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MSP430FR2032IPM

Texas Instruments

MSP430FR2032IPM by Texas Instruments

MSP430FR2032IPM by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 8192 ROM words. It features 10 ADC channels, 8 serial I/Os, and peripherals like RTC and timers. Ideal for industrial applications requiring low power consumption, it operates b/w -40 to 85°C with a supply voltage range of 1.8-3.6V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,007 parts In-Stock

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Vyrian

USA . 3,228 parts In-Stock

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3,228

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Distributors (Availability)

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AZTECH Wire

Italy . 321 parts In-Stock

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$8.092

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One Stop Electronics

USA . 1,177 parts In-Stock

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$15.000

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Parana Technologies

USA . 765 parts In-Stock

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$22.124

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$22.732

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IDEA Electronic Components Group

UK . 1,002 parts In-Stock

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$24.858

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$23.615

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$22.372

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$24.858

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ChromeModa Solutions

Germany . 834 parts In-Stock

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$24.858

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$20.384

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834

$24.858

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Component Stockers USA

USA . 764 parts In-Stock

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$99.990

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764

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Corphita

USA . 4,984 parts In-Stock

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Microchip USA

USA . 2,785 parts In-Stock

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DigiPath Technology Company

USA . 1,417 parts In-Stock

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$22.412

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Overview

Discover the Texas Instruments MSP430FR2032IPM, a top-quality microcontroller that offers unparalleled performance and reliability. With a wide range of applications in various industries, this product is designed to meet your specific needs with ease. Benefit from its low power consumption, integrated cache, and advanced peripherals for enhanced functionality. Trust in Texas Instruments' reputation for excellence in semiconductor technology and unlock endless possibilities with the MSP430FR2032IPM. Choose quality, choose performance, choose Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product ideal for applications where weight and cost are important factors.

Integrated Cache: YES

The integrated cache helps improve performance by storing frequently accessed data, reducing the need to fetch data from external memory.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power supply options and compatibility with a wider range of peripherals.

CPU Family: MSP430

The MSP430 family is known for its low power consumption, making it suitable for battery-powered applications or energy-efficient designs.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to interface with analog sensors and signals, expanding its range of applications.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and flexible firmware updates without the need for external programming hardware, simplifying the design process.

Connectivity: I2C, IRDA, SPI(2), UART

Multiple connectivity options enable easy communication with other devices, sensors, and peripherals, enhancing the versatility of the microcontroller.

Low Power Mode: YES

The availability of a low power mode helps reduce power consumption during idle or standby periods, prolonging battery life in portable devices.

Technical Specifications

Microcontrollers MSP430FR2032IPM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO HAVING 512 BYTES OF INFORMATION FRAM

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

60

No. of Serial I/Os:

8

No. of Terminals:

64

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

1024

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

3.7 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, SPI(2), UART

Peripherals:

RTC, TIMER(2), WDT

Analog To Digital Convertors:

10-Ch 10-Bit

Trade Compliance

MSP430FR2032IPM Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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