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MSP430FR2475TPTR

Texas Instruments

MSP430FR2475TPTR by Texas Instruments

MSP430FR2475TPTR by Texas Instruments is a 16-bit microcontroller with 48 terminals and a max supply voltage of 3.6V. It features FRAM ROM programmability and is suitable for industrial applications requiring connectivity through I2C, IRDA, SPI, and UART interfaces.

Median Price

$2.574

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 61,562 parts In-Stock

1+ parts

$1.667

100+ parts

$1.376

1k+ parts

$0.744

10k+ parts

-

61,562

$1.667

$1.376

$0.744

-

Mouser Electronics

USA . 626 parts In-Stock

1+ parts

$3.480

100+ parts

$1.840

1k+ parts

$1.170

10k+ parts

$1.140

626

$3.480

$1.840

$1.170

$1.140

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$1.430

100+ parts

-

1k+ parts

-

10k+ parts

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10

$1.430

-

-

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Digiode

USA . 60 parts In-Stock

1+ parts

$1.584

100+ parts

-

1k+ parts

-

10k+ parts

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60

$1.584

-

-

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Vyrian

USA . 8,358 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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8,358

-

-

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Semicontronic

India . 31,003 parts In-Stock

1+ parts

$1.420

100+ parts

$1.384

1k+ parts

$1.377

10k+ parts

-

31,003

$1.420

$1.384

$1.377

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Ampacity Inc.

Singapore . 30,628 parts In-Stock

1+ parts

$1.420

100+ parts

-

1k+ parts

-

10k+ parts

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30,628

$1.420

-

-

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Continental Prestige Electronics

USA . 5,915 parts In-Stock

1+ parts

$1.430

100+ parts

-

1k+ parts

-

10k+ parts

$1.401

5,915

$1.430

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-

$1.401

Argo Parts USA

USA . 2,800 parts In-Stock

1+ parts

$1.430

100+ parts

-

1k+ parts

-

10k+ parts

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2,800

$1.430

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-

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Netroflash

USA . 100 parts In-Stock

1+ parts

$1.430

100+ parts

-

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100

$1.430

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Corphita

USA . 3,103 parts In-Stock

1+ parts

$1.500

100+ parts

-

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3,103

$1.500

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Microchip USA

USA . 3,140 parts In-Stock

1+ parts

$8.184

100+ parts

-

1k+ parts

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10k+ parts

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3,140

$8.184

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Corohmni

South Africa . 1,099 parts In-Stock

1+ parts

$25.861

100+ parts

-

1k+ parts

-

10k+ parts

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1,099

$25.861

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Parana Technologies

USA . 1,546 parts In-Stock

1+ parts

$37.040

100+ parts

-

1k+ parts

-

10k+ parts

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1,546

$37.040

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ChromeModa Solutions

Germany . 2,741 parts In-Stock

1+ parts

$41.618

100+ parts

$34.127

1k+ parts

-

10k+ parts

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2,741

$41.618

$34.127

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IDEA Electronic Components Group

UK . 2,203 parts In-Stock

1+ parts

$41.618

100+ parts

$39.537

1k+ parts

$37.456

10k+ parts

-

2,203

$41.618

$39.537

$37.456

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DigiPath Technology Company

USA . 1,794 parts In-Stock

1+ parts

-

100+ parts

$37.523

1k+ parts

-

10k+ parts

-

1,794

-

$37.523

-

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Overview

Discover the Texas Instruments MSP430FR2475TPTR, a high-quality microcontroller that offers exceptional value and benefits to customers. Built by an industry-leading manufacturer, this microcontroller is perfect for a wide range of applications. With its advanced technology and robust features, it provides reliable performance and precise control. Whether you're working on industrial automation, consumer electronics, or IoT devices, the MSP430FR2475TPTR is the perfect choice. Experience the advantages of its low power consumption, versatile connectivity options, and extensive peripheral support. Trust Texas Instruments to deliver top-notch quality and innovation with every product.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY. This material ensures durability and reliability for the microcontroller, making it a good choice for long-lasting products.

Surface Mount:

YES. The surface mount feature allows for easy integration and space-saving on circuit boards, making it a convenient choice for compact designs.

Maximum Supply Voltage:

3.6 V. The high maximum supply voltage capability provides flexibility for applications that require higher power, making it suitable for a wide range of projects.

Package Shape:

SQUARE. The square package shape facilitates easy mounting and alignment, making it convenient for manufacturing and assembly processes.

Bit Size:

16. The 16-bit architecture enables higher processing capabilities and improved performance, making it suitable for more demanding applications.

No. of Terminals:

48. The high number of terminals allows for increased connectivity options and expands the microcontroller's capability to interface with other devices, making it versatile for various applications.

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH. This package style provides a compact and low-profile design, allowing for space-saving and efficient use of board real estate.

Minimum Supply Voltage:

1.8 V. The low minimum supply voltage requirement enables energy-efficient operation and battery-powered applications, making it ideal for portable devices.

