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MSP430FR2033IG56

Texas Instruments

MSP430FR2033IG56 by Texas Instruments

MSP430FR2033IG56 by Texas Instruments is a 16-bit microcontroller with 15360 ROM words, 2048 RAM bytes, and 8 ADC channels. Ideal for industrial applications due to its low power mode, it offers connectivity options like I2C, SPI(2), and UART for versatile usage. With a max clock frequency of 16 MHz and operating temperature range from -40 to 85 °C, it provides high performance in a compact form factor.

Median Price

$2.674

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 17,667 parts In-Stock

1+ parts

$2.169

100+ parts

$1.901

1k+ parts

$1.074

10k+ parts

-

17,667

$2.169

$1.901

$1.074

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DigiKey

USA . 61 parts In-Stock

1+ parts

$3.180

100+ parts

$2.123

1k+ parts

-

10k+ parts

-

61

$3.180

$2.123

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,566 parts In-Stock

1+ parts

$2.061

100+ parts

-

1k+ parts

-

10k+ parts

-

1,566

$2.061

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-

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Vyrian

USA . 6,247 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,247

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,888 parts In-Stock

1+ parts

$1.952

100+ parts

-

1k+ parts

-

10k+ parts

-

2,888

$1.952

-

-

-

Microchip USA

USA . 1,080 parts In-Stock

1+ parts

$18.660

100+ parts

$18.540

1k+ parts

$18.480

10k+ parts

$18.430

1,080

$18.660

$18.540

$18.480

$18.430

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$31.036

100+ parts

$28.243

1k+ parts

$25.450

10k+ parts

-

500

$31.036

$28.243

$25.450

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Parana Technologies

USA . 120 parts In-Stock

1+ parts

$71.654

100+ parts

-

1k+ parts

-

10k+ parts

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120

$71.654

-

-

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DigiPath Technology Company

USA . 1,078 parts In-Stock

1+ parts

$78.900

100+ parts

$72.588

1k+ parts

-

10k+ parts

-

1,078

$78.900

$72.588

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ChromeModa Solutions

Germany . 1,496 parts In-Stock

1+ parts

$80.510

100+ parts

$66.018

1k+ parts

-

10k+ parts

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1,496

$80.510

$66.018

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IDEA Electronic Components Group

UK . 137 parts In-Stock

1+ parts

$80.510

100+ parts

$76.484

1k+ parts

$72.459

10k+ parts

-

137

$80.510

$76.484

$72.459

-

Overview

Discover the powerful MSP430FR2033IG56 microcontroller by Texas Instruments, designed for a wide range of applications. With Texas Instruments renowned quality and reliability, this microcontroller offers exceptional value and benefits to customers. Whether you're looking for low power consumption, advanced connectivity options, or high performance peripherals, the MSP430FR2033IG56 has you covered. Unlock the potential of your projects with this versatile and efficient microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of input voltages, increasing flexibility in design and compatibility.

ADC Channels: YES

Analog to digital converters enable precise measurement and control of analog signals, enhancing the functionality of the microcontroller.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency allows for fast processing speed and performance.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing a Reduced Instruction Set Computing (RISC) architecture typically results in efficient processing and reduced power consumption.

Connectivity: "I2C, IRDS, SPI(2), UART, USCI(2)

Offering multiple connectivity options allows for versatile communication with other devices and systems.

ROM Programmability: FLASH

Flash memory allows for the reprogramming of the ROM, providing flexibility for firmware updates and customization.

Low Power Mode: YES

The availability of a low power mode helps conserve energy and extend battery life in applications where power efficiency is crucial.

Technical Specifications

Microcontrollers MSP430FR2033IG56 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

60

No. of Serial I/Os:

1

No. of Terminals:

56

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

2

ROM Words:

15360

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Maximum Supply Current:

3.7 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDS, SPI(2), UART, USCI(2)"

Peripherals:

"BOR, CRC, RTC, TIMER(6), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430FR2033IG56 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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