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MSP430FR2676TRHAT

Texas Instruments

MSP430FR2676TRHAT by Texas Instruments

MSP430FR2676TRHAT by Texas Instruments is a 16-bit microcontroller with 4096 RAM words and 66048 ROM words. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring low power consumption and high-speed processing. The chip features 10-Ch 12-Bit ADC channels, BOR, POR, RTC, and UART connectivity.

Median Price

$5.030

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 12,250 parts In-Stock

1+ parts

$4.018

100+ parts

$3.521

1k+ parts

$1.989

10k+ parts

-

12,250

$4.018

$3.521

$1.989

-

Mouser Electronics

USA . 467 parts In-Stock

1+ parts

$5.030

100+ parts

$3.050

1k+ parts

$3.010

10k+ parts

$2.950

467

$5.030

$3.050

$3.010

$2.950

DigiKey

USA . 240 parts In-Stock

1+ parts

$5.030

100+ parts

$3.202

1k+ parts

$3.045

10k+ parts

-

240

$5.030

$3.202

$3.045

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,822 parts In-Stock

1+ parts

$3.817

100+ parts

-

1k+ parts

-

10k+ parts

-

3,822

$3.817

-

-

-

Vyrian

USA . 6,102 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,102

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,735 parts In-Stock

1+ parts

$3.616

100+ parts

-

1k+ parts

-

10k+ parts

-

1,735

$3.616

-

-

-

Parana Technologies

USA . 31 parts In-Stock

1+ parts

$13.249

100+ parts

-

1k+ parts

$13.755

10k+ parts

-

31

$13.249

-

$13.755

-

DigiPath Technology Company

USA . 1,888 parts In-Stock

1+ parts

$14.589

100+ parts

-

1k+ parts

-

10k+ parts

-

1,888

$14.589

-

-

-

IDEA Electronic Components Group

UK . 2,166 parts In-Stock

1+ parts

$14.887

100+ parts

$14.143

1k+ parts

$13.398

10k+ parts

-

2,166

$14.887

$14.143

$13.398

-

ChromeModa Solutions

Germany . 1,525 parts In-Stock

1+ parts

$14.887

100+ parts

$12.207

1k+ parts

-

10k+ parts

-

1,525

$14.887

$12.207

-

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$56.295

100+ parts

$51.228

1k+ parts

$46.162

10k+ parts

-

500

$56.295

$51.228

$46.162

-

Overview

Experience the next level of performance with the MSP430FR2676TRHAT by Texas Instruments. This top-of-the-line microcontroller offers unparalleled quality and reliability, making it the perfect choice for a wide range of applications. From industrial automation to consumer electronics, this versatile chip delivers exceptional value and benefits to customers looking for cutting-edge technology. Trust in Texas Instruments' expertise and innovation to take your projects to new heights with the MSP430FR2676TRHAT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Helps reduce the overall weight of the product and provides good protection to the internal components.

Surface Mount: YES

Makes it easy to mount the microcontroller on a printed circuit board, saving space and allowing for automated assembly.

Maximum Supply Voltage: 3.6 V

Operating at a higher voltage allows for better performance and compatibility with a wider range of external components.

On Chip Data RAM Width: 16

Having a wider data RAM width allows for faster data processing and storage capabilities.

Package Shape: SQUARE

Square shape packages are easier to handle and mount on the PCB, ensuring better alignment and space efficiency.

Bit Size: 16

16-bit processing capabilities provide higher precision and computational power compared to lower bit sizes.

No. of Terminals: 40

Having a higher number of terminals allows for more connections to external devices and peripherals, increasing versatility.

Minimum Supply Voltage: 1.8 V

Ability to operate at a lower voltage helps in power saving and efficiency, especially in battery-powered applications.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to interface with analog sensors and devices, expanding its usability.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides faster and more efficient data processing, making the microcontroller suitable for high-performance applications.

Technical Specifications

Microcontrollers MSP430FR2676TRHAT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

35

No. of Serial I/Os:

2

No. of Terminals:

40

No. of Timers:

5

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

RAM Words:

4096

ROM Words:

66048

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

16 rpm

Maximum Supply Current:

3.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), SPI(4), UART(2)

Peripherals:

BOR, COMPARATOR, POR, RTC, TIMER(6), WDT

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

MSP430FR2676TRHAT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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