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MSP430FG6425IPZR

Texas Instruments

MSP430FG6425IPZR by Texas Instruments

MSP430FG6425IPZR by Texas Instruments is a 16-bit microcontroller with 10240 bytes of RAM and 65536 ROM words. It features 15-Ch 16-Bit ADC, 2-Ch 12-Bit DAC, and operates at a max clock frequency of 32 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$4.486

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,650 parts In-Stock

1+ parts

$4.486

100+ parts

$3.657

1k+ parts

$2.438

10k+ parts

-

2,650

$4.486

$3.657

$2.438

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,257 parts In-Stock

1+ parts

$4.262

100+ parts

-

1k+ parts

-

10k+ parts

-

2,257

$4.262

-

-

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Vyrian

USA . 3,466 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

-

3,466

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,542 parts In-Stock

1+ parts

$4.037

100+ parts

-

1k+ parts

-

10k+ parts

-

1,542

$4.037

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-

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AZTECH Wire

Italy . 496 parts In-Stock

1+ parts

$15.100

100+ parts

-

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-

10k+ parts

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496

$15.100

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Microchip USA

USA . 1,650 parts In-Stock

1+ parts

$22.410

100+ parts

$22.270

1k+ parts

$22.200

10k+ parts

$22.130

1,650

$22.410

$22.270

$22.200

$22.130

Parana Technologies

USA . 1,323 parts In-Stock

1+ parts

$67.951

100+ parts

-

1k+ parts

-

10k+ parts

-

1,323

$67.951

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DigiPath Technology Company

USA . 1,732 parts In-Stock

1+ parts

$74.822

100+ parts

$68.836

1k+ parts

-

10k+ parts

-

1,732

$74.822

$68.836

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ChromeModa Solutions

Germany . 3,533 parts In-Stock

1+ parts

$76.349

100+ parts

$62.606

1k+ parts

-

10k+ parts

-

3,533

$76.349

$62.606

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IDEA Electronic Components Group

UK . 105 parts In-Stock

1+ parts

$76.349

100+ parts

$72.532

1k+ parts

$68.714

10k+ parts

-

105

$76.349

$72.532

$68.714

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QUARKTWIN TECHNOLOGY LTD

USA . 7,381 parts In-Stock

1+ parts

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7,381

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Overview

Unlock endless possibilities with the Texas Instruments MSP430FG6425IPZR microcontroller. Crafted with precision and innovation, this device offers unparalleled performance in a compact package. Ideal for a wide range of applications, from IoT devices to industrial automation, this microcontroller boasts top-notch quality and reliability. With features like low power mode, multiple ADC channels, and advanced peripherals, the MSP430FG6425IPZR delivers exceptional value and efficiency to customers looking to elevate their projects to new heights. Trust Texas Instruments for cutting-edge technology that pushes boundaries and exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers good durability and protection for the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage provides flexibility in power supply options and allows for compatibility with a wide range of voltage sources.

CPU Family: MSP430

MSP430 CPU family is known for its low power consumption and high performance, making it ideal for energy-efficient applications.

ADC Channels: YES

Having Analog to Digital Converter (ADC) channels allows the microcontroller to interface with analog sensors and signals, expanding its capabilities.

RAM Bytes: 10240

Ample amount of on-chip data RAM enables efficient data storage and processing, enhancing the overall performance of the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with Reduced Instruction Set Computing (RISC) architecture provides fast and efficient processing of instructions, improving the overall speed of the microcontroller.

Analog To Digital Convertors: 15-Ch 16-Bit

Having multiple 16-bit Analog to Digital Converters (ADCs) allows for high-resolution analog signal processing, offering precise measurements and control in the application.

Speed: 20 rpm

Operating at a speed of 20 revolutions per minute (rpm) provides a balance between power consumption and processing speed, making it suitable for various real-time applications.

Technical Specifications

Microcontrollers MSP430FG6425IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 8MHZ AT 1.8V MIN SUPPLY

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

73

No. of Serial I/Os:

4

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

10240

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

20 rpm

Maximum Supply Current:

6.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(2), SPI(4), UART(2)

Peripherals:

COMPARATOR(12), DMA(6), POR, RTC, TIMER(4), WDT

Analog To Digital Convertors:

15-Ch 16-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430FG6425IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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