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MSP430FR2153TRSMR

Texas Instruments

MSP430FR2153TRSMR by Texas Instruments

MSP430FR2153TRSMR by Texas Instruments is a 16-bit microcontroller with 32 terminals, operating at up to 24 MHz. It features 8 ADC channels, 2048 bytes of RAM, and FRAM ROM programmability. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$1.826

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 889,024 parts In-Stock

1+ parts

$1.826

100+ parts

$1.508

1k+ parts

$0.815

10k+ parts

-

889,024

$1.826

$1.508

$0.815

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,583 parts In-Stock

1+ parts

$1.735

100+ parts

-

1k+ parts

-

10k+ parts

-

3,583

$1.735

-

-

-

Chip Stock

USA . 144,500 parts In-Stock

1+ parts

-

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-

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-

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144,500

-

-

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Vyrian

USA . 5,110 parts In-Stock

1+ parts

-

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-

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5,110

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 708 parts In-Stock

1+ parts

$1.643

100+ parts

-

1k+ parts

-

10k+ parts

-

708

$1.643

-

-

-

AZTECH Wire

Italy . 561 parts In-Stock

1+ parts

$11.980

100+ parts

-

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561

$11.980

-

-

-

Parana Technologies

USA . 226 parts In-Stock

1+ parts

$17.140

100+ parts

-

1k+ parts

$17.354

10k+ parts

-

226

$17.140

-

$17.354

-

DigiPath Technology Company

USA . 484 parts In-Stock

1+ parts

$18.873

100+ parts

-

1k+ parts

-

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484

$18.873

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-

-

ChromeModa Solutions

Germany . 3,589 parts In-Stock

1+ parts

$19.258

100+ parts

$15.792

1k+ parts

-

10k+ parts

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3,589

$19.258

$15.792

-

-

IDEA Electronic Components Group

UK . 1,837 parts In-Stock

1+ parts

$19.258

100+ parts

$18.295

1k+ parts

$17.332

10k+ parts

-

1,837

$19.258

$18.295

$17.332

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

1+ parts

-

100+ parts

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25,000

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QUARKTWIN TECHNOLOGY LTD

USA . 10,496 parts In-Stock

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10,496

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A-Z Elektronik GmbH

Germany . 4,680 parts In-Stock

1+ parts

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4,680

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Infinite Electronics LLP (Excess)

. 3,006 parts In-Stock

1+ parts

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3,006

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Formix International (Excess)

India . 3,000 parts In-Stock

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3,000

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iodParts Technologies Inc.

India . 1,090 parts In-Stock

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1,090

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Overview

Discover the innovative MSP430FR2153TRSMR by Texas Instruments, a cutting-edge microcontroller that delivers high-quality performance and reliability. With a wide range of applications in various industries, this product offers unparalleled value to customers seeking efficient solutions for their projects. Benefit from the advanced features and advantages provided by Texas Instruments, a trusted manufacturer known for its commitment to excellence. Upgrade your designs with the MSP430FR2153TRSMR and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body material provides good protection and durability for the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage allows for versatility in power supply options and compatibility with different systems.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC (Reduced Instruction Set Computer) microcontroller, it offers improved performance and efficiency in executing instructions, making it ideal for speed-sensitive applications.

RAM Bytes: 2048

With a generous amount of RAM, this microcontroller can handle complex tasks and store data efficiently, enabling smooth operation in demanding applications.

ADC Channels: YES

The presence of Analog to Digital Converters allows the microcontroller to interface with analog sensors, enabling it to acquire and process real-world data effectively.

Connectivity: I2C(2), IRADA(2), SPI(2), UART(2)

Multiple connectivity options such as I2C, IRADA, SPI, and UART facilitate communication with other devices, expanding the microcontroller's capabilities and compatibility.

Technical Specifications

Microcontrollers MSP430FR2153TRSMR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

44

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

ROM Words:

16896

ROM Programmability:

FRAM

Maximum Seated Height:

1 mm

Speed:

24 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRADA(2), SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(2), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

MSP430FR2153TRSMR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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