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MSP430FG479IZCAR

Texas Instruments

MSP430FG479IZCAR by Texas Instruments

MSP430FG479IZCAR by Texas Instruments is a 16-bit microcontroller with 1024 RAM words and 61440 ROM words. It features 2-CH 12-BIT DAC, 1-Ch 16-Bit ADC, and peripherals like LCD and RTC. Ideal for industrial applications requiring low power consumption and high-speed operation up to 8 MHz.

Median Price

$11.952

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,483 parts In-Stock

1+ parts

$11.952

100+ parts

$10.440

1k+ parts

$7.200

10k+ parts

-

9,483

$11.952

$10.440

$7.200

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,927 parts In-Stock

1+ parts

$11.354

100+ parts

-

1k+ parts

-

10k+ parts

-

3,927

$11.354

-

-

-

Vyrian

USA . 3,355 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,355

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,079 parts In-Stock

1+ parts

$10.757

100+ parts

-

1k+ parts

-

10k+ parts

-

1,079

$10.757

-

-

-

AZTECH Wire

Italy . 395 parts In-Stock

1+ parts

$17.170

100+ parts

-

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-

10k+ parts

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395

$17.170

-

-

-

Microchip USA

USA . 2,238 parts In-Stock

1+ parts

$26.060

100+ parts

$25.690

1k+ parts

$25.500

10k+ parts

$25.320

2,238

$26.060

$25.690

$25.500

$25.320

Parana Technologies

USA . 193 parts In-Stock

1+ parts

$35.072

100+ parts

-

1k+ parts

-

10k+ parts

-

193

$35.072

-

-

-

DigiPath Technology Company

USA . 1,112 parts In-Stock

1+ parts

$38.619

100+ parts

-

1k+ parts

-

10k+ parts

-

1,112

$38.619

-

-

-

ChromeModa Solutions

Germany . 2,487 parts In-Stock

1+ parts

$39.407

100+ parts

$32.314

1k+ parts

-

10k+ parts

-

2,487

$39.407

$32.314

-

-

IDEA Electronic Components Group

UK . 1,593 parts In-Stock

1+ parts

$39.407

100+ parts

$37.437

1k+ parts

$35.466

10k+ parts

-

1,593

$39.407

$37.437

$35.466

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Lixinc

USA . 19,020 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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19,020

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Component Stockers USA

USA . 13,437 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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13,437

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-

-

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Futuretech Components

Singapore . 2,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,500

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Overview

Unlock the power of innovation with the MSP430FG479IZCAR by Texas Instruments, a top-tier microcontroller designed to elevate your projects to new heights. Manufactured with precision and excellence, this device offers unparalleled quality and reliability, making it the perfect choice for a wide range of applications. From industrial automation to consumer electronics, the MSP430FG479IZCAR delivers exceptional performance, low power consumption, and advanced features that provide value and flexibility to customers. Experience the difference with Texas Instruments - where cutting-edge technology meets superior craftsmanship.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ensuring longevity and ease of handling.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort in production processes.

Maximum Supply Voltage: 3.6 V

Support for a higher maximum supply voltage provides flexibility in power input options for various applications.

On Chip Data RAM Width: 16

Having a wide 16-bit data RAM width allows for faster data processing and handling capabilities.

Package Shape: SQUARE

Square package shape helps optimize PCB layout and space utilization, making it convenient for compact designs.

Bit Size: 16

With a 16-bit architecture, the microcontroller can handle larger data sizes and perform more complex operations efficiently.

DAC Channels: YES

Inclusion of DAC channels enables analog output capability, which is essential for applications requiring precise voltage outputs.

No. of Terminals: 113

Having a high number of terminals allows for a wide range of peripheral connections and interfaces, enhancing the microcontroller's versatility.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The package style with a grid array, thin profile, and fine pitch enhances PCB layout flexibility and component density, suitable for space-constrained designs.

Minimum Supply Voltage: 1.8 V

Support for a low minimum supply voltage enables operation in power-constrained environments and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

Extended operating temperature range of up to 85°C ensures reliability and performance in harsh environmental conditions.

CPU Family: MSP430

Being part of the MSP430 CPU family signifies efficient power management, high performance, and a wide range of integrated peripherals for diverse applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, the microcontroller can withstand extreme cold conditions without compromising functionality.

Terminal Finish: TIN SILVER COPPER

The terminal finish with TIN SILVER COPPER composition ensures excellent conductivity, solderability, and corrosion resistance for reliable connections.

ADC Channels: YES

Inclusion of ADC channels enables accurate analog-to-digital conversion, making the microcontroller suitable for sensor-based applications and data acquisition.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates easier PCB mounting and rework, enhancing overall assembly efficiency.

ROM Words: 61440

Large ROM capacity of 61440 words allows for extensive program storage, offering flexibility for complex software implementations.

Maximum Seated Height: 1 mm

Low maximum seated height minimizes the overall profile of the microcontroller, ideal for slim and compact device designs.

Digital To Analog Convertors: 2-CH 12-BIT

Dual 12-bit DAC channels provide high-resolution analog output capabilities, suitable for applications requiring precise voltage levels.

RAM Words: 1024

Adequate RAM capacity of 1024 words ensures sufficient memory for temporary data storage and efficient program execution.

Width: 7 mm

The compact width of 7 mm allows for space-saving integration in tight PCB layouts, enabling versatile design options.

Technical Specifications

Microcontrollers MSP430FG479IZCAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Serial I/Os:

2

No. of Terminals:

113

No. of Timers:

7

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

2048

RAM Words:

1024

ROM Words:

61440

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

8 rpm

Maximum Supply Current:

.46 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, LIN, SPI(2), UART, USCI(2)

Peripherals:

BOD, COMPARATOR, LCD, RTC, TIMER(7), RTC, WDT

Analog To Digital Convertors:

1-Ch 16-Bit

Digital To Analog Convertors:

2-CH 12-BIT

Trade Compliance

MSP430FG479IZCAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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