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MSP430FR2353TRSMT

Texas Instruments

MSP430FR2353TRSMT by Texas Instruments

MSP430FR2353TRSMT by Texas Instruments is a 16-bit microcontroller with 32 terminals, operating at up to 24 MHz. It features 8-Ch 12-Bit ADC channels and FRAM ROM programmability. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$4.170

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,740 parts In-Stock

1+ parts

$2.937

100+ parts

$2.574

1k+ parts

$1.454

10k+ parts

-

5,740

$2.937

$2.574

$1.454

-

DigiKey

USA . 496 parts In-Stock

1+ parts

$4.170

100+ parts

$2.626

1k+ parts

$2.493

10k+ parts

-

496

$4.170

$2.626

$2.493

-

Mouser Electronics

USA . 119 parts In-Stock

1+ parts

$4.170

100+ parts

$2.630

1k+ parts

$2.390

10k+ parts

-

119

$4.170

$2.630

$2.390

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,572 parts In-Stock

1+ parts

$2.790

100+ parts

-

1k+ parts

-

10k+ parts

-

1,572

$2.790

-

-

-

Vyrian

USA . 5,734 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,734

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,293 parts In-Stock

1+ parts

$2.643

100+ parts

-

1k+ parts

-

10k+ parts

-

4,293

$2.643

-

-

-

Ampacity Inc.

Singapore . 1,623 parts In-Stock

1+ parts

$5.430

100+ parts

-

1k+ parts

-

10k+ parts

-

1,623

$5.430

-

-

-

Microchip USA

USA . 1,836 parts In-Stock

1+ parts

$17.660

100+ parts

$17.550

1k+ parts

$17.500

10k+ parts

$17.440

1,836

$17.660

$17.550

$17.500

$17.440

Parana Technologies

USA . 130 parts In-Stock

1+ parts

$30.649

100+ parts

$2,846.218

1k+ parts

$27.584

10k+ parts

-

130

$30.649

$2,846.218

$27.584

-

DigiPath Technology Company

USA . 1,495 parts In-Stock

1+ parts

$33.748

100+ parts

-

1k+ parts

-

10k+ parts

-

1,495

$33.748

-

-

-

ChromeModa Solutions

Germany . 4,065 parts In-Stock

1+ parts

$34.437

100+ parts

$28.238

1k+ parts

-

10k+ parts

-

4,065

$34.437

$28.238

-

-

IDEA Electronic Components Group

UK . 1,874 parts In-Stock

1+ parts

$34.437

100+ parts

$32.715

1k+ parts

$30.993

10k+ parts

-

1,874

$34.437

$32.715

$30.993

-

QUARKTWIN TECHNOLOGY LTD

USA . 27,882 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

27,882

-

-

-

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,000

-

-

-

-

Overview

Enhance your electronic projects with the MSP430FR2353TRSMT from Texas Instruments. With its high-quality manufacturing and innovative technology, this microcontroller offers a wide range of applications in various industries. Experience the value of seamless connectivity, reliable performance, and energy efficiency that this product provides. Whether you're a hobbyist or a professional, this versatile device delivers the benefits and advantages you need for your projects. Upgrade to the MSP430FR2353TRSMT and take your creations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microcontroller packages due to its durability and cost-effectiveness.

Surface Mount: YES

Surface mount technology allows for easy installation onto circuit boards, saving time and space.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of power sources, increasing flexibility in design.

Minimum Supply Voltage: 1.8 V

Allows for operation in low power environments, making it suitable for battery-powered applications.

ADC Channels: YES

Analog to digital converters allow for the microcontroller to interface with analog sensors and signals.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enables efficient execution of instructions, leading to high performance and low power consumption.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for battery-operated devices.

Speed: 24 rpm

The high clock frequency of 24 MHz enables fast processing of data and instructions.

Connectivity: I2C(2), IRADA(2), SPI(2), UART(2)

Multiple connectivity options allow for easy integration with other devices and systems.

RAM Bytes: 2048

Sufficient memory for storing variables and data during operation.

Technical Specifications

Microcontrollers MSP430FR2353TRSMT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

44

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

16896

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

24 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRADA(2), SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(2), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR2353TRSMT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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