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MSP430FG4617IPZR

Texas Instruments

MSP430FG4617IPZR by Texas Instruments

MSP430FG4617IPZR by Texas Instruments is a 16-bit microcontroller with 80 I/O lines, 8 MHz clock frequency, and 8192 bytes of RAM. Ideal for industrial applications requiring low power consumption and high performance in a compact package.

Median Price

$9.375

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 750 parts In-Stock

1+ parts

$9.375

100+ parts

$5.625

1k+ parts

$5.391

10k+ parts

-

750

$9.375

$5.625

$5.391

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Digiode

USA . 4,598 parts In-Stock

1+ parts

-

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4,598

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Vyrian

USA . 2,699 parts In-Stock

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2,699

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 493 parts In-Stock

1+ parts

$10.808

100+ parts

-

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493

$10.808

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Microchip USA

USA . 339 parts In-Stock

1+ parts

$26.310

100+ parts

$25.940

1k+ parts

$25.750

10k+ parts

$25.560

339

$26.310

$25.940

$25.750

$25.560

One Stop Electronics

USA . 777 parts In-Stock

1+ parts

$30.000

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-

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777

$30.000

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Parana Technologies

USA . 1,294 parts In-Stock

1+ parts

$37.594

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1,294

$37.594

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DigiPath Technology Company

USA . 1,945 parts In-Stock

1+ parts

$41.396

100+ parts

$38.084

1k+ parts

-

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1,945

$41.396

$38.084

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ChromeModa Solutions

Germany . 768 parts In-Stock

1+ parts

$42.241

100+ parts

$34.638

1k+ parts

-

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768

$42.241

$34.638

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IDEA Electronic Components Group

UK . 201 parts In-Stock

1+ parts

$42.241

100+ parts

$40.129

1k+ parts

$38.017

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201

$42.241

$40.129

$38.017

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Kepictronics

USA . 3,235 parts In-Stock

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3,235

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Futuretech Components

Singapore . 827 parts In-Stock

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827

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Corphita

USA . 478 parts In-Stock

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478

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Lixinc

USA . 36 parts In-Stock

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36

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Overview

Discover the exceptional MSP430FG4617IPZR microcontroller by Texas Instruments, a true game-changer in the industry. This high-quality device offers unmatched reliability and performance, making it ideal for a wide range of applications. With advanced features like DAC and ADC channels, DMA support, and ROM programmability, this microcontroller delivers unparalleled value to customers looking for cutting-edge technology. Experience the benefits of Texas Instruments' expertise and innovation with the MSP430FG4617IPZR, setting new standards in the market. Unlock endless possibilities and elevate your projects with this versatile and powerful microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good mechanical strength and insulation, ensuring durability and reliability of the microcontroller.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 3.6 V

Supports a higher supply voltage, making it suitable for a wide range of applications without risking damage to the microcontroller.

Bit Size: 16

16-bit architecture allows for more complex processing and calculations, enhancing the capabilities of the microcontroller.

DAC Channels: YES

Digital-to-analog converter channels enable the microcontroller to interface with analog components and devices, expanding its functionality.

Power Supplies (V): 2/3.3

Supports multiple power supply voltages, providing versatility in design and compatibility with different power sources.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style allows for compact and space-efficient PCB layout, suitable for miniaturized designs.

Minimum Operating Temperature: -40 °C

Wide temperature range support allows the microcontroller to operate reliably in harsh environmental conditions, making it suitable for industrial applications.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to read and process analog sensor data, enhancing its sensing and monitoring capabilities.

DMA Channels: YES

Direct Memory Access channels allow for efficient data transfer between peripherals and memory without CPU intervention, improving overall system performance.

ROM Words: 94208

Large ROM capacity ensures ample space for program storage and data retention, accommodating complex firmware and algorithms.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides high performance with simplified instruction set and reduced power consumption, making it ideal for embedded applications.

RAM Bytes: 8192

Sufficient RAM capacity allows for efficient data processing and multitasking, enhancing the microcontroller's performance in handling concurrent operations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and reliable operation of the microcontroller.

PWM Channels: YES

Pulse Width Modulation channels enable precise control of analog outputs such as motor speed and LED brightness, expanding the microcontroller's applicability in control systems.

Technical Specifications

Microcontrollers MSP430FG4617IPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 3MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

80

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

94208

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430FG4617IPZR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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