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MSP430FG6626IPZR

Texas Instruments

MSP430FG6626IPZR by Texas Instruments

MSP430FG6626IPZR by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 8192 RAM bytes, and 15-Ch 16-Bit ADC channels. Ideal for industrial applications requiring low power consumption, it features peripherals like comparators, DMA controllers, timers, and UART connectivity.

Median Price

$4.252

Lifecycle Status

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9

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1k+

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Texas Instruments

USA . 73,449 parts In-Stock

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$4.804

100+ parts

$3.917

1k+ parts

$2.611

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73,449

$4.804

$3.917

$2.611

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Chip1Stop

Japan . 1,000 parts In-Stock

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$3.700

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$3.700

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Nova Conductors

Japan . 100 parts In-Stock

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$4.024

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100

$4.024

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Digiode

USA . 4,915 parts In-Stock

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$4.564

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$4.564

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Chip Stock

USA . 7,103 parts In-Stock

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Vyrian

USA . 4,035 parts In-Stock

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4,035

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Bristol Electronics

USA . 1,080 parts In-Stock

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1,080

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Atlantic Semiconductor

USA . 1,080 parts In-Stock

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Classic Components Corporation

USA . 450 parts In-Stock

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450

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Semicontronic

India . 37,185 parts In-Stock

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$3.150

100+ parts

$3.071

1k+ parts

$3.056

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37,185

$3.150

$3.071

$3.056

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Ampacity Inc.

Singapore . 36,897 parts In-Stock

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$3.150

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Continental Prestige Electronics

USA . 6,553 parts In-Stock

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$3.817

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$3.741

6,553

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$3.741

Argo Parts USA

USA . 514 parts In-Stock

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$3.817

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514

$3.817

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Advanced Electronics

New Zealand . 40 parts In-Stock

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$4.105

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$4.105

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40

$4.105

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$4.105

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Corphita

USA . 2,814 parts In-Stock

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$4.324

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Corohmni

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AZTECH Wire

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$20.710

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Parana Technologies

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916

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DigiPath Technology Company

USA . 2,107 parts In-Stock

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$28.111

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$25.862

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2,107

$28.111

$25.862

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ChromeModa Solutions

Germany . 5,714 parts In-Stock

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$28.685

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$23.522

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5,714

$28.685

$23.522

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IDEA Electronic Components Group

UK . 560 parts In-Stock

1+ parts

$28.685

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$27.251

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$25.816

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560

$28.685

$27.251

$25.816

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Lixinc

USA . 13,780 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

1+ parts

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$3.944

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$3.823

10k+ parts

$3.743

50

-

$3.944

$3.823

$3.743

Overview

Unlock the power of innovation with the Texas Instruments MSP430FG6626IPZR microcontroller. Designed for high performance and reliability, this cutting-edge device offers a wide range of applications in various industries. With top-notch quality and advanced technology, Texas Instruments ensures that customers receive unparalleled value and benefits. Experience seamless connectivity, low power consumption, and efficient data processing with the MSP430FG6626IPZR, setting new standards in the world of microcontrollers. Trust Texas Instruments to deliver excellence with every product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, making it suitable for a wide range of environments.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows for flexibility in power requirements and compatibility with a variety of power sources.

On Chip Data RAM Width: 16

16-bit data RAM width enables efficient data processing and storage, improving overall performance of the microcontroller.

Package Shape: SQUARE

Square package shape is compact and space-efficient, making it ideal for applications where size is a critical factor.

Bit Size: 16

16-bit architecture provides enhanced processing capabilities and precision, suitable for a wide range of applications requiring high performance.

DAC Channels: YES

Digital-to-analog converter (DAC) channels enable the microcontroller to interface with analog components, expanding its versatility in various applications.

No. of Terminals: 100

Ample number of terminals provide flexibility for connecting peripherals and external components, enhancing the functionality of the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, fine pitch package style offers convenient mounting options and compatibility with modern assembly techniques, ensuring ease of integration.

Minimum Supply Voltage: 2.4 V

Low minimum supply voltage allows for efficient power consumption and operation at lower power levels, ideal for power-sensitive applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures stability and reliable performance in harsh environmental conditions, making it suitable for industrial applications.

