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MSP430FE423IPMR

Texas Instruments

MSP430FE423IPMR by Texas Instruments

MSP430FE423IPMR by Texas Instruments is a 16-bit microcontroller with 64 terminals, operating at max 8 MHz. It features 256 bytes of RAM, SPI and UART connectivity, and low power mode. Ideal for industrial applications requiring high-speed processing in a compact form factor.

Median Price

$3.952

Lifecycle Status

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3

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 950 parts In-Stock

1+ parts

$3.952

100+ parts

$3.222

1k+ parts

$2.148

10k+ parts

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950

$3.952

$3.222

$2.148

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Digiode

USA . 4,661 parts In-Stock

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$3.754

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4,661

$3.754

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Vyrian

USA . 6,013 parts In-Stock

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6,013

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Corphita

USA . 1,511 parts In-Stock

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$3.557

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-

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1,511

$3.557

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AZTECH Wire

Italy . 143 parts In-Stock

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$13.670

100+ parts

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143

$13.670

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Microchip USA

USA . 2,559 parts In-Stock

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$19.740

100+ parts

$19.620

1k+ parts

$19.560

10k+ parts

$19.500

2,559

$19.740

$19.620

$19.560

$19.500

Parana Technologies

USA . 1,129 parts In-Stock

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$51.554

100+ parts

-

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1,129

$51.554

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DigiPath Technology Company

USA . 2,377 parts In-Stock

1+ parts

$56.767

100+ parts

$52.226

1k+ parts

-

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2,377

$56.767

$52.226

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IDEA Electronic Components Group

UK . 1,473 parts In-Stock

1+ parts

$57.926

100+ parts

$55.030

1k+ parts

$52.133

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-

1,473

$57.926

$55.030

$52.133

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ChromeModa Solutions

Germany . 242 parts In-Stock

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$57.926

100+ parts

$47.499

1k+ parts

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242

$57.926

$47.499

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A-Z Elektronik GmbH

Germany . 858 parts In-Stock

1+ parts

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858

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Overview

Unleash the power of innovation with the Texas Instruments MSP430FE423IPMR microcontroller. Built with precision and expertise, this versatile device offers unmatched performance and reliability for a wide range of applications. Whether you're designing smart home devices, wearable technology, or industrial automation systems, this microcontroller delivers exceptional value, efficiency, and flexibility. Elevate your projects to new heights with the MSP430FE423IPMR and experience the difference that cutting-edge technology can make in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the microcontroller, making it suitable for a variety of environments.

Surface Mount: YES

Surface mount packaging allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

On Chip Data RAM Width: 8

Having a wide data RAM width allows for efficient data processing and storage, enhancing the overall performance of the microcontroller.

Package Shape: SQUARE

The square shape of the package makes it easy to handle and mount on circuit boards, ensuring a secure fit.

Bit Size: 16

A 16-bit architecture allows for higher processing capabilities and more complex calculations, making this microcontroller suitable for a variety of applications.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages provides flexibility in design and compatibility with various power sources.

No. of Terminals: 64

Having a high number of terminals allows for easy connectivity to external components and peripherals, expanding the capabilities of the microcontroller.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage ensures efficient power usage and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions and maintain reliable performance.

CPU Family: MSP430

The MSP430 family is known for its low power consumption and versatile features, making it a popular choice for energy-efficient applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows for reliable performance in extreme temperature conditions, making this microcontroller suitable for industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term durability.

ADC Channels: YES

Integrated ADC channels allow for analog signal processing, enabling the microcontroller to interface with sensors and other analog devices.

Terminal Position: QUAD

The quad terminal position provides secure mounting and easy soldering, ensuring a reliable connection in high vibration environments.

ROM Words: 8192

With a large ROM capacity, this microcontroller can store complex programs and data, making it suitable for a wide range of applications.

Maximum Seated Height: 1.6 mm

The low seated height of the package saves space on the circuit board and allows for compact designs in space-constrained applications.

RAM Words: 0.25

The small RAM capacity allows for quick data access and manipulation, enhancing the overall performance of the microcontroller.

Width: 10 mm

The compact width of the microcontroller package allows for easy integration into small electronic devices and tight spaces.

Boundary Scan: YES

Boundary scan support enables efficient testing and debugging of the microcontroller during the manufacturing process, ensuring high product quality.

Peripherals: BOR, LCD, TIMER(4), WDT

The various peripherals included enhance the functionality of the microcontroller, allowing for versatile applications in different industries.

Maximum Clock Frequency: 8 MHz

With a high clock frequency, this microcontroller can process data quickly and efficiently, improving system performance and responsiveness.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum reflow time at peak temperature ensures reliable solder joints and prevents component damage during the manufacturing process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for robust soldering processes and ensures secure connections in high-temperature environments.

Length: 10 mm

The compact length of the microcontroller package allows for space-saving designs and easy integration into small electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh operating conditions, making this microcontroller suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller offers high performance and energy efficiency, making it suitable for a wide range of embedded applications.

No. of Timers: 4

Having multiple timers allows for precise timing control and synchronization of various tasks, enhancing the functionality of the microcontroller.

RAM Bytes: 256

The generous RAM capacity allows for efficient data storage and manipulation, enabling complex calculations and multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, making this microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

The gull-wing terminal form provides secure soldering and easy PCB mounting, ensuring reliable connections in demanding applications.

Maximum Supply Current: 0.5 mA

The low maximum supply current results in energy-efficient operation and longer battery life in portable devices.

Nominal Supply Voltage: 3 V

The stable nominal supply voltage ensures consistent performance and compatibility with a wide range of power sources.

PWM Channels: YES

Support for PWM channels allows for precise control of analog signals, enabling smooth motor control and power management in various applications.

Connectivity: SPI, UART, USART

The multiple connectivity options facilitate communication with external devices and peripherals, allowing for versatile system integration.

ROM Programmability: FLASH

Flash ROM programmability enables easy firmware updates and enhances the flexibility of the microcontroller in adapting to changing requirements.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting and space-saving designs, making this microcontroller suitable for compact electronic devices.

Format: FIXED POINT

The fixed-point format simplifies mathematical calculations and reduces processing overhead, improving the efficiency of the microcontroller in numerical operations.

Moisture Sensitivity Level (MSL): 3

The moderate moisture sensitivity level ensures reliable performance in humid environments and during soldering processes, preventing component damage.

Speed: 8.4 rpm

With a fast processing speed, this microcontroller can handle real-time tasks and high-speed data processing, making it suitable for responsive control applications.

Low Power Mode: YES

The low-power mode enables energy-efficient operation and extends battery life in battery-powered devices, making this microcontroller ideal for portable and IoT applications.

On Chip Program ROM Width: 8

Having a wide on-chip program ROM width allows for efficient program storage and execution, enhancing the performance and responsiveness of the microcontroller.

No. of I/O Lines: 14

The high number of I/O lines allows for versatile connectivity and interfacing with external devices, expanding the capabilities of the microcontroller in control and automation applications.

Technical Specifications

Microcontrollers MSP430FE423IPMR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8 V MINIMUM SUPPLY @ 4.15 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

14

No. of Serial I/Os:

1

No. of Terminals:

64

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8.4 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.5 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI, UART, USART

Peripherals:

BOR, LCD, TIMER(4), WDT

Trade Compliance

MSP430FE423IPMR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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