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MSP430FG4616IZQWT

Texas Instruments

MSP430FG4616IZQWT by Texas Instruments

MSP430FG4616IZQWT by Texas Instruments is a 16-bit microcontroller with 80 I/O lines, 4096 bytes of RAM, and 94208 ROM words. It operates at a max clock frequency of 8 MHz and has ADC, DAC, and PWM channels. Ideal for industrial applications requiring low power consumption and high performance in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,777 parts In-Stock

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Digiode

USA . 901 parts In-Stock

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One Stop Electronics

USA . 754 parts In-Stock

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$10.000

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754

$10.000

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AZTECH Wire

Italy . 435 parts In-Stock

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$14.693

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Parana Technologies

USA . 1,803 parts In-Stock

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$61.990

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DigiPath Technology Company

USA . 658 parts In-Stock

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$68.259

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$62.798

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IDEA Electronic Components Group

UK . 1,817 parts In-Stock

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$69.652

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$66.169

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$62.687

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ChromeModa Solutions

Germany . 1,202 parts In-Stock

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$69.652

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$57.115

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Corphita

USA . 4,263 parts In-Stock

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Authorized Procurement Solutions

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Microchip USA

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Overview

Unlock endless possibilities with the Texas Instruments MSP430FG4616IZQWT microcontroller. Renowned for its top-notch quality and reliability, Texas Instruments delivers cutting-edge technology in the form of this versatile microcontroller. Ideal for a wide range of applications, this microcontroller offers unparalleled value, benefits, and advantages to customers looking for seamless performance and efficiency. Dive into the world of innovation and experience the power of Texas Instruments with the MSP430FG4616IZQWT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for a variety of applications.

Bit Size: 16

Offers a good balance between processing power and efficiency for many applications.

DAC Channels: YES

Allows for digital-to-analog conversion, expanding the range of possible applications for the microcontroller.

No. of Terminals: 113

Provides a sufficient number of terminals for connecting external devices and components.

ADC Channels: YES

Enables analog-to-digital conversion, adding flexibility in interfacing with external sensors and devices.

ROM Words: 94208

Ample amount of ROM storage for program code and data, accommodating complex applications.

PWM Channels: YES

Supports pulse-width modulation, which is useful for controlling motors, LED brightness, and more.

RAM Bytes: 4096

Provides sufficient memory for temporary data storage and efficient program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the microcontroller.

ROM Programmability: FLASH

Flash ROM allows for easy and quick programming of the microcontroller, enabling rapid prototyping and development.

Technical Specifications

Microcontrollers MSP430FG4616IZQWT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 3MHZ

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

80

No. of Terminals:

113

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

94208

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

MSP430FG4616IZQWT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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