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MSP430FG479IZQWR

Texas Instruments

MSP430FG479IZQWR by Texas Instruments

MSP430FG479IZQWR by Texas Instruments is a 16-bit microcontroller with 48 I/O lines, 2 DAC channels, and 1 ADC channel. It operates at a max frequency of 8 MHz and has low power mode capabilities. Ideal for industrial applications requiring high-speed processing and connectivity via I2C, LIN, SPI, UART interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,579 parts In-Stock

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9,579

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Digiode

USA . 4,175 parts In-Stock

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4,175

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Distributors (Availability)

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One Stop Electronics

USA . 460 parts In-Stock

1+ parts

$4.000

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-

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460

$4.000

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Semicontronic

India . 189 parts In-Stock

1+ parts

$8.000

100+ parts

$7.800

1k+ parts

$7.760

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189

$8.000

$7.800

$7.760

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AZTECH Wire

Italy . 724 parts In-Stock

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$15.897

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724

$15.897

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Parana Technologies

USA . 1,268 parts In-Stock

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$39.127

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1,268

$39.127

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IDEA Electronic Components Group

UK . 2,039 parts In-Stock

1+ parts

$43.963

100+ parts

$41.765

1k+ parts

$39.567

10k+ parts

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2,039

$43.963

$41.765

$39.567

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ChromeModa Solutions

Germany . 1,779 parts In-Stock

1+ parts

$43.963

100+ parts

$36.050

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1,779

$43.963

$36.050

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Corphita

USA . 3,761 parts In-Stock

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3,761

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DigiPath Technology Company

USA . 1,044 parts In-Stock

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$39.637

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1,044

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$39.637

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Microchip USA

USA . 204 parts In-Stock

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Overview

Unlock the potential of your projects with the Texas Instruments MSP430FG479IZQWR microcontroller. Known for its exceptional quality and reliability, Texas Instruments delivers cutting-edge technology in a compact package. Ideal for a wide range of applications, this microcontroller offers unparalleled value, efficiency, and performance. Seamlessly integrate peripherals like BOR, COMPARATOR, LCD, RTC, TIMER(7), and WDT into your designs with ease. Experience the power of connectivity with I2C, IRDA, LIN, SPI(2), UART, and USCI(2). Trust in Texas Instruments to bring innovation to your projects and elevate your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power input options, accommodating a range of voltage sources.

ADC Channels: YES

Enables analog-to-digital conversion, making it suitable for applications requiring precise sensor readings.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for efficient processing, enhancing performance and power efficiency.

Maximum Clock Frequency: 8 MHz

Supports high-speed operations, making it suitable for tasks requiring rapid data processing.

Connectivity: I2C, IRDA, LIN, SPI(2), UART, USCI(2)

Offers a wide range of communication options, enabling integration with various external devices and systems.

ROM Programmability: FLASH

Allows for easy reprogramming of the microcontroller's memory, facilitating software updates and customization.

Low Power Mode: YES

Enables power-saving capabilities, prolonging battery life and making it suitable for energy-efficient applications.

Technical Specifications

Microcontrollers MSP430FG479IZQWR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

1

No. of Terminals:

113

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

2

ROM Words:

30720

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.46 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Connectivity:

I2C, IRDA, LIN, SPI(2), UART, USCI(2)

Peripherals:

BOR, COMPARATOR, LCD, RTC, TIMER(7), WDT

Analog To Digital Convertors:

1-Ch 16-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430FG479IZQWR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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