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MSP430FG4270IRGZR

Texas Instruments

MSP430FG4270IRGZR by Texas Instruments

MSP430FG4270IRGZR by Texas Instruments is a 16-bit microcontroller with 32 I/O lines, 8 MHz clock frequency, and 256 bytes of RAM. It features 8-channel 16-bit ADCs and DACs, suitable for industrial applications requiring low power consumption and high-speed processing. The device supports peripherals like LCD, timers, and watchdog timer (WDT) for efficient system control.

Median Price

$4.928

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 10,695 parts In-Stock

1+ parts

$4.928

100+ parts

$4.017

1k+ parts

$2.678

10k+ parts

-

10,695

$4.928

$4.017

$2.678

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,732 parts In-Stock

1+ parts

$4.682

100+ parts

-

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-

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3,732

$4.682

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Vyrian

USA . 8,519 parts In-Stock

1+ parts

-

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8,519

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 997 parts In-Stock

1+ parts

$4.435

100+ parts

-

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-

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997

$4.435

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AZTECH Wire

Italy . 995 parts In-Stock

1+ parts

$15.800

100+ parts

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995

$15.800

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Parana Technologies

USA . 578 parts In-Stock

1+ parts

$50.246

100+ parts

-

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578

$50.246

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ChromeModa Solutions

Germany . 5,549 parts In-Stock

1+ parts

$56.456

100+ parts

$46.294

1k+ parts

-

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5,549

$56.456

$46.294

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IDEA Electronic Components Group

UK . 2,054 parts In-Stock

1+ parts

$56.456

100+ parts

$53.633

1k+ parts

$50.810

10k+ parts

-

2,054

$56.456

$53.633

$50.810

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A-Z Elektronik GmbH

Germany . 6,662 parts In-Stock

1+ parts

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6,662

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Component Stockers USA

USA . 5,246 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$2.840

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5,246

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$2.840

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DigiPath Technology Company

USA . 1,199 parts In-Stock

1+ parts

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100+ parts

$50.901

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1,199

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$50.901

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Kepictronics

USA . 731 parts In-Stock

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731

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Overview

Unleash the power of innovation with the MSP430FG4270IRGZR by Texas Instruments. This cutting-edge microcontroller is designed to exceed expectations, offering unrivaled performance and reliability. Whether you're in the automotive, industrial, or consumer electronics sector, this versatile device will elevate your products to new heights. With advanced features like DAC and ADC channels, along with low power modes, the MSP430FG4270IRGZR delivers exceptional value and benefits to customers looking to stay ahead of the curve. Trust in Texas Instruments for quality and innovation that sets you apart from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with various voltage sources.

ADC Channels: YES

The presence of Analog to Digital Convertor channels allows for conversion of analog signals to digital data, enabling sensor interfacing and data acquisition.

CPU Family: MSP430

The MSP430 family of microcontrollers is known for its low power consumption, making it an energy-efficient choice for battery-operated devices.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the microcontroller without requiring specialized equipment, facilitating firmware updates and customization.

Technical Specifications

Microcontrollers MSP430FG4270IRGZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.5V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

32

No. of Serial I/Os:

0

No. of Terminals:

48

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.52 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Peripherals:

"BOR, LCD, TIMER(4), WDT"

Analog To Digital Convertors:

8-Ch 16-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

MSP430FG4270IRGZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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