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MSP430FR2353TPT

Texas Instruments

MSP430FR2353TPT by Texas Instruments

MSP430FR2353TPT by Texas Instruments is a 16-bit microcontroller with 16896 ROM words, 2048 RAM bytes, and 12-Ch 12-Bit ADC channels. Ideal for industrial applications, it offers peripherals like BOR, RTC, and WDT along with connectivity options such as I2C, SPI, and UART. Operating temperature ranges from -40 to 105 °C.

Median Price

$2.721

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,708 parts In-Stock

1+ parts

$2.721

100+ parts

$2.219

1k+ parts

$1.479

10k+ parts

-

4,708

$2.721

$2.219

$1.479

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$2.476

100+ parts

-

1k+ parts

-

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550

$2.476

-

-

-

Digiode

USA . 3,153 parts In-Stock

1+ parts

$2.585

100+ parts

-

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-

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3,153

$2.585

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Vyrian

USA . 4,815 parts In-Stock

1+ parts

-

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-

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4,815

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4,503 parts In-Stock

1+ parts

$2.310

100+ parts

-

1k+ parts

-

10k+ parts

-

4,503

$2.310

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-

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$2.426

100+ parts

-

1k+ parts

$2.329

10k+ parts

-

100

$2.426

-

$2.329

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Corphita

USA . 1,365 parts In-Stock

1+ parts

$2.449

100+ parts

-

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1,365

$2.449

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-

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Argo Parts USA

USA . 5,273 parts In-Stock

1+ parts

$2.476

100+ parts

-

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5,273

$2.476

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Continental Prestige Electronics

USA . 2,201 parts In-Stock

1+ parts

$2.476

100+ parts

-

1k+ parts

-

10k+ parts

$2.426

2,201

$2.476

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-

$2.426

AZTECH Wire

Italy . 452 parts In-Stock

1+ parts

$8.540

100+ parts

-

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452

$8.540

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Microchip USA

USA . 2,074 parts In-Stock

1+ parts

$17.960

100+ parts

$17.850

1k+ parts

$17.800

10k+ parts

$17.740

2,074

$17.960

$17.850

$17.800

$17.740

Parana Technologies

USA . 1,406 parts In-Stock

1+ parts

$20.188

100+ parts

-

1k+ parts

$20.149

10k+ parts

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1,406

$20.188

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$20.149

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DigiPath Technology Company

USA . 1,358 parts In-Stock

1+ parts

$22.229

100+ parts

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1,358

$22.229

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ChromeModa Solutions

Germany . 4,255 parts In-Stock

1+ parts

$22.683

100+ parts

$18.600

1k+ parts

-

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4,255

$22.683

$18.600

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IDEA Electronic Components Group

UK . 298 parts In-Stock

1+ parts

$22.683

100+ parts

$21.549

1k+ parts

$20.415

10k+ parts

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298

$22.683

$21.549

$20.415

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Corohmni

South Africa . 260 parts In-Stock

1+ parts

$34.185

100+ parts

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260

$34.185

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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10,000

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Overview

Discover the innovative MSP430FR2353TPT by Texas Instruments, a top-quality microcontroller perfect for a wide range of applications. With a reputation for excellence in the industry, Texas Instruments delivers cutting-edge technology that ensures reliability and performance. This versatile microcontroller offers customers unmatched value with its advanced features, including multiple ADC channels, PWM capabilities, and various connectivity options. Experience the benefits of this product's high-speed operation, low power consumption, and industrial-grade temperature range. Choose the MSP430FR2353TPT for your next project and unlock endless possibilities for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the microcontroller suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a variety of systems.

Bit Size: 16

Provides a good balance between computational power and energy efficiency for embedded applications.

ADC Channels: YES

Enables the microcontroller to interface with analog sensors and signals, expanding its range of possible uses.

ROM Words: 16896

Ample memory capacity for storing program instructions and data, enabling complex application development.

PWM Channels: YES

Allows for precise control of analog devices such as motors or LEDs, enhancing the microcontroller's versatility.

Connectivity: I2C(2), IRADA(2), SPI(4), UART(2)

Supports various communication protocols, facilitating integration with other devices and systems.

Peripherals: BOR, COMPARATOR(2), POR, RTC, TIMER(4), WDT

A wide range of built-in peripherals enhances the functionality and performance of the microcontroller.

Technical Specifications

Microcontrollers MSP430FR2353TPT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

44

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

16896

ROM Programmability:

FRAM

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRADA(2), SPI(4), UART(2)

Peripherals:

BOR, COMPARATOR(2), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

MSP430FR2353TPT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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