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MSP430FR5043IPM

Texas Instruments

MSP430FR5043IPM by Texas Instruments

MSP430FR5043IPM by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at up to 24 MHz. It features 9-Ch 12-Bit ADCs, FRAM ROM programmability, and various peripherals like BOR, RTC, and WDT. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$9.976

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 46,524 parts In-Stock

1+ parts

$7.923

100+ parts

$6.459

1k+ parts

$4.306

10k+ parts

-

46,524

$7.923

$6.459

$4.306

-

Mouser Electronics

USA . 86 parts In-Stock

1+ parts

$12.030

100+ parts

$6.350

1k+ parts

$6.340

10k+ parts

$6.100

86

$12.030

$6.350

$6.340

$6.100

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,400 parts In-Stock

1+ parts

$7.527

100+ parts

-

1k+ parts

-

10k+ parts

-

1,400

$7.527

-

-

-

Bristol Electronics

USA . 12 parts In-Stock

1+ parts

$10.500

100+ parts

-

1k+ parts

-

10k+ parts

-

12

$10.500

-

-

-

Vyrian

USA . 7,235 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,235

-

-

-

-

Microfarads

USA . 12 parts In-Stock

1+ parts

-

100+ parts

-

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-

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12

-

-

-

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Electronics Depot

USA . 7 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,352 parts In-Stock

1+ parts

$7.131

100+ parts

-

1k+ parts

-

10k+ parts

-

1,352

$7.131

-

-

-

Component Stockers USA

USA . 56,336 parts In-Stock

1+ parts

$10.150

100+ parts

$7.600

1k+ parts

$4.650

10k+ parts

$4.650

56,336

$10.150

$7.600

$4.650

$4.650

Parana Technologies

USA . 398 parts In-Stock

1+ parts

$53.179

100+ parts

-

1k+ parts

-

10k+ parts

-

398

$53.179

-

-

-

DigiPath Technology Company

USA . 1,663 parts In-Stock

1+ parts

$58.557

100+ parts

$53.872

1k+ parts

-

10k+ parts

-

1,663

$58.557

$53.872

-

-

ChromeModa Solutions

Germany . 3,680 parts In-Stock

1+ parts

$59.752

100+ parts

$48.997

1k+ parts

-

10k+ parts

-

3,680

$59.752

$48.997

-

-

IDEA Electronic Components Group

UK . 2,352 parts In-Stock

1+ parts

$59.752

100+ parts

$56.764

1k+ parts

$53.777

10k+ parts

-

2,352

$59.752

$56.764

$53.777

-

Overview

Unlocking endless possibilities, the Texas Instruments MSP430FR5043IPM microcontroller offers unparalleled quality and cutting-edge technology. With a wide range of applications in various industries, this product stands out for its reliability and efficiency. Featuring advanced peripherals like BOR, DMA, RTC, and WDT, this microcontroller provides customers with unmatched value and performance. Experience seamless connectivity with I2C, IRDA, SPI, and UART while benefiting from the innovative FRAM ROM programmability. Elevate your projects with the Texas Instruments MSP430FR5043IPM and unleash your creativity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options and can handle higher voltage inputs if required.

Minimum Supply Voltage: 1.8 V

Allows for operation at lower power supply levels, making it more energy-efficient.

ROM Words: 65536

Large ROM capacity allows for storing a significant amount of data or program code.

Maximum Clock Frequency: 24 MHz

High clock frequency enables fast processing speeds for efficient operation.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture of the microcontroller provides efficient processing capabilities.

RAM Bytes: 12288

Ample RAM capacity allows for smooth multitasking and data handling.

Analog To Digital Convertors: 9-Ch 12-Bit

Multiple ADC channels with high resolution enable accurate analog to digital conversions.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Multiple connectivity options provide versatility in data communication and interfacing with other devices.

Technical Specifications

Microcontrollers MSP430FR5043IPM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

44

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

12288

ROM Words:

65536

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(11), DMA(6), POR, RTC, TIMER(6), WDT

Analog To Digital Convertors:

9-Ch 12-Bit

Trade Compliance

MSP430FR5043IPM Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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