Maximum Operating Temperature:

105°C. The high maximum operating temperature tolerance ensures reliable performance even in demanding environmental conditions, making it suitable for industrial applications.

CPU Family:

MSP430. The MSP430 CPU family is known for its low power consumption, making it an excellent choice for energy-efficient and battery-powered applications.

Minimum Operating Temperature:

40°C. The low minimum operating temperature capability ensures reliable operation in extreme cold environments, making it suitable for a wide range of applications.

Terminal Finish:

NICKEL PALLADIUM GOLD. This terminal finish provides excellent conductivity, corrosion resistance, and solderability, ensuring reliable connections and long-term performance.

ADC Channels:

YES. The presence of analog-to-digital converter (ADC) channels allows for accurate conversion of analog signals, making it suitable for applications that require precise measurement and control.

Terminal Position:

QUAD. The quad terminal position enables easy soldering and enhances the stability of the microcontroller during assembly, making it reliable for manufacturing processes.

ROM Words:

33280. The large ROM word capacity allows for extensive program storage, enabling complex applications and firmware upgrades, making it versatile for a wide range of projects.

Maximum Seated Height:

1.6 mm. The low maximum seated height provides a compact profile, making it suitable for applications with space constraints.

Width:

7 mm. The narrow width allows for efficient use of board space, making it convenient for compact designs and densely populated circuits.

Peripherals:

BOR, COMPARATOR, POR, RTC, TIMER(5), WDT. The abundance of peripherals offers added functionality and flexibility for various applications, providing enhanced capabilities and customization options.

Maximum Time At Peak Reflow Temperature (s):

30. The maximum time at peak reflow temperature ensures optimal soldering and assembly processes within acceptable time limits, ensuring reliable production.

Peak Reflow Temperature °C:

260°C. The high peak reflow temperature capability ensures proper solder melting and reliable connections during manufacturing, ensuring robust operation.

Length:

7 mm. The compact length allows for efficient use of board space, making it desirable for designs with size constraints or limited available area.

Temperature Grade:

INDUSTRIAL. The industrial temperature grade ensures reliable performance and operation in harsh environments with extreme temperature variations, making it suitable for rugged applications.

Peripheral IC Type:

MICROCONTROLLER, RISC. The microcontroller's RISC architecture offers efficient instruction execution and power consumption, making it an optimal choice for resource-constrained applications.

RAM Bytes:

4096. The generous RAM capacity allows for data storage and manipulation during program execution, accommodating more complex algorithms and applications.

Technology:

CMOS. The CMOS technology provides low power consumption and enhanced noise immunity, making it ideal for energy-efficient and noise-sensitive applications.

Terminal Form:

GULL WING. The gull wing terminal form enables easy soldering and secure connections, ensuring reliable contact and ease of assembly during production processes.

Analog To Digital Convertors:

12-Ch 12-Bit. The presence of 12-channel 12-bit analog-to-digital converters enables precise measurement and accurate conversion of analog signals, making it suitable for applications that require high-resolution data acquisition.

Nominal Supply Voltage:

2 V. The low nominal supply voltage requirement enables energy-efficient operation and compatibility with various power sources, making it suitable for a wide range of applications.

PWM Channels:

YES. The presence of pulse-width modulation (PWM) channels allows for precise control of signals and efficient utilization of power, making it useful for applications that require accurate signal modulation.

Connectivity:

I2C(2), IRDA(2), SPI(4), UART(2). The variety of connectivity options, including I2C, IRDA, SPI, and UART, enables easy interfacing with other devices and communication protocols, enhancing versatility and integration capabilities.

ROM Programmability:

FRAM. The use of FRAM (ferroelectric random-access memory) for ROM programmability offers faster write speeds, non-volatility, and endurance, making it advantageous for frequent program updates and data storage.

Terminal Pitch:

0.5 mm. The small terminal pitch allows for high-density and precise connections, making it suitable for applications that require a large number of connections within limited space.

Moisture Sensitivity Level (MSL):

3. The MSL 3 rating indicates that the microcontroller can withstand moderate moisture exposure during storage and assembly, ensuring reliability and longevity.

Speed:

16 rpm. The speed of 16 revolutions per minute ensures efficient execution of instructions and data processing, making it suitable for applications that require fast operation.

On Chip Program ROM Width:

8. The 8-bit width of the on-chip program ROM allows for efficient address space utilization and enhanced program storage, making it suitable for small to medium-scale applications.

No. of I/O Lines:

43. The high number of input/output (I/O) lines provides extensive connectivity options, enabling versatile interfaces with various external devices and expansion capabilities.

Technical Specifications

Microcontrollers MSP430FR2475TPTR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

43

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

ROM Words:

33280

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), SPI(4), UART(2)

Peripherals:

BOR, COMPARATOR, POR, RTC, TIMER(5), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

MSP430FR2475TPTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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