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MSP430FR2311IPW20

Texas Instruments

MSP430FR2311IPW20 by Texas Instruments

MSP430FR2311IPW20 by Texas Instruments is a 16-bit microcontroller with 3840 ROM words, 1024 RAM bytes, and 8-Ch 10-Bit ADC channels. It operates at a max clock frequency of 16 MHz and offers peripherals like PWM, RTC, and TIMER(2). Ideal for industrial applications requiring low power consumption and high-speed processing.

Median Price

$2.000

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 35,720 parts In-Stock

1+ parts

$1.434

100+ parts

$1.184

1k+ parts

$0.640

10k+ parts

-

35,720

$1.434

$1.184

$0.640

-

DigiKey

USA . 1,071 parts In-Stock

1+ parts

$2.000

100+ parts

$1.232

1k+ parts

$1.084

10k+ parts

$0.997

1,071

$2.000

$1.232

$1.084

$0.997

Mouser Electronics

USA . 987 parts In-Stock

1+ parts

$2.000

100+ parts

$1.170

1k+ parts

$1.080

10k+ parts

$0.997

987

$2.000

$1.170

$1.080

$0.997

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,907 parts In-Stock

1+ parts

$1.362

100+ parts

-

1k+ parts

-

10k+ parts

-

2,907

$1.362

-

-

-

Chip Stock

USA . 63,712 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

63,712

-

-

-

-

Vyrian

USA . 8,326 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,326

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 11,677 parts In-Stock

1+ parts

$1.220

100+ parts

-

1k+ parts

-

10k+ parts

-

11,677

$1.220

-

-

-

Corphita

USA . 1,369 parts In-Stock

1+ parts

$1.291

100+ parts

-

1k+ parts

-

10k+ parts

-

1,369

$1.291

-

-

-

Parana Technologies

USA . 2,225 parts In-Stock

1+ parts

$15.183

100+ parts

-

1k+ parts

$15.580

10k+ parts

-

2,225

$15.183

-

$15.580

-

DigiPath Technology Company

USA . 325 parts In-Stock

1+ parts

$16.719

100+ parts

$15.381

1k+ parts

-

10k+ parts

-

325

$16.719

$15.381

-

-

ChromeModa Solutions

Germany . 5,900 parts In-Stock

1+ parts

$17.060

100+ parts

$13.989

1k+ parts

-

10k+ parts

-

5,900

$17.060

$13.989

-

-

IDEA Electronic Components Group

UK . 2,014 parts In-Stock

1+ parts

$17.060

100+ parts

$16.207

1k+ parts

$15.354

10k+ parts

-

2,014

$17.060

$16.207

$15.354

-

Lixinc

USA . 4,940 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,940

-

-

-

-

Overview

Unlock the power of innovation with the MSP430FR2311IPW20 by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers cutting-edge solutions for a wide range of applications. This versatile microcontroller offers unmatched performance and efficiency, making it ideal for projects that require precision and reliability. With advanced features like FRAM ROM programmability and a wide range of peripherals, the MSP430FR2311IPW20 provides exceptional value and flexibility to customers. Whether you're designing IoT devices, industrial automation systems, or consumer electronics, this microcontroller is the perfect choice for your next project. Experience the quality and excellence of Texas Instruments with the MSP430FR2311IPW20.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost.

Maximum Supply Voltage: 3.6 V

Support for a higher supply voltage allows for flexibility in power source options.

Package Shape: RECTANGULAR

Rectangular shape saves space on the PCB and allows for efficient component layout.

Bit Size: 16

16-bit architecture provides improved performance and processing capabilities.

No. of Terminals: 20

Sufficient number of terminals for multiple I/O connections and interfacing with other components.

ADC Channels: YES

Built-in ADC channels enable analog input signal processing, enhancing the product's versatility.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient processing and execution speed, suitable for embedded applications.

RAM Bytes: 1024

Ample RAM capacity for data storage and processing, supporting complex algorithms and applications.

Connectivity: I2C, IRDA, SPI, UART

Multiple connectivity options make it easy to interface with various devices and systems, enhancing versatility.

Technical Specifications

Microcontrollers MSP430FR2311IPW20 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

16

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

1024

ROM Words:

3840

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, SPI, UART

Peripherals:

PWM, RTC, TIMER(2)

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430FR2311IPW20 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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