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MSP430FG6426IZQWR

Texas Instruments

MSP430FG6426IZQWR by Texas Instruments

MSP430FG6426IZQWR by Texas Instruments is a 16-bit microcontroller with 131072 ROM words, 10240 RAM bytes, and 15-Ch 16-Bit ADC. Ideal for industrial applications, it features low power mode, 32 MHz clock frequency, and peripherals like RTC and WDT.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,566 parts In-Stock

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Vyrian

USA . 3,496 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 560 parts In-Stock

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$15.249

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$15.249

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One Stop Electronics

USA . 1,633 parts In-Stock

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$17.000

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Parana Technologies

USA . 2,257 parts In-Stock

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$31.718

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$87.552

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$31.718

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$87.552

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IDEA Electronic Components Group

UK . 2,011 parts In-Stock

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$35.638

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$33.856

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$32.074

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2,011

$35.638

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$32.074

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ChromeModa Solutions

Germany . 405 parts In-Stock

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$35.638

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$29.223

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405

$35.638

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DigiPath Technology Company

USA . 2,167 parts In-Stock

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$32.131

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Corphita

USA . 1,194 parts In-Stock

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Microchip USA

USA . 450 parts In-Stock

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Overview

Unleash the power of innovation with the MSP430FG6426IZQWR by Texas Instruments, a top-of-the-line microcontroller designed to elevate your projects to new heights. With a reputation for excellence in quality and reliability, Texas Instruments delivers cutting-edge technology that exceeds expectations. Ideal for a wide range of applications, this microcontroller offers unparalleled value, delivering efficiency, performance, and versatility to meet all your needs. Experience the difference with Texas Instruments and take your projects to the next level with the MSP430FG6426IZQWR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for a variety of applications.

Maximum Supply Voltage: 3.6 V

The higher supply voltage allows for flexibility in power requirements and compatibility with different systems.

ROM Words: 131072

With a large ROM capacity, this microcontroller can store a significant amount of code and data for complex operations.

Maximum Clock Frequency: 32 MHz

The high clock frequency enables fast processing speeds, making this microcontroller suitable for applications that require quick response times.

Analog To Digital Convertors: 15-Ch 16-Bit

Having multiple high-resolution ADC channels allows for precise analog signal conversion, making this microcontroller ideal for sensor interfacing and data acquisition applications.

Connectivity: I2C(2), IRDA(2), SPI(4), UART(2)

The multiple connectivity options enable easy interfacing with other devices and peripherals, enhancing the versatility of this microcontroller.

Technical Specifications

Microcontrollers MSP430FG6426IZQWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 8MHZ AT 1.8V MIN SUPPLY

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

73

No. of Serial I/Os:

4

No. of Terminals:

113

No. of Timers:

4

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

10240

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Maximum Supply Current:

6.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), SPI(4), UART(2)

Peripherals:

COMPARATOR(12), DMA(6), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

15-Ch 16-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430FG6426IZQWR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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