CPU Family: MSP430

MSP430 CPU family offers efficient and low-power processing capabilities, making it ideal for battery-operated devices and power-sensitive applications.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range allows for operation in extreme cold environments, enhancing the microcontroller's versatility in various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

ADC Channels: YES

Analog-to-digital converter (ADC) channels enable the microcontroller to convert external analog signals into digital data, expanding its capabilities for sensor interfacing.

DMA Channels: YES

Direct memory access (DMA) channels allow for efficient data transfer and processing, improving overall system performance and responsiveness.

Terminal Position: QUAD

Quad terminal position offers convenient pinout arrangement and ease of PCB layout, simplifying the design and manufacturing process.

ROM Words: 131072

Large ROM capacity provides ample storage space for program code and data, accommodating complex algorithms and applications with ease.

Maximum Seated Height: 1.6 mm

Low maximum seated height ensures compatibility with slim and compact devices, making it suitable for space-constrained applications.

Digital To Analog Convertors: 2-Ch 12-Bit

Dual digital-to-analog converters (DACs) with 12-bit resolution offer precise analog output capabilities, suitable for audio, instrumentation, and control applications.

Width: 14 mm

Compact width allows for easy integration into small form factor devices, making it suitable for portable and handheld applications.

Boundary Scan: YES

Boundary scan feature enables efficient testing and debugging of the microcontroller during production and maintenance, ensuring high product quality and reliability.

Peripherals: COMPARATOR(12), DMA(6), POR, RTC, TIMER(4), WDT

Wide range of built-in peripherals such as comparators, timers, watchdog timers, and DMA controllers enhance the microcontroller's capabilities for diverse application requirements.

Maximum Clock Frequency: 32 MHz

High maximum clock frequency allows for fast and efficient data processing, suitable for applications requiring real-time responsiveness and high-speed operation.

Maximum Time At Peak Reflow Temperature (s): 30

Short maximum time at peak reflow temperature ensures safe and reliable soldering process during manufacturing, minimizing the risk of component damage.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures compatibility with lead-free soldering processes, meeting environmental and regulatory standards.

Length: 14 mm

Compact length enables easy integration into tight spaces, making it suitable for applications with size constraints.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments, making the microcontroller suitable for rugged applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers high computational efficiency and reduced instruction execution time, enhancing overall system performance.

No. of Timers: 4

Multiple timers provide precise timing and scheduling capabilities, essential for applications requiring time-sensitive operations and control functions.

RAM Bytes: 8192

Ample RAM capacity allows for efficient data storage and processing, enabling multitasking and complex algorithms to run smoothly.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, maximizing energy efficiency and system reliability.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and reworkability, ensuring reliable solder joints and simplified manufacturing process.

Analog To Digital Convertors: 15-Ch 16-Bit

Fifteen-channel analog-to-digital converters (ADCs) with 16-bit resolution provide high-precision analog input capabilities, essential for sensor-based applications.

Maximum Supply Current: 6.6 mA

Low maximum supply current ensures energy efficiency and extended battery life, making the microcontroller suitable for portable and battery-operated devices.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage provides consistent power delivery to the microcontroller, ensuring reliable operation and performance under varying load conditions.

No. of DMA Channels: 6

Six direct memory access (DMA) channels allow for efficient data transfer and processing, enhancing system performance and responsiveness.

No. of Serial I/Os: 4

Four serial input/output (I/O) interfaces provide versatile communication options, enabling the microcontroller to communicate with external devices and peripherals.

PWM Channels: YES

Pulse-width modulation (PWM) channels enable precise control of analog outputs, essential for motor control, LED dimming, and power management applications.

Connectivity: I2C(2), IRDA(2), SPI(4), UART(2), USB

Multiple connectivity options such as I2C, IRDA, SPI, UART, and USB facilitate seamless integration with a variety of external devices and communication protocols.

ROM Programmability: FLASH

Flash ROM programmability allows for flexible firmware updates and customization, ensuring adaptability to evolving application requirements and technological advancements.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm enables high-density mounting and precise connections, essential for compact and space-constrained designs.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates moderate sensitivity to moisture, requiring standard handling and storage practices to prevent component damage.

Technical Specifications

Microcontrollers MSP430FG6626IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

HAVING ADDITIONAL 2KB OF USB SRAM, WILL WORK WHEN USB NOT IN USE;

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

73

No. of Serial I/Os:

4

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

8192

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Maximum Supply Current:

6.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), SPI(4), UART(2), USB

Peripherals:

COMPARATOR(12), DMA(6), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

15-Ch 16-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430FG6626IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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