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MSP430FG4616IZCAR

Texas Instruments

MSP430FG4616IZCAR by Texas Instruments

MSP430FG4616IZCAR by Texas Instruments is a 16-bit microcontroller with integrated cache, 2-Ch 12-Bit DAC, and 12-Ch 12-Bit ADC. Ideal for industrial applications due to its low power mode, peripherals like LCD and RTC, and connectivity options including I2C and UART. Operating temperature range from -40 to 85 °C.

Median Price

$12.926

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,949 parts In-Stock

1+ parts

$12.926

100+ parts

$11.291

1k+ parts

$7.787

10k+ parts

-

6,949

$12.926

$11.291

$7.787

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,797 parts In-Stock

1+ parts

$12.280

100+ parts

-

1k+ parts

-

10k+ parts

-

1,797

$12.280

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Vyrian

USA . 5,080 parts In-Stock

1+ parts

-

100+ parts

-

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-

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5,080

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 202 parts In-Stock

1+ parts

$8.490

100+ parts

-

1k+ parts

-

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202

$8.490

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Corphita

USA . 4,204 parts In-Stock

1+ parts

$11.633

100+ parts

-

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-

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4,204

$11.633

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Microchip USA

USA . 1,468 parts In-Stock

1+ parts

$28.190

100+ parts

$27.790

1k+ parts

$27.580

10k+ parts

$27.380

1,468

$28.190

$27.790

$27.580

$27.380

Parana Technologies

USA . 1,374 parts In-Stock

1+ parts

$38.420

100+ parts

-

1k+ parts

-

10k+ parts

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1,374

$38.420

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DigiPath Technology Company

USA . 1,552 parts In-Stock

1+ parts

$42.305

100+ parts

$38.920

1k+ parts

-

10k+ parts

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1,552

$42.305

$38.920

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ChromeModa Solutions

Germany . 6,678 parts In-Stock

1+ parts

$43.168

100+ parts

$35.398

1k+ parts

-

10k+ parts

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6,678

$43.168

$35.398

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IDEA Electronic Components Group

UK . 756 parts In-Stock

1+ parts

$43.168

100+ parts

$41.010

1k+ parts

$38.851

10k+ parts

-

756

$43.168

$41.010

$38.851

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Overview

Unlock the power of innovation with the Texas Instruments MSP430FG4616IZCAR microcontroller. Designed with precision and quality in mind, this versatile device offers a wide range of applications in various industries. With advanced features such as integrated cache, DAC channels, and peripherals like brown-out detect and LCD support, this microcontroller provides unmatched value and performance to customers. Trust Texas Instruments for cutting-edge technology that delivers reliability and efficiency in every project. Experience the difference with the MSP430FG4616IZCAR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, making the product suitable for a wide range of applications.

Integrated Cache: YES

Enhances processing speed and efficiency by storing frequently accessed data.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with various voltage sources.

On Chip Data RAM Width: 16

Allows for efficient data processing and storage capabilities.

DAC Channels: YES

Enables the conversion of digital signals into analog output, expanding the product's functionality.

No. of Terminals: 113

Provides ample connectivity options for interfacing with external devices and peripherals.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments.

CPU Family: MSP430

A well-established and reliable CPU family known for its performance and efficiency.

ADC Channels: YES

Facilitates analog-to-digital conversion for precise and accurate input data processing.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes Reduced Instruction Set Computing (RISC) architecture for streamlined and efficient operation.

Technical Specifications

Microcontrollers MSP430FG4616IZCAR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 1.8V MINIMUM SUPPLY AT 3 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B113

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

3

No. of I/O Lines:

80

No. of Terminals:

113

No. of Timers:

2

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA113,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

RAM Words:

2048

ROM Words:

94208

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

8 rpm

Maximum Supply Current:

.74 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI(3), UART(2), USART

Peripherals:

BROWN-OUT DETECT, COMPARATOR, DMA(3), LCD, RTC, TIMER(2), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

MSP430FG4616IZCAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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