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MSP430FR2310IPW16

Texas Instruments

MSP430FR2310IPW16 by Texas Instruments

MSP430FR2310IPW16 by Texas Instruments is a 16-bit microcontroller with 2048 ROM words, 1024 RAM bytes, and 8-Ch 10-Bit ADC channels. It operates at a max clock frequency of 16 MHz and features peripherals like PWM, RTC, and TIMER(2). Ideal for industrial applications requiring low power consumption and high-speed processing.

Median Price

$1.676

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 16,089 parts In-Stock

1+ parts

$1.322

100+ parts

$1.092

1k+ parts

$0.590

10k+ parts

-

16,089

$1.322

$1.092

$0.590

-

DigiKey

USA . 712 parts In-Stock

1+ parts

$2.030

100+ parts

$1.229

1k+ parts

$1.104

10k+ parts

-

712

$2.030

$1.229

$1.104

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,642 parts In-Stock

1+ parts

$1.256

100+ parts

-

1k+ parts

-

10k+ parts

-

4,642

$1.256

-

-

-

Vyrian

USA . 5,334 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,334

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,914 parts In-Stock

1+ parts

$1.190

100+ parts

-

1k+ parts

-

10k+ parts

-

3,914

$1.190

-

-

-

Component Stockers USA

USA . 16,484 parts In-Stock

1+ parts

$1.740

100+ parts

$1.260

1k+ parts

$0.640

10k+ parts

$0.640

16,484

$1.740

$1.260

$0.640

$0.640

Microchip USA

USA . 2,907 parts In-Stock

1+ parts

$11.440

100+ parts

$11.370

1k+ parts

$11.330

10k+ parts

$11.300

2,907

$11.440

$11.370

$11.330

$11.300

Advanced Electronics

New Zealand . 650 parts In-Stock

1+ parts

$23.462

100+ parts

$21.350

1k+ parts

$19.239

10k+ parts

-

650

$23.462

$21.350

$19.239

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Parana Technologies

USA . 1,158 parts In-Stock

1+ parts

$25.938

100+ parts

-

1k+ parts

$26.533

10k+ parts

-

1,158

$25.938

-

$26.533

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ChromeModa Solutions

Germany . 1,210 parts In-Stock

1+ parts

$29.144

100+ parts

$23.898

1k+ parts

-

10k+ parts

-

1,210

$29.144

$23.898

-

-

IDEA Electronic Components Group

UK . 1,192 parts In-Stock

1+ parts

$29.144

100+ parts

$27.687

1k+ parts

$26.230

10k+ parts

-

1,192

$29.144

$27.687

$26.230

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DigiPath Technology Company

USA . 2,316 parts In-Stock

1+ parts

-

100+ parts

$26.276

1k+ parts

-

10k+ parts

-

2,316

-

$26.276

-

-

Overview

Unlock the power of innovation with the Texas Instruments MSP430FR2310IPW16 microcontroller. Designed for a wide range of applications, this versatile device boasts high-quality manufacturing and cutting-edge technology from a trusted industry leader. With its small size, low power consumption, and robust features such as PWM, RTC, and UART connectivity, the MSP430FR2310IPW16 offers unmatched value and performance for your next project. Whether you're working on IoT devices, consumer electronics, or industrial automation, this microcontroller delivers the reliability and efficiency you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, suitable for various environments.

Surface Mount: YES

Surface mount technology allows for easier assembly and miniaturization of devices.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power supply options.

Bit Size: 16

16-bit architecture allows for more complex processing and calculations.

ADC Channels: YES

Analog to digital converters enable the microcontroller to interface with analog sensors or devices.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enables high performance and efficiency in processing instructions.

ROM Words: 2048

Large ROM capacity allows for storing program instructions and data.

RAM Bytes: 1024

Sufficient RAM capacity for data storage and manipulation during program execution.

Connectivity: I2C, IRDA, SPI, UART

Multiple connectivity options allow for easy communication with other devices or peripherals.

Speed: 16 rpm

High clock frequency enables fast processing and response times.

Technical Specifications

Microcontrollers MSP430FR2310IPW16 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

11

No. of Terminals:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

1024

ROM Words:

2048

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, SPI, UART

Peripherals:

PWM, RTC, TIMER(2)

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430FR2310IPW16 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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