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MSP430FR2155TDBT

Texas Instruments

MSP430FR2155TDBT by Texas Instruments

MSP430FR2155TDBT by Texas Instruments is a 16-bit microcontroller with 10-Ch 12-Bit ADC channels, 4096 bytes RAM, and FRAM ROM programmability. It operates at up to 24 MHz clock frequency and has various peripherals like BOR, RTC, and WDT. Ideal for industrial applications requiring low power consumption and high-speed processing.

Median Price

$3.680

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,845 parts In-Stock

1+ parts

$2.557

100+ parts

$2.241

1k+ parts

$1.266

10k+ parts

-

1,845

$2.557

$2.241

$1.266

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DigiKey

USA . 213 parts In-Stock

1+ parts

$3.680

100+ parts

$2.300

1k+ parts

-

10k+ parts

-

213

$3.680

$2.300

-

-

Mouser Electronics

USA . 175 parts In-Stock

1+ parts

$3.680

100+ parts

$2.290

1k+ parts

$2.170

10k+ parts

-

175

$3.680

$2.290

$2.170

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,038 parts In-Stock

1+ parts

$2.429

100+ parts

-

1k+ parts

-

10k+ parts

-

2,038

$2.429

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-

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Vyrian

USA . 6,074 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,074

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 367 parts In-Stock

1+ parts

$2.301

100+ parts

-

1k+ parts

-

10k+ parts

-

367

$2.301

-

-

-

Parana Technologies

USA . 1,295 parts In-Stock

1+ parts

$37.913

100+ parts

-

1k+ parts

-

10k+ parts

-

1,295

$37.913

-

-

-

DigiPath Technology Company

USA . 960 parts In-Stock

1+ parts

$41.747

100+ parts

-

1k+ parts

-

10k+ parts

-

960

$41.747

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-

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ChromeModa Solutions

Germany . 3,189 parts In-Stock

1+ parts

$42.599

100+ parts

$34.931

1k+ parts

-

10k+ parts

-

3,189

$42.599

$34.931

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IDEA Electronic Components Group

UK . 1,997 parts In-Stock

1+ parts

$42.599

100+ parts

$40.469

1k+ parts

$38.339

10k+ parts

-

1,997

$42.599

$40.469

$38.339

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QUARKTWIN TECHNOLOGY LTD

USA . 8,610 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,610

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Overview

Unlock endless possibilities with the Texas Instruments MSP430FR2155TDBT microcontroller. Designed with cutting-edge technology and precision engineering, this compact device offers unmatched performance for a wide range of applications. From industrial automation to consumer electronics, this versatile microcontroller delivers reliable and efficient operation. Experience seamless connectivity and advanced features that will elevate your projects to new heights. Trust in Texas Instruments for quality, innovation, and value. Elevate your designs with the MSP430FR2155TDBT and unleash your creativity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the microcontroller lightweight and cost-effective.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto PCBs, saving space and reducing production time.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in power input options for the microcontroller.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and facilitates easy integration into various electronic devices.

Bit Size: 16

The 16-bit architecture allows for faster processing and handling of data compared to lower bit sizes.

No. of Terminals: 38

The ample number of terminals provide multiple connection points for interfacing with external components and peripherals.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage helps in reducing power consumption and extending battery life in portable devices.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption, making it suitable for battery-operated applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller ensures efficient processing of instructions, enhancing overall performance.

ADC Channels: YES

The presence of Analog-to-Digital Converter channels enables the microcontroller to interface with analog sensors and signals.

RAM Bytes: 4096

With 4096 bytes of RAM, the microcontroller can store and process a significant amount of data quickly.

Technology: CMOS

The CMOS technology used in the microcontroller allows for low power consumption and high noise immunity.

Connectivity: I2C(2), IRADA(2), SPI(4), UART(2)

Multiple connectivity options such as I2C, SPI, and UART enable seamless communication with various peripherals and devices.

Technical Specifications

Microcontrollers MSP430FR2155TDBT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

44

No. of Terminals:

38

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

ROM Words:

33280

ROM Programmability:

FRAM

Maximum Seated Height:

1.2 mm

Speed:

24 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRADA(2), SPI(4), UART(2)

Peripherals:

BOR, COMPARATOR(2), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

MSP430FR2155TDBT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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