italy . 677 parts In-Stock

1+ parts

$11.980

100+ parts

-

1k+ parts

-

10k+ parts

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677

$11.980

-

-

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Parana Technologies

USA . 1,544 parts In-Stock

1+ parts

$51.357

100+ parts

-

1k+ parts

-

10k+ parts

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1,544

$51.357

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-

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DigiPath Technology Company

USA . 1,430 parts In-Stock

1+ parts

$56.551

100+ parts

$52.027

1k+ parts

-

10k+ parts

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1,430

$56.551

$52.027

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-

ChromeModa Solutions

Germany . 5,235 parts In-Stock

1+ parts

$57.705

100+ parts

$47.318

1k+ parts

-

10k+ parts

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5,235

$57.705

$47.318

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IDEA Electronic Components Group

UK . 1,213 parts In-Stock

1+ parts

$57.705

100+ parts

$54.820

1k+ parts

$51.934

10k+ parts

-

1,213

$57.705

$54.820

$51.934

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Perfect Parts

USA . 179 parts In-Stock

1+ parts

-

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179

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Overview

Experience unparalleled performance and reliability with the MSP430FR5721IDA by Texas Instruments, a leading manufacturer in the industry. This microcontroller offers exceptional value and benefits for a wide range of applications, from IoT devices to industrial automation. With its advanced technology and low power consumption, this product provides customers with a competitive edge in their projects. Trust in Texas Instrument's reputation for quality and innovation, and elevate your designs with the MSP430FR5721IDA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring longevity and reliability in various environmental conditions.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

ADC Channels: YES

Analog to digital convertors allow for easy interfacing with analog sensors or devices, increasing the versatility of the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient processing and execution of instructions, making the microcontroller suitable for tasks that require fast response times.

Connectivity: I2C, IRDA(2), SCI(3), SPI(3), UART(2)

Multiple communication interfaces enable seamless integration with other devices and systems, expanding the connectivity options for the microcontroller.

Technical Specifications

Microcontrollers MSP430FR5721IDA attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

3

No. of External Interrupts:

0

No. of I/O Lines:

32

No. of Serial I/Os:

2

No. of Terminals:

38

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

RAM Words:

1

ROM Words:

4096

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

2.8 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA(2), SCI(3), SPI(3), UART(2)"

Peripherals:

"COMPARATOR(16), CRC, DMA(3), RTC, TIMER(5)"

Analog To Digital Convertors:

14-Ch 10-Bit

Trade Compliance

MSP430FR5721IDA Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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