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MSP430FR2310IPW20

Texas Instruments

MSP430FR2310IPW20 by Texas Instruments

MSP430FR2310IPW20 by Texas Instruments is a 16-bit microcontroller with 2048 ROM words, 1024 RAM bytes, and 8-Ch 10-Bit ADC channels. It operates at a max clock frequency of 16 MHz and offers peripherals like PWM, RTC, and TIMER(2). Ideal for industrial applications requiring low power consumption and high performance.

Median Price

$1.910

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 17,600 parts In-Stock

1+ parts

$1.355

100+ parts

$1.119

1k+ parts

$0.605

10k+ parts

-

17,600

$1.355

$1.119

$0.605

-

DigiKey

USA . 739 parts In-Stock

1+ parts

$1.910

100+ parts

$1.170

1k+ parts

$1.028

10k+ parts

-

739

$1.910

$1.170

$1.028

-

Mouser Electronics

USA . 81 parts In-Stock

1+ parts

$1.910

100+ parts

$1.110

1k+ parts

$1.020

10k+ parts

$0.978

81

$1.910

$1.110

$1.020

$0.978

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,807 parts In-Stock

1+ parts

$1.287

100+ parts

-

1k+ parts

-

10k+ parts

-

3,807

$1.287

-

-

-

Vyrian

USA . 3,409 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,409

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,848 parts In-Stock

1+ parts

$1.220

100+ parts

-

1k+ parts

-

10k+ parts

-

2,848

$1.220

-

-

-

Microchip USA

USA . 2,558 parts In-Stock

1+ parts

$11.700

100+ parts

$11.630

1k+ parts

$11.590

10k+ parts

$11.560

2,558

$11.700

$11.630

$11.590

$11.560

Parana Technologies

USA . 1,506 parts In-Stock

1+ parts

$43.904

100+ parts

-

1k+ parts

-

10k+ parts

-

1,506

$43.904

-

-

-

DigiPath Technology Company

USA . 721 parts In-Stock

1+ parts

$48.343

100+ parts

$44.476

1k+ parts

-

10k+ parts

-

721

$48.343

$44.476

-

-

IDEA Electronic Components Group

UK . 1,948 parts In-Stock

1+ parts

$49.330

100+ parts

$46.864

1k+ parts

$44.397

10k+ parts

-

1,948

$49.330

$46.864

$44.397

-

ChromeModa Solutions

Germany . 1,735 parts In-Stock

1+ parts

$49.330

100+ parts

$40.451

1k+ parts

-

10k+ parts

-

1,735

$49.330

$40.451

-

-

Overview

Unleash the power of innovation with the Texas Instruments MSP430FR2310IPW20 microcontroller. As a leader in the industry, Texas Instruments brings you a top-of-the-line product that offers unparalleled quality and reliability. Ideal for a wide range of applications, this microcontroller provides exceptional value and benefits to customers looking for cutting-edge technology. Experience seamless connectivity and superior performance with the MSP430FR2310IPW20, delivering advanced features and capabilities to meet your needs. Trust Texas Instruments to take your projects to the next level with this innovative microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and lightweight, suitable for various applications.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for more flexibility in power supply options.

Bit Size: 16

16-bit architecture provides a good balance between performance and power efficiency.

Minimum Operating Temperature: -40 °C

Wide operating temperature range makes the product suitable for use in extreme environments.

ADC Channels: YES

Integrated ADC channels allow for analog to digital conversion, enabling the microcontroller to interface with various sensors and other analog devices.

Maximum Clock Frequency: 16 MHz

High clock frequency provides fast processing speed for demanding applications.

RAM Bytes: 1024

Ample amount of RAM allows for efficient data handling and multitasking.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Analog To Digital Convertors: 8-Ch 10-Bit

Multiple ADC channels and high resolution (10-bit) allow for precise and accurate analog signal processing.

Connectivity: I2C, IRDA, SPI, UART

Support for various communication protocols enables seamless integration with other devices and systems.

Technical Specifications

Microcontrollers MSP430FR2310IPW20 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

16

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

1024

ROM Words:

2048

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, SPI, UART

Peripherals:

PWM, RTC, TIMER(2)

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430FR2310IPW20 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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