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MSP430FG4619IZCAR

Texas Instruments

MSP430FG4619IZCAR by Texas Instruments

MSP430FG4619IZCAR by Texas Instruments is a 16-bit microcontroller with 2-Ch 12-Bit DAC and 12-Ch 12-Bit ADC. It features 11 timers, operates at up to 8 MHz, and has a supply voltage range of 2.7V to 3.6V. Ideal for industrial applications requiring low power consumption and multiple serial I/O connectivity options like I2C, SPI, and UART.

Median Price

$13.805

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 14,755 parts In-Stock

1+ parts

$13.805

100+ parts

$12.058

1k+ parts

$8.316

10k+ parts

-

14,755

$13.805

$12.058

$8.316

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,394 parts In-Stock

1+ parts

$13.115

100+ parts

-

1k+ parts

-

10k+ parts

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4,394

$13.115

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Vyrian

USA . 5,260 parts In-Stock

1+ parts

-

100+ parts

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5,260

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,537 parts In-Stock

1+ parts

$12.424

100+ parts

-

1k+ parts

-

10k+ parts

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1,537

$12.424

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-

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AZTECH Wire

Italy . 1,133 parts In-Stock

1+ parts

$15.010

100+ parts

-

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1,133

$15.010

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Microchip USA

USA . 2,611 parts In-Stock

1+ parts

$30.100

100+ parts

$29.670

1k+ parts

$29.460

10k+ parts

$29.240

2,611

$30.100

$29.670

$29.460

$29.240

Parana Technologies

USA . 2,347 parts In-Stock

1+ parts

$52.078

100+ parts

-

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10k+ parts

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2,347

$52.078

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DigiPath Technology Company

USA . 1,477 parts In-Stock

1+ parts

$57.345

100+ parts

-

1k+ parts

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10k+ parts

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1,477

$57.345

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ChromeModa Solutions

Germany . 5,908 parts In-Stock

1+ parts

$58.515

100+ parts

$47.982

1k+ parts

-

10k+ parts

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5,908

$58.515

$47.982

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IDEA Electronic Components Group

UK . 914 parts In-Stock

1+ parts

$58.515

100+ parts

$55.589

1k+ parts

$52.664

10k+ parts

-

914

$58.515

$55.589

$52.664

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Overview

Unlock the power of innovation with the MSP430FG4619IZCAR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments sets the standard for quality and reliability. The MSP430FG4619IZCAR is a versatile microcontroller that offers a wide range of applications, from IoT devices to industrial automation. With its low power consumption and advanced peripherals, this product provides unmatched value to customers looking to streamline their designs and enhance performance. Experience the benefits of cutting-edge technology with the MSP430FG4619IZCAR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various industrial applications.

Maximum Supply Voltage: 3.6 V

Allows for a higher voltage input, providing flexibility in power supply options.

CPU Family: MSP430

Known for low power consumption and high performance, making it efficient for battery-powered applications.

ADC Channels: YES

Ability to convert analog signals to digital, allowing for precise measurement and control in various systems.

ROM Programmability: FLASH

Flash ROM allows for easy and fast reprogramming of the microcontroller, enabling quick updates and changes in the system.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient processing and execution of commands, enhancing overall performance.

Connectivity: I2C, IRDA, SPI(2), UART(2), USCI(2), USART

Multiple communication interfaces allow for seamless integration with other devices and systems, enhancing connectivity options.

Low Power Mode: YES

Ability to operate in low power mode conserves energy, prolonging battery life in portable devices.

Technical Specifications

Microcontrollers MSP430FG4619IZCAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

80

No. of Serial I/Os:

2

No. of Terminals:

113

No. of Timers:

11

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

RAM Words:

2048

ROM Words:

122880

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

8 rpm

Maximum Supply Current:

.74 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, SPI(2), UART(2), USCI(2), USART

Peripherals:

BOD, COMPARATOR(2), DMA(3), LCD, POR, TIMER(11), RTC, WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430FG4619IZCAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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